公开(公告)号：US20190074808A1

公开(公告)日：2019-03-07

申请号：US16124767

申请日：2018-09-07

Applicant: D-WAVE SYSTEMS INC.

Inventor： J. Craig Petroff ,  Sergey V. Uchaykin ,  Alexandr M. Tcaciuc ,  Gordon Lamont

IPC: H03H1/00 ,  H01L39/02 ,  H01F41/076 ,  H01F6/06 ,  H01F27/28 ,  H03H7/01 ,  H01P1/203 ,  H01L39/14 ,  H01F41/069 ,  H01F41/04

CPC classification number: H01R12/50 ,  H01F6/06 ,  H01F6/065 ,  H01F27/2823 ,  H01F41/048 ,  H01F41/069 ,  H01F41/076 ,  H01L39/02 ,  H01L39/14 ,  H01P1/203 ,  H01R13/46 ,  H03H1/00 ,  H03H7/0115 ,  H03H7/0138 ,  H03H7/1741 ,  H03H2001/0078

Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic. multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The ace between the cryogenic tubular assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

公开(公告)号：US10755190B2

公开(公告)日：2020-08-25

申请号：US15382278

申请日：2016-12-16

Applicant: D-Wave Systems Inc.

Inventor： Alexandr M. Tcaciuc ,  Pedro A. de Buen ,  Peter D. Spear ,  Sergey V. Uchaykin ,  Colin C. Enderud ,  Richard D. Neufeld ,  Jeremy P. Hilton ,  J. Craig Petroff ,  Amar B. Kamdar ,  Gregory D. Peregrym ,  Edmond Ho Yin Kan ,  Loren J. Swenson ,  George E. G. Sterling ,  Gregory Citver

IPC: H01F7/06 ,  G06N10/00 ,  H03H3/00 ,  H01F41/04 ,  H01F13/00 ,  H03H7/42 ,  H05K1/02 ,  H01F41/076 ,  H03H1/00 ,  H05K1/16 ,  H01L39/14 ,  H01L39/02

Abstract: An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.

公开(公告)号：US10097151B2

公开(公告)日：2018-10-09

申请号：US15672506

申请日：2017-08-09

Applicant: D-Wave Systems Inc.

Inventor： Murray C. Thom ,  Alexander M. Tcaciuc ,  Gordon Lamont ,  J. Craig Petroff ,  Richard D. Neufeld ,  David S. Bruce ,  Sergey V. Uchaykin

IPC: H03H7/00 ,  H01P1/20 ,  H03H1/00 ,  H01F6/06 ,  H01F41/04 ,  H01L39/14 ,  H01P1/203 ,  H01L39/02 ,  H01F27/28 ,  H03H7/01

Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

公开(公告)号：US10468793B2

公开(公告)日：2019-11-05

申请号：US16124767

申请日：2018-09-07

Applicant: D-WAVE SYSTEMS INC.

Inventor： J. Craig Petroff ,  Sergey V. Uchaykin ,  Alexandr M. Tcaciuc ,  Gordon Lamont

IPC: H01R12/50 ,  H01R13/46 ,  H03H7/01 ,  H01L39/14 ,  H01P1/203 ,  H01L39/02 ,  H01F27/28 ,  H01F41/04 ,  H03H1/00 ,  H01F6/06 ,  H01F41/069 ,  H01F41/076

Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The ace between the cryogenic tubular assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

公开(公告)号：US20170373658A1

公开(公告)日：2017-12-28

申请号：US15672506

申请日：2017-08-09

Applicant: D-Wave Systems Inc.

Inventor： Murray C. Thom ,  Alexander M. Tcaciuc ,  Gordon Lamont ,  J. Craig Petroff ,  Richard D. Neufeld ,  David S. Bruce ,  Sergey V. Uchaykin

IPC: H03H1/00 ,  H01F6/06 ,  H01L39/02 ,  H01F41/04 ,  H03H7/01 ,  H01P1/203 ,  H01L39/14 ,  H01F27/28

CPC classification number: H03H1/00 ,  H01F6/06 ,  H01F6/065 ,  H01F27/2823 ,  H01F41/048 ,  H01F41/069 ,  H01F41/076 ,  H01L39/02 ,  H01L39/14 ,  H01P1/203 ,  H03H7/0115 ,  H03H7/0138 ,  H03H7/1741 ,  H03H2001/0078

Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

公开(公告)号：US20170178018A1

公开(公告)日：2017-06-22

申请号：US15382278

申请日：2016-12-16

Applicant: D-Wave Systems Inc.

Inventor： Alexandr M. Tcaciuc ,  Pedro A. de Buen ,  Peter D. Spear ,  Sergey V. Uchaykin ,  Colin C. Enderud ,  Richard D. Neufeld ,  Jeremy P. Hilton ,  J. Craig Petroff ,  Amar B. Kamdar ,  Gregory D. Peregrym ,  Edmond Ho Yin Kan ,  Loren J. Swenson ,  George E.G. Sterling ,  Gregory Citver

IPC: G06N99/00 ,  H01L39/12 ,  H01L39/24 ,  H05K3/34 ,  H05K9/00 ,  F25B43/00 ,  H01L39/18 ,  H01F41/06 ,  H01F41/04 ,  H01F13/00 ,  F25B9/12 ,  H03H3/00 ,  H05K1/02

CPC classification number: G06N10/00 ,  H01F13/006 ,  H01F41/048 ,  H01F41/076 ,  H01L39/02 ,  H01L39/14 ,  H03H3/00 ,  H03H7/425 ,  H03H2001/005 ,  H05K1/0233 ,  H05K1/0245 ,  H05K1/16 ,  H05K2201/10287

Abstract: An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.