公开(公告)号：US20070163621A1

公开(公告)日：2007-07-19

申请号：US10591330

申请日：2005-03-07

申请人： Hitoshi Ishizaka ,  Daisuke Uenda ,  Daisuke Hanai

发明人： Hitoshi Ishizaka ,  Daisuke Uenda ,  Daisuke Hanai

IPC分类号： B08B9/00

CPC分类号： H01L21/6715 ,  H01L21/6708

摘要： An object is to provide a cleaning member for semiconductor apparatus which can easily remove, without fail, foreign matters adherent to inner parts of a semiconductor apparatus, can bear a clearly readable mark for lot management, and can be prevented from generating particles upon contact with the holding part of a wafer case. A cleaning member for semiconductor apparatus, characterized in that the cleaning member comprises a wafer 1 and formed on at least one side thereof a cleaning layer 2 made of a heat-resistant resin formed by thermally curing a poly(amic acid), and that the cleaning layer 2 has a part 12 where a wafer surface is exposed; and in particular a cleaning member for semiconductor apparatus having the constitution described above wherein that part 12 in the cleaning layer 2 in which a wafer surface is exposed is a part where the cleaning layer has been removed throughout the whole circular area having a given width ranging from the peripheral edge of the wafer toward the center thereof.

摘要翻译： 本发明的目的是提供一种用于半导体装置的清洁部件，其能够容易地去除附着于半导体装置的内部部件的异物，从而能够为批次管理提供清晰可读的标记，并且可以防止在接触时产生颗粒 晶片盒的保持部分。 一种用于半导体装置的清洁部件，其特征在于，所述清洁部件包括晶片1，并且在其至少一侧上形成由通过热固化聚（酰胺酸）形成的耐热树脂制成的清洁层2， 清洁层2具有暴露晶片表面的部分12; 特别是具有上述结构的半导体装置用清洁部件，其中，露出晶片表面的清洁层2中的部分12是在具有给定宽度范围的整个圆形区域中已经清除了清洁层的部分 从晶片的周缘朝向其中心。

公开(公告)号：US20050244632A1

公开(公告)日：2005-11-03

申请号：US11014779

申请日：2004-12-20

申请人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

发明人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

IPC分类号： B08B7/00 ,  B32B27/06

CPC分类号： B08B1/00 ,  B08B7/00 ,  B08B7/0028 ,  Y10T428/2848 ,  Y10T428/31721

摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

摘要翻译： 提供了一种用于清除离开基板处理设备内部的异物的清洁片。 清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。 或者，清洁片包括维氏硬度不低于10MPa的清洁层。

公开(公告)号：US07793668B2

公开(公告)日：2010-09-14

申请号：US11014779

申请日：2004-12-20

申请人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

发明人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

IPC分类号： B08B3/00

CPC分类号： B08B1/00 ,  B08B7/00 ,  B08B7/0028 ,  Y10T428/2848 ,  Y10T428/31721

摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

摘要翻译： 提供了一种用于清除离开基板处理设备内部的异物的清洁片。 清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。 或者，清洁片包括维氏硬度不低于10MPa的清洁层。

公开(公告)号：US20100319151A1

公开(公告)日：2010-12-23

申请号：US12851797

申请日：2010-08-06

申请人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

发明人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

IPC分类号： A47L25/00

CPC分类号： B08B1/00 ,  B08B7/00 ,  B08B7/0028 ,  Y10T428/2848 ,  Y10T428/31721

摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

摘要翻译： 提供了一种用于清除离开基板处理设备内部的异物的清洁片。 清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。 或者，清洁片包括维氏硬度不低于10MPa的清洁层。

公开(公告)号：US20060105164A1

公开(公告)日：2006-05-18

申请号：US11229586

申请日：2005-09-20

申请人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

发明人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

IPC分类号： C23G1/00 ,  B08B7/00 ,  B32B27/04 ,  B32B7/12

CPC分类号： B08B1/00 ,  B08B7/00 ,  B08B7/0028 ,  C08G73/12 ,  C08G73/16 ,  C08J7/047 ,  C08J2409/00 ,  C08J2479/00 ,  G11B5/41 ,  Y10T428/28 ,  Y10T442/2738

摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

摘要翻译： 提供了一种用于清除离开基板处理设备内部的异物的清洁片。 清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。 或者，清洁片包括维氏硬度不低于10MPa的清洁层。

公开(公告)号：US08697300B2

公开(公告)日：2014-04-15

申请号：US12935369

申请日：2009-03-18

申请人： Masakazu Sugimoto ,  Masaya Yano ,  Hitoshi Ishizaka

发明人： Masakazu Sugimoto ,  Masaya Yano ,  Hitoshi Ishizaka

IPC分类号： H01M8/18 ,  H01M8/06 ,  H01M8/24 ,  H01M2/38 ,  H01M2/40

CPC分类号： H01M8/2475 ,  C01B3/065 ,  C01B3/08 ,  C01B2203/0405 ,  C01B2203/0465 ,  C01B2203/066 ,  H01M8/04089 ,  H01M8/0606 ,  H01M8/065 ,  H01M8/241 ,  H01M8/242 ,  Y02E60/362 ,  Y02P70/56

摘要： A fuel cell of the present invention comprises a power generating cell (C), which has at least two surfaces, a fuel gas being supplied through one of the surfaces and oxygen being supplied through the other surface, thereby generating electric power, a cell holder (6) that holds the power generating cell (c) to face the one of the surfaces inward, whereby forming an inner space together with the power generating cell (C), and a fuel generating section (B) that is arranged in the inner space of the cell holder (6) and generates the fuel gas.

摘要翻译： 本发明的燃料电池包括具有至少两个表面的发电电池（C），通过一个表面供给的燃料气体和通过另一个表面供给的氧气，从而产生电力，电池座 （6），其保持所述发电单元（c）向内面对所述一个表面，由此与所述发电单元（C）一起形成内部空间;以及燃料生成部（B），其布置在所述内部 电池座（6）的空间并产生燃料气体。

公开(公告)号：US20090242506A1

公开(公告)日：2009-10-01

申请号：US12457183

申请日：2009-06-03

申请人： Kei Nakamura ,  Hitoshi Ishizaka

发明人： Kei Nakamura ,  Hitoshi Ishizaka

IPC分类号： H05K3/06

CPC分类号： H05K1/0269 ,  H01L21/4846 ,  H01L23/4985 ,  H01L23/544 ,  H01L2223/54473 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/056 ,  H05K3/303 ,  H05K2201/0108 ,  H05K2201/0969 ,  H05K2201/09918 ,  H05K2203/166 ,  Y02P70/613 ,  H01L2924/00

摘要： A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for manufacturing the wired circuit board and mounting the electronic component thereon. An insulating layer including a mounting portion is formed on a metal supporting layer having a specular gloss of 150 to 500% at an incidence angle of 45°. A conductive pattern is formed on the insulating layer. By a reflection-type optical sensor, a defective shape of the conductive pattern is inspected. Then, an opening is formed by etching the portion of the metal supporting layer which is overlapping the mounting portion such that the mounting portion of the insulating layer exposed by etching has a haze value of 20 to 50%, whereby a TAB tape carrier is obtained. Thereafter, an electronic component is aligned with the mounting portion by a reflection-type optical sensor such that the electronic component is mounted on the mounting portion.

公开(公告)号：US07561434B2

公开(公告)日：2009-07-14

申请号：US11595984

申请日：2006-11-13

申请人： Kei Nakamura ,  Hitoshi Ishizaka

发明人： Kei Nakamura ,  Hitoshi Ishizaka

IPC分类号： H05K1/00 ,  H01L23/52

CPC分类号： H05K1/0269 ,  H01L21/4846 ,  H01L23/4985 ,  H01L23/544 ,  H01L24/86 ,  H01L2223/54473 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/056 ,  H05K3/303 ,  H05K2201/0108 ,  H05K2201/0969 ,  H05K2201/09918 ,  H05K2203/166 ,  Y02P70/613 ,  H01L2924/00

摘要： A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for manufacturing the wired circuit board and mounting the electronic component thereon. An insulating layer including a mounting portion is formed on a metal supporting layer having a specular gloss of 150 to 500% at an incidence angle of 45°. A conductive pattern is formed on the insulating layer. By a reflection-type optical sensor, a defective shape of the conductive pattern is inspected. Then, an opening is formed by etching the portion of the metal supporting layer which is overlapping the mounting portion such that the mounting portion of the insulating layer exposed by etching has a haze value of 20 to 50%, whereby a TAB tape carrier is obtained. Thereafter, an electronic component is aligned with the mounting portion by a reflection-type optical sensor such that the electronic component is mounted on the mounting portion.

