公开(公告)号：US20140065843A1

公开(公告)日：2014-03-06

申请号：US13602465

申请日：2012-09-04

申请人： Chun-Wei Chang ,  Chih-Chien Wang ,  Wang-Pen Mo ,  Hung-Chang Hsieh

发明人： Chun-Wei Chang ,  Chih-Chien Wang ,  Wang-Pen Mo ,  Hung-Chang Hsieh

IPC分类号： H01L21/02 ,  H01L21/31

CPC分类号： H01L21/02282 ,  B05D1/005 ,  G03F7/091 ,  G03F7/162 ,  H01L21/0271 ,  H01L21/0276 ,  H01L21/6715

摘要： A method for forming a photoresist layer on a semiconductor device is disclosed. An exemplary includes providing a wafer. The method further includes spinning the wafer during a first cycle at a first speed, while a pre-wet material is dispensed over the wafer and spinning the wafer during the first cycle at a second speed, while the pre-wet material continues to be dispensed over the wafer. The method further includes spinning the wafer during a second cycle at the first speed, while the pre-wet material continues to be dispensed over the wafer and spinning the wafer during the second cycle at the second speed, while the pre-wet material continues to be dispensed over the wafer. The method further includes spinning the wafer at a third speed, while a photoresist material is dispensed over the wafer including the pre-wet material.

摘要翻译： 公开了一种在半导体器件上形成光致抗蚀剂层的方法。 示例性的包括提供晶片。 该方法还包括在第一次循环期间以第一速度旋转晶片，同时将预湿材料分配在晶片上并以第二速度在第一周期期间旋转晶片，同时预湿材料继续被分配 在晶圆上。 该方法还包括在第一速度的第二循环期间旋转晶片，同时预湿材料继续分配在晶片上，并且在第二次循环期间以第二速度旋转晶片，同时预湿材料继续 分配在晶片上。 该方法还包括以三速旋转晶片，同时将光致抗蚀剂材料分配在包括预湿材料的晶片上。

公开(公告)号：US09028915B2

公开(公告)日：2015-05-12

申请号：US13602465

申请日：2012-09-04

申请人： Chun-Wei Chang ,  Chih-Chien Wang ,  Wang-Pen Mo ,  Hung-Chang Hsieh

发明人： Chun-Wei Chang ,  Chih-Chien Wang ,  Wang-Pen Mo ,  Hung-Chang Hsieh

IPC分类号： B05D3/12 ,  H01L21/67 ,  G03F7/16

CPC分类号： H01L21/02282 ,  B05D1/005 ,  G03F7/091 ,  G03F7/162 ,  H01L21/0271 ,  H01L21/0276 ,  H01L21/6715

摘要： A method for forming a photoresist layer on a semiconductor device is disclosed. An exemplary includes providing a wafer. The method further includes spinning the wafer during a first cycle at a first speed, while a pre-wet material is dispensed over the wafer and spinning the wafer during the first cycle at a second speed, while the pre-wet material continues to be dispensed over the wafer. The method further includes spinning the wafer during a second cycle at the first speed, while the pre-wet material continues to be dispensed over the wafer and spinning the wafer during the second cycle at the second speed, while the pre-wet material continues to be dispensed over the wafer. The method further includes spinning the wafer at a third speed, while a photoresist material is dispensed over the wafer including the pre-wet material.

摘要翻译： 公开了一种在半导体器件上形成光致抗蚀剂层的方法。 示例性的包括提供晶片。 该方法还包括在第一次循环期间以第一速度旋转晶片，同时将预湿材料分配在晶片上并以第二速度在第一周期期间旋转晶片，同时预湿材料继续被分配 在晶圆上。 该方法还包括在第一速度的第二循环期间旋转晶片，同时预湿材料继续分配在晶片上，并且在第二次循环期间以第二速度旋转晶片，同时预湿材料继续 分配在晶片上。 该方法还包括以三速旋转晶片，同时将光致抗蚀剂材料分配在包括预湿材料的晶片上。

公开(公告)号：US20130270667A1

公开(公告)日：2013-10-17

申请号：US13449019

申请日：2012-04-17

申请人： Chih-Chien Wang ,  Chu-Wei Chang ,  Wang-Pen Mo ,  Hung-Chang Hsieh

发明人： Chih-Chien Wang ,  Chu-Wei Chang ,  Wang-Pen Mo ,  Hung-Chang Hsieh

IPC分类号： H01L31/0224 ,  H01L27/146 ,  H01L31/18

CPC分类号： H01L27/14621 ,  H01L27/14629 ,  H01L27/1464

摘要： A method includes forming a plurality of image sensors on a front side of a semiconductor substrate, and forming a dielectric layer on a backside of the semiconductor substrate. The dielectric layer is over the semiconductor substrate. The dielectric layer is patterned into a plurality of grid-filling regions, wherein each of the plurality of grid-filling regions overlaps one of the plurality of image sensors. A metal layer is formed on top surfaces and sidewalls of the plurality of grid-filling regions. The metal layer is etched to remove horizontal portions of the metal layer, wherein vertical portions of the metal layer remain after the step of etching to form a metal grid. A transparent material is filled into grid openings of the metal grid.

