摘要:
The invention relates to epoxy adhesives. An epoxy adhesive is provided that simultaneously has low E-modulus and high glass temperature. Such adhesives are useful in the manufacture of large machinery (e.g., automobiles), and are useful for bonding different materials, such as metal and carbon fiber composite. The cured epoxy adhesive can be formulated to have an E-modulus of less than 1000 MPa, and a glass transition temperature of at least 80 C. The epoxy adhesive comprises a capped polyurethane pre polymer, a core shell rubber, and polyetheramine-epoxy adduct.
摘要:
Structural adhesives are prepared from a chain extended elastomeric toughener that contains urethane and/or urea groups, and have terminal isocyanate groups that are capped with a phenol, a polyphenol or an aminophenol compound. The adhesives have very good storage stability and cure to form cured adhesives that have good lap shear and impact peel strengths.
摘要:
Structural adhesives containing a non-rubber-modified epoxy resin, an elastomeric toughener and a curing agent further include an epoxy-functional fatty acid oligomer and a polyol. The presence of the epoxy-functional fatty acid oligomer and a semi-crystalline or crystalline polyester polyol in combination increase the storage stability of the structural adhesive.
摘要:
Structural adhesives are prepared from a chain extended elastomeric toughener that contains urethane and/or urea groups, and have terminal isocyanate groups that are capped with a phenol, a polyphenol or an aminophenol compound. The adhesives have very good storage stability and cure to form cured adhesives that have good lap shear and impact peel strengths.
摘要:
A structural adhesive exhibiting good humidity resistance in the uncured state, good failure mode after curing, good crash stability, and good corrosion resistance, is provided, as well as methods of use thereof. The structural adhesive and methods of use thereof are applicable, e.g., in complete knock down (CKD) assembly systems, e.g., in the assembly of automobile body structures.
摘要:
Structural adhesives are prepared from a chain extended elastomeric toughener that contains urethane and/or urea groups, and have terminal isocyanate groups that are capped with a phenol, a polyphenol or an aminophenol compound. The adhesives have very good storage stability and cure to form cured adhesives that have good lap shear and impact peel strengths.
摘要:
A one-component epoxy composition containing a latent catalyst and with surprisingly long storage stability. The catalyst being a reaction product of at least one tertiary amine compound and at least one polymer having at least one carboxylic acid and/or anhydride group.
摘要:
Epoxy adhesive compositions contain a heat-activatable catalyst. The heat-activatable catalyst includes a tertiary amine catalyst and a novolac resin that has a weight average molecular weight of at least 3000. One-component epoxy adhesive formulations that contain the heat-activatable catalyst have unexpectedly good storage stability.
摘要:
A heat-curable structural adhesive includes a non-rubber-modified epoxy resin, a reaction product of a carboxyl- or amine-terminated butadiene polymer or copolymer and a bisphenol F-based epoxy resin, a elastomeric toughener containing capped isocyanate groups, one or more epoxy curing agents a moisture scavenger and a heat activatable catalyst comprising a mixture of a solid or liquid tertiary amine compound that has a boiling temperature of at least 130° C. and a novolac resin. The structural adhesive develops excellent bonding properties when cured at moderate temperatures, especially from 120 to 170° C., and in addition performs very well in environmental aging stress testing. The adhesive is particularly good for bonding aluminum to another metal, or bonding aluminum to aluminum.
摘要:
The present invention provides low polyphenols (such as bisphenol A) tougheners for epoxy adhesives. The tougheners, and adhesives comprising the tougheners exhibit enhanced viscosity stability, e.g., compared to tougheners prepared from higher amounts of bisphenol A (and epoxy adhesives comprising them).