摘要翻译： 提供了一种布线电路板，其上形成有高可靠性导电图案并且以高精度安装电子部件，并且提供了制造布线电路板并将电子部件安装在其上的方法。 包括安装部分的绝缘层形成在入射角为45°的镜面光泽度为150至500％的金属支撑层上。 在绝缘层上形成导电图案。 通过反射型光学传感器检查导电图案的不良形状。 然后，通过蚀刻金属支撑层的与安装部分重叠的部分形成开口，使得通过蚀刻暴露的绝缘层的安装部分的雾度值为20-50％，由此获得TAB带载体 。 此后，电子部件通过反射型光学传感器与安装部对准，使得电子部件安装在安装部上。

公开(公告)号：US07358619B2

公开(公告)日：2008-04-15

申请号：US11467437

申请日：2006-08-25

申请人： Hitoshi Ishizaka

发明人： Hitoshi Ishizaka

IPC分类号： H01L23/544 ,  H01L23/58 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/0097 ,  G03F9/7076 ,  G03F9/7084 ,  H01L23/49572 ,  H01L23/4985 ,  H01L23/544 ,  H01L2924/0002 ,  H05K1/0266 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/0008 ,  H05K3/0052 ,  H05K3/0082 ,  H05K3/108 ,  H05K2201/09063 ,  H05K2201/09918 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2203/0152 ,  H05K2203/1545 ,  H05K2203/166 ,  H01L2924/00

摘要： A striped tape carrier for TAB includes a plurality of mounting parts. In the respective mounting parts, wiring patterns to bond electrodes of electronic components are formed. Each of exposure regions includes a predetermined number of mounting parts. On both sides of each of the exposure regions, alignment marks and identification marks are formed. The alignment marks are used for alignment during the exposure. The identification marks are used for specifying positions of the respective exposure regions on the tape carrier.

摘要翻译： 用于TAB的带状带状载体包括多个安装部件。 在各个安装部分中，形成了电子部件的接合电极的布线图案。 每个曝光区域包括预定数量的安装部件。 在每个曝光区域的两侧形成对准标记和识别标记。 对准标记用于曝光期间的对准。 识别标记用于指定带状载体上各个曝光区域的位置。

公开(公告)号：US20070045790A1

公开(公告)日：2007-03-01

申请号：US11467437

申请日：2006-08-25

申请人： Hitoshi Ishizaka

发明人： Hitoshi Ishizaka

IPC分类号： H01L23/495

CPC分类号： H05K3/0097 ,  G03F9/7076 ,  G03F9/7084 ,  H01L23/49572 ,  H01L23/4985 ,  H01L23/544 ,  H01L2924/0002 ,  H05K1/0266 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/0008 ,  H05K3/0052 ,  H05K3/0082 ,  H05K3/108 ,  H05K2201/09063 ,  H05K2201/09918 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2203/0152 ,  H05K2203/1545 ,  H05K2203/166 ,  H01L2924/00

摘要： A striped tape carrier for TAB includes a plurality of mounting parts. In the respective mounting parts, wiring patterns to bond electrodes of electronic components are formed. Each of exposure regions includes a predetermined number of mounting parts. On both sides of each of the exposure regions, alignment marks and identification marks are formed. The alignment marks are used for alignment during the exposure. The identification marks are used for specifying positions of the respective exposure regions on the tape carrier.

摘要翻译： 用于TAB的带状带状载体包括多个安装部件。 在各个安装部分中，形成了电子部件的接合电极的布线图案。 每个曝光区域包括预定数量的安装部件。 在每个曝光区域的两侧形成对准标记和识别标记。 对准标记用于曝光期间的对准。 识别标记用于指定带状载体上各个曝光区域的位置。