公开(公告)号：US07045011B2

公开(公告)日：2006-05-16

申请号：US10604257

申请日：2003-07-07

申请人： David C. Long ,  Jason S. Miller ,  Randall J. Werner

发明人： David C. Long ,  Jason S. Miller ,  Randall J. Werner

IPC分类号： B05B15/04

CPC分类号： H05K3/1233 ,  H05K2203/0126

摘要： An integrated circuit screen printing nozzle that has a nozzle body, a first inner layer on the nozzle body, a second outer layer on the first layer, and an opening through the nozzle body, the first layer, and the second layer. The first and second layers can be an insert held within the body. The opening allows paste material to flow through the screen printing nozzle to the stencil mask. Also, the second outer layer includes a contact surface adapted to contact the stencil mask. One feature of the invention is that the first layer is softer (has a lower durometer) than the second layer. This allows the second layer to be more durable than the first layer and for the first layer to provide additional flexibility to the second layer. Therefore, the invention provides a nozzle that has the high durability characteristics of a hard outer surface with the compliance of a soft nozzle.

摘要翻译： 一种集成电路丝网印刷喷嘴，其具有喷嘴体，所述喷嘴体上的第一内层，所述第一层上的第二外层，以及通过所述喷嘴体，所述第一层和所述第二层的开口。 第一和第二层可以是保持在体内的插入物。 该开口允许糊料材料通过丝网印刷喷嘴流到模板掩模。 此外，第二外层包括适于接触模板掩模的接触表面。 本发明的一个特征是第一层比第二层更软（具有较低的硬度）。 这允许第二层比第一层更耐用，并且第一层为第二层提供额外的灵活性。 因此，本发明提供了一种具有柔软喷嘴的柔软性的硬外表面的高耐久性特性的喷嘴。

公开(公告)号：US08090504B2

公开(公告)日：2012-01-03

申请号：US11971503

申请日：2008-01-09

申请人： David C. Long ,  Randall J. Werner

发明人： David C. Long ,  Randall J. Werner

IPC分类号： B60R21/01

CPC分类号： B60R22/48 ,  B60R21/01546 ,  B60R2021/01088 ,  B60R2022/4816 ,  B60R2022/4858 ,  B60R2022/4866

摘要： Methods, systems and apparatus for automatically ensuring passenger safety by identifying article(s) in need of securing in a vehicle and attaching at least one wireless signaling component to each article. Each wireless signaling component includes a wireless signaling device and a mechanical blocking device that controls a wireless signal emitted from the wireless signaling device. The emitted wireless signaling indicates a state of the article. State information relating to a state of each article is generated and received at a data network device, which generates state results based on this state information. The state results are output to an end user, whereby the state results identify those articles that are secured, unsecured, and/or improperly secured, for automatically ensuring passenger safety.

摘要翻译： 用于通过识别需要固定在车辆中并附着至少一个无线信令部件到每个物品上的物品来自动确保乘客安全的方法，系统和装置。 每个无线信令组件包括无线信令装置和机械阻塞装置，其控制从无线信令装置发射的无线信号。 所发射的无线信号表示文章的状态。 在数据网络设备生成并接收与每个物品的状态有关的状态信息，该数据网络设备基于该状态信息生成状态结果。 将状态结果输出给最终用户，由此状态结果识别那些固定，不安全和/或不正确地固定的物品，以自动确保乘客的安全。

公开(公告)号：US08962701B2

公开(公告)日：2015-02-24

申请号：US13326017

申请日：2011-12-14

申请人： Paul D. Oldenburg ,  Michel Daage ,  Virginia M. Roberts ,  Paul J. Berlowitz ,  David C. Long ,  James R. Bielenberg

发明人： Paul D. Oldenburg ,  Michel Daage ,  Virginia M. Roberts ,  Paul J. Berlowitz ,  David C. Long ,  James R. Bielenberg

IPC分类号： C07C27/00 ,  C07C51/43 ,  C07C1/00

CPC分类号： C07C29/1518 ,  C10G2/32 ,  C10J2300/0916 ,  C10J2300/1659 ,  C10J2300/1665 ,  C10J2300/1681 ,  C10K1/005 ,  C10K3/04 ,  C11B1/04 ,  C11B1/10 ,  C11C3/003 ,  C12P7/6463 ,  Y02E50/18 ,  Y02E50/343 ,  Y02P20/125 ,  Y02P20/145 ,  Y02P20/582 ,  C07C31/04

摘要： Systems and methods are provided for enhancing the integration of processes for recovering products from algae-derived biomass. The enhanced process integration allows for increased use of input streams and other reagents that are derived from renewable sources. This increases the overall renewable character of the products extracted from the algae-derived biomass. The process integration can include exchange of input streams or energy between an algae processing system and a system for processing non-algal biomass. One example of improving process integration is using oxygenates that are generated in a renewable manner as a reagent for enhancing the algae processing system.

