摘要:
A method and system for mitigating survey fraud is provided. Survey responses stored in storage of a computer system are analyzed. The survey responses include identifiers associated with computing devices of users providing the survey responses. The number of the survey responses is totaled for each of the identifiers. The identifiers for which the number of the survey responses meets a threshold are identified as belonging to suspected gamers. At least some of the survey responses for the identifiers identified as belonging to suspected gamers are flagged as invalid.
摘要:
A front wheel drive bicycle assembly includes a frame that may be mounted for riding. A front wheel is rotatably coupled to a front end of the frame and the front wheel rolls along a support surface. A pedal unit is rotatably coupled to the frame and the pedal unit is selectively pedaled. The pedal unit is in mechanical communication with the front wheel to rotate the front wheel thereby urging the frame along the support surface. A rear wheel is rotatably coupled to a back end of the frame and the rear wheel rolls along the support surface. Moreover, the rear wheel is selectively rotated about a vertical axis for steering. A steering unit is movably coupled to the frame and the steering unit is in mechanical communication with the rear wheel. In this way the steering unit selectively rotates the rear wheel about the vertical axis for steering.
摘要:
A method for making a semiconductor chip package. At least one compliant pad is provided on a surface of a substrate and a chip unit is attached to the at least one compliant pad. The at least one compliant pad has a first coefficient of thermal expansion (“CTE”). An encapsulant having a second CTE lower than the CTE of the compliant pads is disposed around the at least one compliant pad to form a composite layer between the chip unit and the substrate.
摘要:
A front wheel drive bicycle assembly includes a frame that may be mounted for riding. A front wheel is rotatably coupled to a front end of the frame and the front wheel rolls along a support surface. A pedal unit is rotatably coupled to the frame and the pedal unit is selectively pedaled. The pedal unit is in mechanical communication with the front wheel to rotate the front wheel thereby urging the frame along the support surface. A rear wheel is rotatably coupled to a back end of the frame and the rear wheel rolls along the support surface. Moreover, the rear wheel is selectively rotated about a vertical axis for steering. A steering unit is movably coupled to the frame and the steering unit is in mechanical communication with the rear wheel. In this way the steering unit selectively rotates the rear wheel about the vertical axis for steering.
摘要:
A method of making a microelectronic assembly comprises providing a first side assembly juxtaposed with a second side assembly and a first resilient element disposed therebetween. Leads extend between the first side assembly and the second side assembly. A compressive force is applied to the juxtaposed assemblies so as to compress the first resilient element and the compressive force is at least partially released so as to allow the first resilient element to expand, thereby moving one or both of the first side assembly and the second side assembly to deform the leads.
摘要:
An apparatus and method for determining the angular position of a rotor. The rotor is a part of a resolver used to determine the position of a shaft, or the like, in operation in a system such as a shaft in a missile gimbal. A digital signal processor is used advantageously to reduce cost. The inherently poorer performance of a data sampling approach in the presence of noise, as compared to the prior art tracking converter approach, is overcome by novel application of the digital signal processor and related circuitry.
摘要:
A semiconductor chip package structure for providing a reliable interface between a semiconductor chip and a PWB to accommodate for the thermal coefficient of expansion mismatch therebetween. The interface between a chip and a PWB is comprised of a package substrate having a plurality of compliant pads defining channels therebetween. The package substrate is typically comprised of a flexible dielectric sheet that has leads and terminals on at least one surface thereof. The pads have a first coefficient of thermal expansion (“CTE”) and are comprised of a material having a fairly low modulus of elasticity. An encapsulant having a second CTE lower than the CTE of the compliant pads is disposed within the channels to form a uniform encapsulation layer. The pads are in rough alignment with the conductive terminals on the package substrate thereby allowing independent movement of the terminals during thermal cycling of the chip. The encapsulant encases the conductive leads electrically connecting the terminals to chip contacts on a face surface of the chip. The lower CTE of the encapsulant controls the flexing of the conductive leads so that the leads do not prematurely fatigue and become unreliable while the lower modulus compliant pads relieve the stress on the solder balls induced by the CTE mismatch of the chip and the PWB.