摘要翻译： 一种方法包括在半导体衬底的正面上形成多个图像传感器，并在半导体衬底的背面形成电介质层。 电介质层在半导体衬底之上。 电介质层被图案化成多个栅格填充区域，其中多个网格填充区域中的每一个与多个图像传感器之一重叠。 金属层形成在多个网格填充区域的顶表面和侧壁上。 蚀刻金属层以去除金属层的水平部分，其中金属层的垂直部分在蚀刻步骤之后保留以形成金属网格。 将透明材料填充到金属网格的网格开口中。

公开(公告)号：US08940574B2

公开(公告)日：2015-01-27

申请号：US13449019

申请日：2012-04-17

申请人： Chih-Chien Wang ,  Chu-Wei Chang ,  Wang-Pen Mo ,  Hung-Chang Hsieh

发明人： Chih-Chien Wang ,  Chu-Wei Chang ,  Wang-Pen Mo ,  Hung-Chang Hsieh

IPC分类号： H01L27/146 ,  H01L31/0232 ,  H01L31/20

CPC分类号： H01L27/14621 ,  H01L27/14629 ,  H01L27/1464

摘要： A method includes forming a plurality of image sensors on a front side of a semiconductor substrate, and forming a dielectric layer on a backside of the semiconductor substrate. The dielectric layer is over the semiconductor substrate. The dielectric layer is patterned into a plurality of grid-filling regions, wherein each of the plurality of grid-filling regions overlaps one of the plurality of image sensors. A metal layer is formed on top surfaces and sidewalls of the plurality of grid-filling regions. The metal layer is etched to remove horizontal portions of the metal layer, wherein vertical portions of the metal layer remain after the step of etching to form a metal grid. A transparent material is filled into grid openings of the metal grid.

摘要翻译： 一种方法包括在半导体衬底的正面上形成多个图像传感器，并在半导体衬底的背面形成电介质层。 电介质层在半导体衬底之上。 电介质层被图案化成多个栅格填充区域，其中多个网格填充区域中的每一个与多个图像传感器之一重叠。 金属层形成在多个网格填充区域的顶表面和侧壁上。 蚀刻金属层以去除金属层的水平部分，其中金属层的垂直部分在蚀刻步骤之后保留以形成金属网格。 将透明材料填充到金属网格的网格开口中。

公开(公告)号：US20080060974A1

公开(公告)日：2008-03-13

申请号：US11358306

申请日：2006-02-21

申请人： S. Y. Liang ,  Chih-Wing Chang ,  Hsin-Yuan Chen ,  Chung-Jen Chen ,  J. F. Lee ,  Chih-Chien Wang ,  Chun-Yi Ho

发明人： S. Y. Liang ,  Chih-Wing Chang ,  Hsin-Yuan Chen ,  Chung-Jen Chen ,  J. F. Lee ,  Chih-Chien Wang ,  Chun-Yi Ho

IPC分类号： B65D85/00

CPC分类号： G03F7/70741 ,  G03F1/66

摘要： A reticle carrier including a base portion and a cover portion at least partially detachable from the base portion. The base portion and the cover portion are configured to collectively house a reticle in a region collectively defined by the base portion and the cover portion when the base portion and the cover portion are fully attached. At least a portion of an interior surface of at least one of the base portion and the cover portion is treated with a sulfide-absorbing composition, such as silver or a silver-containing alloy.

摘要翻译： 一种标线载体，其包括基部和至少部分地可从基部分离的盖部。 底座部分和盖部分构造成当底座部分和盖部分完全安装时，共同地将掩模版容纳在由基部和盖部共同限定的区域中。 基体部分和盖部分中的至少一个的内表面的至少一部分用硫化物吸收组合物如银或含银合金进行处理。

公开(公告)号：US11529245B2

公开(公告)日：2022-12-20

申请号：US17036595

申请日：2020-09-29

申请人： Chih-Chien Wang

发明人： Chih-Chien Wang

IPC分类号： A61B17/15 ,  A61F2/46 ,  A61F2/30

摘要： A kinematic-axis locating device for knee arthroplasty includes two spoon-shaped arms and a linking piece. The two spoon-shaped arms are to be placed between a proximal tibia and a distal femur. Due to checking effects of ligaments on the proximal tibia and the distal femur, a medial condyle femur and a lateral condyle femur hold the two spoon-shaped arms on the tibial plateau using their respective curvatures. The linking piece provides a reference axis that is naturally defined by the two inserted and positioned spoon-shaped arms. The reference axis is roughly parallel to a kinematic axis upon which the medial condyle and the lateral condyle pivot against the tibial plateau. Articular surface resection can then be performed between the proximal tibia and the distal femur with reference to the reference axis.

