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公开(公告)号：US20180211759A1
公开(公告)日：2018-07-26
申请号：US15935067
申请日：2018-03-26
Applicant: CYNTEC CO., LTD.
Inventor： Chun-Tiao Liu , Lan-Chin Hsieh , Tsung-Chan Wu , Chi-Hsun Lee , Chih-Siang Chuang
CPC classification number: H01F27/022 , H01F1/14741 , H01F1/14766 , H01F1/14791 , H01F17/045 , H01F27/255 , H01F27/2828 , H01F27/29
Abstract: A magnetic device comprising a T-shaped magnetic core made of a material comprising a soft magnetic metal material and having a base and a pillar integrally formed with the base; a coil wound on the pillar; and a unitary magnetic body encapsulating the pillar, the coil and a portion of the base with a bottom surface of the base being not covered by the unitary magnetic body, wherein a contiguous portion of the unitary magnetic body encapsulates a top surface of the pillar and extends into a gap between a side surface of the pillar and an inner surface of the coil, wherein the core loss PBL (mW/cm3) of the unitary magnetic body satisfies: 2×f1.29×Bm2.2≤PBL≤14.03×f1.29×Bm1.08, where f(kHz) represents a frequency of a magnetic field applied to the T-shaped magnetic core, and Bm (kGauss) represents the operating magnetic flux density of the magnetic field at the frequency.
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公开(公告)号：US09959965B2
公开(公告)日：2018-05-01
申请号：US14941647
申请日：2015-11-15
Applicant: CYNTEC CO., LTD.
Inventor： Chun-Tiao Liu , Lan-Chin Hsieh , Tsung-Chan Wu , Chi-Hsun Lee , Chih-Siang Chuang
CPC classification number: H01F27/022 , H01F1/14741 , H01F1/14766 , H01F1/14791 , H01F17/045 , H01F27/255 , H01F27/2828 , H01F27/29
Abstract: An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein the volume of the base is V1 and the volume of the pillar is V2; a coil wound on the pillar; and a magnetic body encapsulating the pillar, the coil and a portion of the base, wherein the ratio of V1 to V2 (V1/V2) is configured in a pre-determined range so as to reduce the total core loss of the inductor with the equivalent permeability of the inductor being between 28.511 and 52.949.
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公开(公告)号：US09451701B2
公开(公告)日：2016-09-20
申请号：US14594083
申请日：2015-01-10
Applicant: CYNTEC CO., LTD.
Inventor： Da-Jung Chen , Chun-Tiao Liu , Bau-Ru Lu
IPC: H05K7/00 , H05K1/18 , H01L23/64 , H01L25/16 , H01F27/24 , H01F27/29 , H01F27/40 , H01F27/02 , H05K3/34 , H01L23/24 , H01L23/31 , H01L23/552 , H01L23/00
CPC classification number: H05K1/181 , H01F27/022 , H01F27/027 , H01F27/24 , H01F27/29 , H01F27/40 , H01L23/24 , H01L23/3121 , H01L23/552 , H01L23/645 , H01L24/73 , H01L25/16 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K3/3421 , H05K2201/1003 , H05K2201/10515 , H05K2201/10537 , H05K2201/10924 , Y02P70/611 , Y10T29/49146 , H01L2924/00012 , H01L2924/00
Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.
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公开(公告)号：US08837168B2
公开(公告)日：2014-09-16
申请号：US13754910
申请日：2013-01-31
Applicant: Cyntec Co., Ltd.
Inventor： Da-Jung Chen , Chau-Chun Wen , Chun-Tiao Liu
IPC: H05K7/18 , H05K3/30 , H05K1/18 , H01L23/64 , H01L25/16 , H01F27/29 , H05K9/00 , H01L23/24 , H01L23/31 , H01L23/552 , H01F27/02 , H05K3/34
CPC classification number: H05K1/18 , H01F27/027 , H01F27/29 , H01L23/24 , H01L23/3121 , H01L23/552 , H01L23/645 , H01L24/73 , H01L25/16 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19105 , H01L2924/30107 , H01L2924/3025 , H05K1/181 , H05K3/30 , H05K3/3421 , H05K9/00 , H05K2201/1003 , H05K2201/10515 , H05K2201/10537 , H05K2201/10924 , Y02P70/611 , Y10T29/49071 , Y10T29/49146 , H01L2924/00012 , H01L2924/00
Abstract: An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.
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公开(公告)号：US20210125767A1
公开(公告)日：2021-04-29
申请号：US17140143
申请日：2021-01-04
Applicant: CYNTEC CO., LTD.
