公开(公告)号：US10790221B2

公开(公告)日：2020-09-29

申请号：US16743145

申请日：2020-01-15

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Satoru Kuramochi ,  Sumio Koiwa ,  Hidenori Yoshioka

IPC: H01L23/498 ,  H01L25/065 ,  H05K3/44 ,  H01L25/18 ,  H05K1/11 ,  H05K3/28 ,  H01L23/48 ,  H01L23/13 ,  H01L23/15 ,  H01L23/00

Abstract: A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.

公开(公告)号：US10580727B2

公开(公告)日：2020-03-03

申请号：US16266203

申请日：2019-02-04

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Satoru Kuramochi ,  Sumio Koiwa ,  Hidenori Yoshioka

IPC: H01L23/498 ,  H01L25/065 ,  H01L25/18 ,  H05K1/11 ,  H05K3/28 ,  H05K3/44 ,  H01L23/48 ,  H01L23/13 ,  H01L23/15 ,  H01L23/00

Abstract: A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.

公开(公告)号：US10256176B2

公开(公告)日：2019-04-09

申请号：US15159323

申请日：2016-05-19

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Satoru Kuramochi ,  Sumio Koiwa ,  Hidenori Yoshioka

IPC: H01L23/498 ,  H01L25/065 ,  H01L25/18 ,  H05K1/11 ,  H05K3/28 ,  H05K3/44 ,  H01L23/48 ,  H01L23/13 ,  H01L23/15

Abstract: A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture 5 being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planar view is smallest among a plurality of areas of the through-hole in a planar view, a filler arranged within the 10 through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.

公开(公告)号：US12080637B2

公开(公告)日：2024-09-03

申请号：US17725627

申请日：2022-04-21

Applicant: Dai Nippon Printing Co., Ltd.

Inventor： Satoru Kuramochi ,  Sumio Koiwa ,  Hidenori Yoshioka

IPC: H01L23/498 ,  H01L23/48 ,  H01L25/065 ,  H01L25/18 ,  H05K1/11 ,  H05K3/28 ,  H05K3/44 ,  H01L23/00 ,  H01L23/13 ,  H01L23/15

CPC classification number: H01L23/49827 ,  H01L23/481 ,  H01L23/49894 ,  H01L25/065 ,  H01L25/18 ,  H05K1/115 ,  H05K3/28 ,  H05K3/445 ,  H01L23/13 ,  H01L23/15 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16165 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/81805 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/381 ,  H05K2201/09154 ,  H05K2201/09563 ,  H05K2201/09581 ,  H05K2201/0959 ,  H05K2201/09854 ,  H05K2203/0594 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/15787 ,  H01L2924/05432 ,  H01L2924/1579 ,  H01L2924/00014 ,  H01L2224/13109 ,  H01L2924/00014 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2224/13144 ,  H01L2924/00014 ,  H01L2224/81805 ,  H01L2924/00014 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2224/2919 ,  H01L2924/07025

Abstract: A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.

公开(公告)号：US11362028B2

公开(公告)日：2022-06-14

申请号：US16936519

申请日：2020-07-23

Applicant: Dai Nippon Printing Co., Ltd.

Inventor： Satoru Kuramochi ,  Sumio Koiwa ,  Hidenori Yoshioka

IPC: H01L23/498 ,  H01L25/065 ,  H01L25/18 ,  H05K1/11 ,  H05K3/28 ,  H05K3/44 ,  H01L23/48 ,  H01L23/13 ,  H01L23/15 ,  H01L23/00

Abstract: A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.