公开(公告)号：USD777122S1

公开(公告)日：2017-01-24

申请号：US29518882

申请日：2015-02-27

Applicant: Cree, Inc.

Designer： Michael John Bergmann ,  Jesse Reiherzer ,  Joseph Gates Clark ,  Benjamin Jacobson ,  Sung Chul Joo

公开(公告)号：USD783547S1

公开(公告)日：2017-04-11

申请号：US29529243

申请日：2015-06-04

Applicant: Cree, Inc.

Designer： Michael John Bergmann ,  Jesse Reiherzer ,  Joseph Gates Clark ,  Benjamin Jacobson ,  Sung Chul Joo

公开(公告)号：US20160254423A1

公开(公告)日：2016-09-01

申请号：US14633734

申请日：2015-02-27

Applicant: CREE, INC.

Inventor： Michael John Bergmann ,  Jesse Reiherzer ,  Joseph Gates Clark ,  Benjamin Jacobson ,  Sung Chul Joo

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/60 ,  H01L33/48

CPC classification number: H01L33/54 ,  H01L27/156 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Light emitting diode components are disclosed that utilize a thin, substantially flat or undomed encapsulant in order to achieve the desired emission profile to increase luminance and/or center beam candle power. Some embodiments of the devices include encapsulants, which result in an apparent source image, which does not exceed 2× the source size. Different embodiments of the present invention can comprise different configurations of emitters within the component, such as monolithic chips. The LEDs can be wire bonded to a surface. This surface can be black, reflective or include a reflective coating. In some embodiments, conversion materials can be applied conformal to the LED.

Abstract translation: 公开了使用薄的，基本上平坦的或未掺杂的密封剂的发光二极管组件，以便实现所需的发射分布，以增加亮度和/或中心光束烛光功率。 装置的一些实施例包括密封剂，其产生不超过2×源尺寸的明显源图像。 本发明的不同实施例可以包括组件内的发射器的不同配置，例如单片芯片。 LED可以引线键合到表面。 该表面可以是黑色的，反射的或包括反射涂层。 在一些实施例中，转换材料可以适用于LED。

公开(公告)号：US09287474B2

公开(公告)日：2016-03-15

申请号：US14010828

申请日：2013-08-27

Applicant: CREE, INC.

Inventor： Bernd Keller ,  Benjamin Jacobson ,  Robert Gengelbach

IPC: H01L33/58 ,  H01L33/48 ,  H01L33/52 ,  G02B6/42 ,  G02B19/00 ,  F21K99/00 ,  H01L33/54 ,  H01L33/60 ,  F21Y101/02

CPC classification number: H01L33/58 ,  F21K9/60 ,  F21K9/61 ,  F21Y2115/10 ,  G02B6/4214 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0071 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/60

Abstract: An LED package includes a LED structure that outputs light in a pattern about an axis and an optical coupling device with a central axis. The coupling device is positioned relative to the LED structure and accepts light from the LED. The coupling device includes a first dielectric interface surface that is substantially cylindrical with respect to the central axis, and a reflecting surface. The first dielectric interface surface accepts a first portion of light from the LED structure and directs it toward the reflecting surface. The reflecting surface accepts the light from the first dielectric interface surface and directs it toward the first dielectric interface surface in a direction substantially perpendicular to the central axis.