Inventor： Chun-Tiao Liu , Lan-Chin Hsieh , Tsung-Chan Wu , Chi-Hsun Lee , Chih-Siang Chuang
Abstract: An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein μC×Hsat≥1800, where μC is a permeability of the T-shaped magnetic core, and Hsat (Oe) is a strength of the magnetic field at 80% of μC0, where μC0 is the permeability of the T-shaped magnetic core when the strength of the magnetic field is 0.
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Patent Agency Ranking
公开(公告)号：US10991681B2
公开(公告)日：2021-04-27
申请号：US16779660
申请日：2020-02-02
Applicant: CYNTEC CO., LTD.
Inventor： Da-Jung Chen , Chun-Tiao Liu , Chau-Chun Wen
IPC: H01L25/16 , H01L23/495 , H01L23/552 , H01L23/04 , H01L23/498 , H01L23/64 , H01L23/00 , H01L25/10
Abstract: A three-dimensional package structure includes an energy storage element, a semiconductor package body and a shielding layer. The semiconductor package body has a plurality of second conductive elements and at least one control device inside. The energy storage element is disposed on the semiconductor package body. The energy storage element including a magnetic body is electrically connected to the second conductive elements. The semiconductor package body or the energy storage element has a plurality of first conductive elements to be electrically connected to an outside device. The three-dimensional package structure is applicable to a POL, (Point of Load) converter.
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公开(公告)号：US20200176429A1
公开(公告)日：2020-06-04
申请号：US16779660
申请日：2020-02-02
Applicant: CYNTEC CO., LTD.
Inventor： Da-Jung Chen , Chun-Tiao Liu , Chau-Chun Wen
IPC: H01L25/16 , H01L23/64 , H01L23/498 , H01L23/495 , H01L23/04 , H01L23/552
Abstract: A three-dimensional package structure includes an energy storage element, a semiconductor package body and a shielding layer. The semiconductor package body has a plurality of second conductive elements and at least one control device inside. The energy storage element is disposed on the semiconductor package body. The energy storage element including a magnetic body is electrically connected to the second conductive elements. The semiconductor package body or the energy storage element has a plurality of first conductive elements to be electrically connected to an outside device. The three-dimensional package structure is applicable to a POL, (Point of Load) converter.
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公开(公告)号：US09805860B2
公开(公告)日：2017-10-31
申请号：US15409549
申请日：2017-01-19
Applicant: CYNTEC CO., LTD.
Inventor： Roger Hsieh , Cheng-Chang Lee , Chun-Tiao Liu , Yi-Min Huang , Chih-Siang Chuang
IPC: H01F27/29 , H01F27/255 , H01F27/28
CPC classification number: H01F27/29 , H01F5/00 , H01F5/003 , H01F7/06 , H01F17/04 , H01F27/00 , H01F27/022 , H01F27/255 , H01F27/2828 , H01F27/292 , H01F41/0206 , H01F41/10 , H05K3/301 , Y10T29/302 , Y10T29/49073 , Y10T29/49075
Abstract: A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through opening and a second through opening. A coil is disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein the first portion is electrically connected with the first terminal via the first through opening, and the second portion is electrically connected with the second terminal via the second through opening, respectively.
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公开(公告)号：US09728331B2
公开(公告)日：2017-08-08
申请号：US14565428
申请日：2014-12-10
Applicant: CYNTEC CO., LTD.
Inventor： Lan-Chin Hsieh , Roger Hsieh , Yu-Ching Kuo , Chun-Tiao Liu
CPC classification number: H01F41/005 , H01F3/10 , H01F17/04 , H01F17/045 , H01F27/022 , H01F2017/048 , Y10T29/49073
Abstract: A method to form a choke is disclosed, wherein the method comprises: encapsulating a hollow coil by a molding body; forming a first core, wherein the first core comprises a pillar; and disposing at least one first portion of the pillar inside the encapsulated hollow coil. The method avoids the overflow or vertical flow issue during a molding process for encapsulating a coil that has been wound on a core already.
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公开(公告)号：US20170133149A1
公开(公告)日：2017-05-11
申请号：US15409549
申请日：2017-01-19
Applicant: CYNTEC CO., LTD.
Inventor： Roger Hsieh , Cheng-Chang Lee , Chun-Tiao Liu , Yi-Min Huang , Chih-Siang Chuang
IPC: H01F27/29 , H01F27/28 , H01F27/255
CPC classification number: H01F27/29 , H01F5/00 , H01F5/003 , H01F7/06 , H01F17/04 , H01F27/00 , H01F27/022 , H01F27/255 , H01F27/2828 , H01F27/292 , H01F41/0206 , H01F41/10 , H05K3/301 , Y10T29/302 , Y10T29/49073 , Y10T29/49075
Abstract: A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through opening and a second through opening. A coil is disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein the first portion is electrically connected with the first terminal via the first through opening, and the second portion is electrically connected with the second terminal via the second through opening, respectively.
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