公开(公告)号：US08487148B2

公开(公告)日：2013-07-16

申请号：US13285519

申请日：2011-10-31

申请人： Virginia M. Roberts ,  Michel Daage ,  Paul D. Oldenburg ,  James R. Bielenberg ,  Paul J. Berlowitz ,  David C. Long ,  Halou Oumar-Mahamat

发明人： Virginia M. Roberts ,  Michel Daage ,  Paul D. Oldenburg ,  James R. Bielenberg ,  Paul J. Berlowitz ,  David C. Long ,  Halou Oumar-Mahamat

IPC分类号： C10M169/04

CPC分类号： C10G3/42 ,  C10G3/47 ,  C10G3/48 ,  C10G3/50 ,  C10G2300/1014 ,  C10G2300/1018 ,  C10G2300/301 ,  C10G2300/4018 ,  C10J2300/0916 ,  Y02P20/145 ,  Y02P30/20

摘要： Biomass based feeds are processed under hydrothermal treatment conditions, e.g., to produce a hydrocarbon liquid product and a solids portion. The hydrothermal treatment can be performed in the presence of heterogeneous catalyst particles that can optionally include a catalyst metal or metal salt. The presence of the heterogeneous catalyst can modify the nature of the hydrocarbon products produced from the hydrothermal treatment.

摘要翻译： 基于生物质的饲料在水热处理条件下进行处理，例如产生烃液体产物和固体部分。 水热处理可以在可任选地包括催化剂金属或金属盐的非均相催化剂颗粒的存在下进行。 非均相催化剂的存在可以改变由水热处理产生的烃产物的性质。

公开(公告)号：US07819027B2

公开(公告)日：2010-10-26

申请号：US11766869

申请日：2007-06-22

申请人： Virendra R. Jadhav ,  Vijayeshwar D. Khanna ,  David C. Long ,  David L. Questad

发明人： Virendra R. Jadhav ,  Vijayeshwar D. Khanna ,  David C. Long ,  David L. Questad

IPC分类号： G01L5/24

CPC分类号： G01N19/04 ,  G01N3/00 ,  G01N3/08 ,  G01N2203/0017 ,  G01N2203/0296 ,  Y10T29/49995

摘要： A tensile strength testing structure for controlled collapse chip connections (C4) disposed above a substrate includes: a fixture base configured for positioning substrates with C4; a top fixture plate with through hole channels; test pins for insertion through the through hole channels; wherein dimensional tolerances of the substrates are accounted for with openings on at least two sides of the fixture base for positioning the substrates, and during alignment of the top fixture plate through hole channels with the C4 prior to securing the top fixture plate to the fixture base; wherein the test pins are strain hardened metal wires; wherein lower ends of the test pins are joined to the C4 during a solder reflow process; and wherein distal ends of the test pins are pulled in a direction perpendicular to the testing structure to determine the tensile strength of the C4.

摘要翻译： 设置在基板上方的受控崩溃芯片连接（C4）的拉伸强度测试结构包括：被配置用于用C4定位基板的固定座; 具有通孔通道的顶部固定板; 测试销用于插入通孔通道; 其中基板的尺寸公差被用于定位基板的固定基座的至少两个侧面上的开口，并且在将顶部固定板固定到固定基座之前以及在顶部固定板通过孔通道与C4对准期间 ; 其中所述测试销是应变硬化金属线; 其中在焊料回流工艺期间，测试销的下端连接到C4; 并且其中测试销的远端在垂直于测试结构的方向上拉动以确定C4的拉伸强度。

公开(公告)号：US20090145973A1

公开(公告)日：2009-06-11

申请号：US12348364

申请日：2009-01-05

申请人： Mukta G. Farooq ,  Benjamin V. Fasano ,  Jason L. Frankel ,  Harvey C. Hamel ,  Suresh D. Kadakia ,  David C. Long ,  Frank L. Pompeo ,  Sudipta K. Ray

