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公开(公告)号：US20090178699A1
公开(公告)日：2009-07-16
申请号：US12275863
申请日：2008-11-21
申请人： Daniel J. O'Donnell , Paul A. Crabb
发明人： Daniel J. O'Donnell , Paul A. Crabb
IPC分类号： A45B3/00
摘要： Improved gripping structures for a hand-held umbrella are provided. In one example structure, a first grip is fixedly attached to an end of a shaft of the umbrella, such as the end located distally away from a canopy of the umbrella. A second grip is coupled to the shaft. The second grip may be slidably repositionable along the shaft. The second grip may include an interlocking device to lock the second grip at a desired location along the shaft. The second grip may further include a runner interface. An accessory mount may be disposed at the first grip to couple an accessory, such as a camera, at the end of the shaft distally away from the canopy of the umbrella.
摘要翻译： 提供了用于手持式伞的改进的夹持结构。 在一个示例性结构中，第一把手固定地附接到伞的轴的端部，例如位于远离伞的顶部的端部。 第二把手与轴连接。 第二把手可以沿着轴可滑动地重新定位。 第二把手可以包括互锁装置，以将第二把手锁定在沿着轴的所需位置。 第二把手可以进一步包括转轮界面。 附件安装件可以设置在第一把手处以将诸如相机的附件在轴的端部远离伞的顶篷耦合。
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公开(公告)号：US07726326B2
公开(公告)日：2010-06-01
申请号：US12275863
申请日：2008-11-21
申请人： Daniel J. O'Donnell , Paul A. Crabb
发明人： Daniel J. O'Donnell , Paul A. Crabb
摘要： Improved gripping structures for a hand-held umbrella are provided. In one example structure, a first grip is fixedly attached to an end of a shaft of the umbrella, such as the end located distally away from a canopy of the umbrella. A second grip is coupled to the shaft. The second grip may be slidably repositionable along the shaft. The second grip may include an interlocking device to lock the second grip at a desired location along the shaft. The second grip may further include a runner interface. An accessory mount may be disposed at the first grip to couple an accessory, such as a camera, at the end of the shaft distally away from the canopy of the umbrella.
摘要翻译： 提供了用于手持式伞的改进的夹持结构。 在一个示例性结构中，第一把手固定地附接到伞的轴的端部，例如位于远离伞的顶部的端部。 第二把手与轴连接。 第二把手可以沿着轴可滑动地重新定位。 第二把手可以包括互锁装置，以将第二把手锁定在沿着轴的所需位置。 第二把手可以进一步包括转轮界面。 附件安装件可以设置在第一把手处以将诸如相机的附件在轴的端部远离伞的顶篷耦合。
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公开(公告)号：USD913784S1
公开(公告)日：2021-03-23
申请号：US29700871
申请日：2019-08-06
申请人： Daniel J. O'Donnell
设计人： Daniel J. O'Donnell
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公开(公告)号：US09780285B1
公开(公告)日：2017-10-03
申请号：US15238375
申请日：2016-08-16
CPC分类号： H01L39/223 , H01L39/025 , H01L39/2493
摘要： A method is provided of forming a superconductor device interconnect structure. The method includes forming a first dielectric layer overlying a substrate, and forming a base electrode in the first dielectric layer with the base electrode having a top surface aligned with the top surface of the first dielectric layer. The method further comprises forming a Josephson junction (JJ) over the base electrode, depositing a second dielectric layer over the JJ, the base electrode and the first dielectric layer, and forming a first contact through the second dielectric layer to the base electrode to electrically couple the first contact to a first end of the JJ, and a second contact through the second dielectric layer to a second end of the JJ.
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5.发明授权公开(公告)号：US11522118B2
公开(公告)日：2022-12-06
申请号：US16738790
申请日：2020-01-09
申请人： Christopher F. Kirby , Michael Rennie , Daniel J. O'Donnell , Aurelius L. Graninger , Aaron A. Pesetski
发明人： Christopher F. Kirby , Michael Rennie , Daniel J. O'Donnell , Aurelius L. Graninger , Aaron A. Pesetski
IPC分类号： H01L21/00 , H01L39/24 , H01L23/522 , H01L23/532
摘要： A method of forming a superconductor structure is disclosed. The method comprises forming a superconductor line in a first dielectric layer, forming a resistor with an end coupled to an end of the superconductor line, and forming a second dielectric layer overlying the resistor. The method further comprises etching a tapered opening through the second dielectric layer to the resistor, and performing a contact material fill with a normal metal material to fill the tapered opening and form a normal metal connector coupled to the resistor.
