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    Semiconductor chip assembly
    2.
    发明授权
    Semiconductor chip assembly 有权
    半导体芯片组装

    公开(公告)号：US06169328A

    公开(公告)日：2001-01-02

    申请号：US09246056

    申请日：1999-02-08

    申请人： Craig Mitchell ,  Mike Warner ,  Jim Behlen

    发明人： Craig Mitchell ,  Mike Warner ,  Jim Behlen

    IPC分类号： H01L2348

    CPC分类号： H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H01L2924/00

    摘要： A semiconductor chip package structure for providing a reliable interface between a semiconductor chip and a PWB to accommodate for the thermal coefficient of expansion mismatch therebetween. The interface between a chip and a PWB is comprised of a package substrate having a plurality of compliant pads defining channels therebetween. The package substrate is typically comprised of a flexible dielectric sheet that has leads and terminals on at least one surface thereof. The pads have a first coefficient of thermal expansion (“CTE”) and are comprised of a material having a fairly low modulus of elasticity. An encapsulant having a second CTE lower than the CTE of the compliant pads is disposed within the channels to form a uniform encapsulation layer. The pads are in rough alignment with the conductive terminals on the package substrate thereby allowing independent movement of the terminals during thermal cycling of the chip. The encapsulant encases the conductive leads electrically connecting the terminals to chip contacts on a face surface of the chip. The lower CTE of the encapsulant controls the flexing of the conductive leads so that the leads do not prematurely fatigue and become unreliable while the lower modulus compliant pads relieve the stress on the solder balls induced by the CTE mismatch of the chip and the PWB.

    摘要翻译： 一种用于在半导体芯片和PWB之间提供可靠接口的半导体芯片封装结构，以适应其间的热膨胀系数不匹配。 芯片和PWB之间的接口包括具有多个在其间形成通道的柔性衬垫的封装衬底。 封装基板通常由在其至少一个表面上具有引线和端子的柔性电介质片构成。 垫具有第一热膨胀系数（“CTE”），并且由具有相当低的弹性模量的材料组成。 具有比柔性焊盘的CTE低的第二CTE的密封剂设置在通道内以形成均匀的封装层。 焊盘与封装衬底上的导电端子粗略对准，从而允许在芯片的热循环期间端子的独立移动。 密封剂封装导电引线，将引线电连接到芯片的表面上的芯片触点。 密封剂的较低CTE控制导电引线的弯曲，使得引线不会过早地疲劳并变得不可靠，而较低模量的柔性焊盘缓解由芯片和PWB的CTE不匹配引起的焊球上的应力。

    Front wheel drive bicycle assembly
    3.
    发明授权
    Front wheel drive bicycle assembly 有权

    公开(公告)号：US10239576B2

    公开(公告)日：2019-03-26

    申请号：US15468249

    申请日：2017-03-24

    申请人： Mike Warner

    发明人： Mike Warner

    IPC分类号： B62K21/18 ,  B62K3/02 ,  B62M1/36 ,  B62M9/10 ,  B62K21/02 ,  B62K21/12 ,  B62J1/00

    摘要： A front wheel drive bicycle assembly includes a frame that may be mounted for riding. A front wheel is rotatably coupled to a front end of the frame and the front wheel rolls along a support surface. A pedal unit is rotatably coupled to the frame and the pedal unit is selectively pedaled. The pedal unit is in mechanical communication with the front wheel to rotate the front wheel thereby urging the frame along the support surface. A rear wheel is rotatably coupled to a back end of the frame and the rear wheel rolls along the support surface. Moreover, the rear wheel is selectively rotated about a vertical axis for steering. A steering unit is movably coupled to the frame and the steering unit is in mechanical communication with the rear wheel. In this way the steering unit selectively rotates the rear wheel about the vertical axis for steering.

    Front Wheel Drive Bicycle Assembly
    4.
    发明申请
    Front Wheel Drive Bicycle Assembly 审中-公开

    公开(公告)号：US20180273133A1

    公开(公告)日：2018-09-27

    申请号：US15468249

    申请日：2017-03-24

    申请人： Mike Warner

    发明人： Mike Warner

    IPC分类号： B62K21/18 ,  B62K3/02 ,  B62M1/36 ,  B62M9/10 ,  B62K21/02 ,  B62K21/12 ,  B62J1/00

    CPC分类号： B62K21/18 ,  B62J1/00 ,  B62J1/08 ,  B62K3/02 ,  B62K21/02 ,  B62K21/12 ,  B62M1/36 ,  B62M9/10

    摘要： A front wheel drive bicycle assembly includes a frame that may be mounted for riding. A front wheel is rotatably coupled to a front end of the frame and the front wheel rolls along a support surface. A pedal unit is rotatably coupled to the frame and the pedal unit is selectively pedaled. The pedal unit is in mechanical communication with the front wheel to rotate the front wheel thereby urging the frame along the support surface. A rear wheel is rotatably coupled to a back end of the frame and the rear wheel rolls along the support surface. Moreover, the rear wheel is selectively rotated about a vertical axis for steering. A steering unit is movably coupled to the frame and the steering unit is in mechanical communication with the rear wheel. In this way the steering unit selectively rotates the rear wheel about the vertical axis for steering.