发明人： Mukta G. Farooq ,  Benjamin V. Fasano ,  Jason L. Frankel ,  Harvey C. Hamel ,  Suresh D. Kadakia ,  David C. Long ,  Frank L. Pompeo ,  Sudipta K. Ray

IPC分类号： G06K19/06

CPC分类号： G06K19/07381 ,  H01L23/04 ,  H01L23/055 ,  H01L23/10 ,  H01L23/576 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/3011 ,  H05K1/0275 ,  H05K1/0306 ,  H05K1/144 ,  H05K2201/09263 ,  H05K2201/10151

摘要： A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier; one or more integrated circuit chips attached to a top surface of the chip carrier; a ceramic-based cap structure attached to the top surface of the chip carrier, and covering the one or more integrated circuit chips; and a conductive grid structure embedded within the chip carrier and the cap structure, the conductive grid structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction; wherein the conductive grid structure is configured so as to detect an attempt to penetrate the IC module.

摘要翻译： 防篡改集成电路（IC）模块包括陶瓷芯片载体; 一个或多个集成电路芯片，附接到芯片载体的顶表面; 一个陶瓷基帽结构，附着在芯片载体的顶表面上，并覆盖一个或多个集成电路芯片; 以及嵌入在所述芯片载体和所述盖结构内的导电栅格结构，所述导电栅格结构具有设置在x方向，y方向和z方向上的多个曲折线; 其中所述导电栅格结构被配置为检测穿透所述IC模块的尝试。

公开(公告)号：US20090090229A1

公开(公告)日：2009-04-09

申请号：US11866470

申请日：2007-10-03

申请人： Anthony F. Coneski ,  Michael J. Domitrovits ,  David C. Long

发明人： Anthony F. Coneski ,  Michael J. Domitrovits ,  David C. Long

IPC分类号： B26D7/06

CPC分类号： B26D7/2628 ,  B26F1/02 ,  B26F1/04 ,  H05K1/0306 ,  H05K3/005 ,  H05K2203/0173 ,  H05K2203/1105 ,  Y10T83/2092 ,  Y10T83/9423 ,  Y10T83/943 ,  Y10T83/944

摘要： An apparatus for maintaining alignment between precision ground plates includes a first plate including a main body portion having plurality of passages. The first plate also includes a first heating device mounted to heat the main body portion to a selected temperature. A second plate including a main body portion having a plurality of passages is positioned adjacent the first plate. The second plate includes a second heating device mounted to heat the main body portion to a selected temperature. A controller operatively connected to the first and second heating devices selectively establishes a desired temperature in each of the first and second plates to facilitate a desired alignment between the plurality of passages in the first plate and the plurality of passages in the second plate.

摘要翻译： 用于保持精密接地板之间的对准的装置包括：第一板，包括具有多个通道的主体部分。 第一板还包括安装成将主体部分加热至选定温度的第一加热装置。 包括具有多个通道的主体部分的第二板位于第一板附近。 第二板包括安装成将主体部分加热至选定温度的第二加热装置。 可操作地连接到第一和第二加热装置的控制器选择性地在第一和第二板中的每一个中建立期望的温度，以促进第一板中的多个通道和第二板中的多个通道之间的期望对准。

公开(公告)号：US20080313879A1

公开(公告)日：2008-12-25

申请号：US11766869

申请日：2007-06-22

申请人： Virendra R. Jadhav ,  Vijayeshwar D. Khanna ,  David C. Long ,  David L. Questad

发明人： Virendra R. Jadhav ,  Vijayeshwar D. Khanna ,  David C. Long ,  David L. Questad

IPC分类号： G01N3/08 ,  G01N3/62

CPC分类号： G01N19/04 ,  G01N3/00 ,  G01N3/08 ,  G01N2203/0017 ,  G01N2203/0296 ,  Y10T29/49995

摘要： A tensile strength testing structure for controlled collapse chip connections (C4) disposed above a substrate includes: a fixture base configured for positioning substrates with C4; a top fixture plate with through hole channels; test pins for insertion through the through hole channels; wherein dimensional tolerances of the substrates are accounted for with openings on at least two sides of the fixture base for positioning the substrates, and during alignment of the top fixture plate through hole channels with the C4 prior to securing the top fixture plate to the fixture base; wherein the test pins are strain hardened metal wires; wherein lower ends of the test pins are joined to the C4 during a solder reflow process; and wherein distal ends of the test pins are pulled in a direction perpendicular to the testing structure to determine the tensile strength of the C4.