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公开(公告)号：USD364621S
公开(公告)日：1995-11-28
申请号：US31718
申请日：1994-12-05
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公开(公告)号：US10608159B2
公开(公告)日：2020-03-31
申请号：US15351755
申请日：2016-11-15
摘要： A method of forming a superconductor device structure is disclosed. The method comprises forming a base electrode in a first dielectric layer, forming a junction material stack over the base electrode, forming a hardmask over the junction material stack, etching away a portion of the junction material stack to form a Josephson junction (JJ) over the base electrode, and depositing a second dielectric layer over the hardmask, the JJ, the base electrode and the first dielectric layer. The method additionally comprises forming a first contact through the second dielectric layer to the base electrode to electrically couple the first contact to a first end of the JJ, and forming a second contact through the second dielectric layer and the hardmask to electrically coupled the second contact to a second end of the JJ.
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公开(公告)号：US20120062407A1
公开(公告)日：2012-03-15
申请号：US12272927
申请日：2008-11-18
IPC分类号： G01S13/89
CPC分类号： G01S13/885 , G01S7/02
摘要： An explosive detection system includes an unmanned vehicle and a manned vehicle. The unmanned vehicle includes a reflector. The manned vehicle includes a ground penetrating radar. The manned vehicle also includes electronics configured to process radar signals that are reflected by the reflector to detect an explosive device. The manned vehicle follows the unmanned vehicle.
摘要翻译： 爆炸检测系统包括无人驾驶车辆和载人车辆。 无人驾驶车辆包括反射器。 载人车辆包括地面穿透雷达。 载人车辆还包括被配置为处理被反射器反射以检测爆炸装置的雷达信号的电子装置。 载人车辆跟随无人驾驶车辆。
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公开(公告)号：US10312142B2
公开(公告)日：2019-06-04
申请号：US15362400
申请日：2016-11-28
IPC分类号： H01L21/00 , H01L21/768 , H01L21/02 , H01L21/027 , H01L21/311 , H01L21/321 , H01L23/522 , H01L23/528 , H01L23/532 , H01L23/66 , H01L39/12 , H01L39/24 , H01P3/08 , H01P11/00
摘要： A method of forming a superconductor structure is provided. The method comprises forming a superconducting element in a first dielectric layer that has a top surface aligned with the top surface of the first dielectric layer, forming a second dielectric layer over the first dielectric layer and the superconducting element, and forming an opening in the second dielectric layer to a top surface of the superconducting element. The method also comprises performing a cleaning process on the top surface of the superconducting element to remove oxides formed on the top surface of the superconducting element at a first processing stage, forming a protective barrier over the top surface of the superconducting element, and moving the superconductor structure to a second processing stage for further processing.
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公开(公告)号：US20180151430A1
公开(公告)日：2018-05-31
申请号：US15362400
申请日：2016-11-28
IPC分类号： H01L21/768 , H01L39/24 , H01L39/12 , H01L21/02 , H01L21/027 , H01L21/311 , H01L21/321 , H01L23/528 , H01L23/522 , H01L23/532 , H01P3/08 , H01P11/00 , H01L23/66
CPC分类号： H01L21/76891 , H01L21/02063 , H01L21/02074 , H01L21/0273 , H01L21/31116 , H01L21/3212 , H01L21/76802 , H01L21/76814 , H01L21/7684 , H01L21/76849 , H01L21/7685 , H01L21/76877 , H01L21/76883 , H01L23/5226 , H01L23/528 , H01L23/53285 , H01L23/66 , H01L39/12 , H01L39/2406 , H01L2223/6627 , H01P3/081 , H01P11/003
摘要： A method of forming a superconductor structure is provided. The method comprises forming a superconducting element in a first dielectric layer that has a top surface aligned with the top surface of the first dielectric layer, forming a second dielectric layer over the first dielectric layer and the superconducting element, and forming an opening in the second dielectric layer to a top surface of the superconducting element. The method also comprises performing a cleaning process on the top surface of the superconducting element to remove oxides formed on the top surface of the superconducting element at a first processing stage, forming a protective barrier over the top surface of the superconducting element, and moving the superconductor structure to a second processing stage for further processing.
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