公开(公告)号：US08770797B2

公开(公告)日：2014-07-08

申请号：US13455099

申请日：2012-04-24

申请人： Chih-Chien Wang

发明人： Chih-Chien Wang

IPC分类号： F21V29/00 ,  F21V15/01 ,  F21S8/08

CPC分类号： F21V29/507 ,  F21S8/086 ,  F21V23/0464 ,  F21V29/004 ,  F21V29/74 ,  F21V29/83 ,  F21W2131/103 ,  Y10S362/802

摘要： An illuminating device includes a heat-dissipating shroud, a heat-dissipating module, an upper cover module and a lower cover module. The heat-dissipating module includes a light source, a substrate, a heat-conducting element and heat-dissipating blades. The upper cover module includes an upper cover, a light sensor and a protective cover. The lower cover module includes a lower cover, a transparent shroud and a transformer. The heat-dissipating shroud is assembled above the heat-dissipating blades of the heat-dissipating module. A top surface of the heat-dissipating shroud is provided with heat-dissipating holes. A space of a suitable height is generated between the top surface of the heat-dissipating shroud and the heat-dissipating blades of the heat-dissipating module to act as a heat concentration chamber. A gap is formed between the bottom of the heat-dissipating shroud and the top surface of the upper cover of the upper cover module.

摘要翻译： 照明装置包括散热罩，散热模块，上盖模块和下盖模块。 散热模块包括光源，基板，导热元件和散热叶片。 上盖模块包括上盖，光传感器和保护罩。 下盖模块包括下盖，透明护罩和变压器。 散热罩组装在散热模块的散热片上方。 散热罩的顶面设有散热孔。 在散热罩的上表面和散热模块的散热片之间产生合适的高度的空间，作为热集中室。 在散热罩的底部和上盖模块的上盖的上表面之间形成间隙。

公开(公告)号：US20130279172A1

公开(公告)日：2013-10-24

申请号：US13455099

申请日：2012-04-24

申请人： Chih-Chien Wang

发明人： Chih-Chien Wang

IPC分类号： F21V29/00 ,  F21V7/00

CPC分类号： F21V29/507 ,  F21S8/086 ,  F21V23/0464 ,  F21V29/004 ,  F21V29/74 ,  F21V29/83 ,  F21W2131/103 ,  Y10S362/802

摘要： An illuminating device includes a heat-dissipating shroud, a heat-dissipating module, an upper cover module and a lower cover module. The heat-dissipating module includes a light source, a substrate, a heat-conducting element and heat-dissipating blades. The upper cover module includes an upper cover, a light sensor and a protective cover. The lower cover module includes a lower cover, a transparent shroud and a transformer. The heat-dissipating shroud is assembled above the heat-dissipating blades of the heat-dissipating module. A top surface of the heat-dissipating shroud is provided with heat-dissipating holes. A space of a suitable height is generated between the top surface of the heat-dissipating shroud and the heat-dissipating blades of the heat-dissipating module to act as a heat concentration chamber. A gap is formed between the bottom of the heat-dissipating shroud and the top surface of the upper cover of the upper cover module.

摘要翻译： 照明装置包括散热罩，散热模块，上盖模块和下盖模块。 散热模块包括光源，基板，导热元件和散热叶片。 上盖模块包括上盖，光传感器和保护罩。 下盖模块包括下盖，透明护罩和变压器。 散热罩组装在散热模块的散热片上方。 散热罩的顶面设有散热孔。 在散热罩的上表面和散热模块的散热片之间产生合适的高度的空间，作为热集中室。 在散热罩的底部和上盖模块的上盖的上表面之间形成间隙。

公开(公告)号：US09040891B2

公开(公告)日：2015-05-26

申请号：US13492348

申请日：2012-06-08

申请人： U-Ting Chen ,  Dun-Nian Yaung ,  Jen-Cheng Liu ,  Yu-Hao Shih ,  Chih-Chien Wang ,  Shih Pei Chou ,  Wei-Tung Huang ,  Cheng-Ta Wu

发明人： U-Ting Chen ,  Dun-Nian Yaung ,  Jen-Cheng Liu ,  Yu-Hao Shih ,  Chih-Chien Wang ,  Shih Pei Chou ,  Wei-Tung Huang ,  Cheng-Ta Wu

IPC分类号： H01L27/00 ,  H01L21/033 ,  H01L27/146

CPC分类号： H01L21/0334 ,  H01L21/0337 ,  H01L27/14603 ,  H01L27/1464 ,  H01L27/14689

摘要： A method of forming of an image sensor device includes a substrate having a pixel region and a periphery region. A plurality of first trenches is etched in the periphery region. Each of the first trenches has a depth D1. A mask layer is formed over the substrate. The mask layer has a plurality of openings in the pixel region. A spacer is formed in an interior surface of each opening. A plurality of second trenches is etched through each opening having the spacer in the pixel region. Each of the second trenches has a depth D2. The depth D1 is larger than the depth D2.

摘要翻译： 形成图像传感器装置的方法包括具有像素区域和周边区域的基板。 在周边区域中蚀刻多个第一沟槽。 每个第一沟槽具有深度D1。 掩模层形成在衬底上。 掩模层在像素区域中具有多个开口。 间隔件形成在每个开口的内表面中。 通过在像素区域中具有间隔物的每个开口蚀刻多个第二沟槽。 每个第二沟槽具有深度D2。 深度D1大于深度D2。