摘要翻译： 设置在基板上方的受控崩溃芯片连接（C4）的拉伸强度测试结构包括：被配置用于用C4定位基板的固定座; 具有通孔通道的顶部固定板; 测试销用于插入通孔通道; 其中基板的尺寸公差被用于定位基板的固定基座的至少两个侧面上的开口，并且在将顶部固定板固定到固定基座之前以及在顶部固定板通过孔通道与C4对准期间 ; 其中所述测试销是应变硬化金属线; 其中在焊料回流工艺期间，测试销的下端连接到C4; 并且其中测试销的远端在垂直于测试结构的方向上拉动以确定C4的拉伸强度。

公开(公告)号：US20080225484A1

公开(公告)日：2008-09-18

申请号：US11687037

申请日：2007-03-16

申请人： William L. Brodsky ,  Peter J. Brofman ,  James A. Busby ,  Bruce J. Chamberlin ,  Scott A. Cummings ,  David L. Edwards ,  Thomas J. Fleischman ,  Michael J. Griffin ,  Sushumna Iruvanti ,  David C. Long ,  Jennifer V. Muncy ,  Robin A. Susko

发明人： William L. Brodsky ,  Peter J. Brofman ,  James A. Busby ,  Bruce J. Chamberlin ,  Scott A. Cummings ,  David L. Edwards ,  Thomas J. Fleischman ,  Michael J. Griffin ,  Sushumna Iruvanti ,  David C. Long ,  Jennifer V. Muncy ,  Robin A. Susko

IPC分类号： H05K7/20

CPC分类号： H01L23/42 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/3511 ,  H01L2224/0401

摘要： Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed between top and bottom conductive layers, with the bottom layer having a flexible reservoir residing on opposing sides of a central portion of the pillow that has a gap. The pillow may have roughened internal surfaces to increase an internal surface area within the pillow for enhanced heat dissipation. In an electronic assembly, the central portion of the pillow resides between a heat sink and heat-generating component for the thermal coupling there-between. During thermal cycling, the flexible reservoir of the pillow expands to retain thermally conductive material extruded from the gap, and then contracts to force such extruded material back into the gap. An external pressure source may contact the pillow for further forcing the extruded thermally conductive material back into the gap.

摘要翻译： 使用柔性热枕头增强电子部件传热的方法，装置和组件。 柔性热枕头具有密封在顶部和底部导电层之间的导热材料，底层具有位于枕头的中心部分的具有间隙的相对侧上的柔性容器。 枕头可能具有粗糙的内表面以增加枕头内的内表面积，以增强散热。 在电子组件中，枕头的中心部分位于散热器和用于其之间的热耦合的发热部件之间。 在热循环期间，枕头的柔性储存器膨胀以保持从间隙挤出的导热材料，然后收缩以迫使这种挤出的材料回到间隙中。 外部压力源可以接触枕头，以进一步迫使挤出的导热材料回到间隙中。

公开(公告)号：US07118385B1

公开(公告)日：2006-10-10

申请号：US11162779

申请日：2005-09-22

申请人： Paul Bodenweber ,  David C. Long ,  Jason S. Miller ,  Robert P. Westerfield, Jr. ,  Yuet-Ying Yu

发明人： Paul Bodenweber ,  David C. Long ,  Jason S. Miller ,  Robert P. Westerfield, Jr. ,  Yuet-Ying Yu

IPC分类号： H01R12/00

CPC分类号： H05K7/1061

摘要： A self-aligning socket for an integrated circuit package includes an outer frame and an array of contacts configured for alignment with corresponding conductive pads on the bottom of the integrated circuit package. The outer frame further includes a first plurality of alignment ball bearings configured thereon, the ball bearings mounted on cantilevered spring rods.

摘要翻译： 用于集成电路封装的自对准插座包括外框架和触头阵列，其被配置为与集成电路封装的底部上的对应导电焊盘对准。 外框架还包括构造在其上的第一多个对准球轴承，球轴承安装在悬臂弹簧杆上。