摘要:
A writeback and refresh circuit for a direct sense architecture memory wherein a plurality of primary sense amps are connected to a global data line and also to bitlines, each of which is coupled to an array of memory storage cells which are selected for write and read operations by a plurality of wordlines. A single secondary sense amp receives analog level data from the primary sense amps over the global data line, and includes a restore/writeback circuit which digitizes the data and then returns the digitized data over the global data line to the primary sense amp and back into the memory. A 2-cycle read/writeback operation is used for each memory read cycle, a first cycle read operation, and a second cycle writeback operation. The 2-cycle destructive read architecture eliminates the need for a cache and complex caching algorithms.
摘要:
A localized direct sense architecture circuit includes a large number (e.g. 8) of microcells, each having a primary sense amp PSA, coupled to one global data line which is coupled to one secondary sense amp SSA. Each PSA includes its own bias current device, which supplies bias current to sense devices in the PSA and is also used for precharge, such that the bias current does not flow along the highly capacitive global data line. With this technical approach, the size of each bias current supply device can be substantially reduced, and the number of PSAs on one global data line can be increased for increased layout density.
摘要:
A method of manufacturing a device having embedded memory including a plurality of memory cells. During manufacturing test, a first test stress is applied to selected cells of the plurality of memory cells with a built-in self test. At least one weak memory cell is identified. The at least one weak memory cell is repaired. A second test stress is applied to the selected cells and the repaired cells with the built-in self test.
摘要:
A ferroelectric space charge capacitor memory device includes a ferroelectric dielectric having a plurality of polarization states; a first electrode attached to the dielectric and establishing a first electric contact potential between the first electrode and the dielectric and a second electrode spaced from the first electrode and attached to the dielectric and establishing a second electric contact potential between the second electrode and the dielectric for generating a differential internal bias voltage on the dielectric which defines a number of capacitive levels, one representative of each of a corresponding number of polarization states and produces an electrical field which is less than the coercive electric field of the dielectric.
摘要:
A ferroelectric space charge capacitor analog memory device includes a pair of spaced first and second electrodes; a ferroelectric dielectric disposed between the electrodes; and a signal source for applying to the dielectric a write signal equal to or greater than the coercive voltage to write the dielectric into a predetermined polarization state in the range from zero to maximum coerced polarization and to establish, proximate the interface between the dielectric and each electrode, a space charge region having a charge opposite to that applied to the electrode, with a neutral region between the space charge regions, the relative sizes of the neutral and space charge regions defining the capacitance of the dielectric, the neutral region having an internal polarization field opposite to that represented by the space charge regions; a bias source for applying to the dielectric a bias voltage less than the coercive voltage at a rate slower than the rate of space charge formation to define the capacitance level representative of the predetermined polarization state; the signal source for introducing to the dielectric a read signal at a rate faster than the rate of space charge formation which together with the bias voltage is less than the coercive voltage; and a current detector responsive to the introduction of the read signal to the dielectric for determining the capacitance level representative of the predetermined polarization state.
摘要:
A system and method of electrostatic discharge (ESD) protection in a logic circuit using either state manipulation or current injection. A first system is disclosed that includes an ESD detection circuit for detecting an ESD event; and an ESD control circuit that can change a state of the logic circuit from a normal mode to an ESD mode in response to a signal received from the ESD detection circuit. A second system is disclosed that includes an attenuator circuit coupled to a chip pad; and a switch for diverting current from the attenuator circuit to an internal node of the logic circuit during an ESD event to reduce a voltage at the chip pad.
摘要:
A linearized ferroelectric capacitor includes a ferroelectric dielectric medium; a doped region in the ferroelectric dielectric medium, the doped region having a charge of a first polarity which divides the medium into two sections of opposing polarized domains; and a pair of electrodes on the ferroelectric medium having a contact potential of a second, opposite polarity to that of the doped region for reinforcing and stabilizing the polarized domains in each section.
摘要:
A ferroelectric space charge capacitor memory system includes a ferroelectric space charge capacitor memory cell having two ferroelectric space charge capacitor memory devices; a write circuit for applying coercive write voltage to each of the memory devices to establish internal polarization fields and space charge regions of opposite polarity in each device, respectively; a bias voltage circuit for applying to each of the devices a bias voltage less than the coercive voltage at a rate slower than the rate of space charge formation to define a capacitive level representative of one of the polarization states; a read signal circuit for introducing to each of the devices a read signal at a rate faster than the rate of space charge formation, which together with the bias voltage is less than the coercive voltage; and a detector responsive to the read signal for indicating the difference in charge transferred by each memory device representing the logical state of the memory cell.
摘要:
An integrated system and method to achieve ESD robustness on an integrated circuit (IC) in a fully automated ASIC design environment is described. Electrical characteristics and electrical limits on the power network are translated to power route region constraints for each chip input/output (I/O) cell. Electrical limits on the signal network are translated into signal route region constraints for each chip I/O cell. These constraints are passed on to an I/O floorplanner (automatic placer of I/O cells) that analyzes trade-offs between these constraints. For I/O cells that can not be placed to satisfy both power and signal region constraints, the I/O floorplanner utilizes the knowledge of alternative power distribution structures to group I/Os and create local power grid structures that have the effect of relaxing the power region constraints. Instructions for creating these local power grid structures are passed on to the automatic power routing tool.
摘要:
A silicon-germanium ESD element comprises a substrate of a first dopant type coupled to a first voltage terminal and a first diode-configured element. The first diode-configured element has a collector region of a second dopant type in the substrate, a SiGe base layer of the first dopant type on the collector region, with the SiGe base layer including a base contact region, and an emitter of the second dopant type on the SiGe base layer. Preferably, the SiGe base layer ion the collector region is an epitaxial SiGe layer and the second dopant type of the emitter is diffused in to the SiGe base layer. The ESD element of the present invention may further include a second diode-configured element of the same structure as the first diode-configured element, with an isolation region in the substrate separating the first and second diode-configured elements. The first and second diode-configured elements form a diode network. In each of the embodiments, the isolation regions may be disposed adjacent the collector regions of the diode elements and below a portion of the SiGe base layer of the diode elements. The SiGe base layer in the diode elements preferably comprises an active, single crystal layer in a portion directly over the collector region and a polycrystalline layer in portions directly over the isolation regions. The isolation regions may be shallow or deep trench isolations.