-
公开(公告)号：US08008783B2
公开(公告)日：2011-08-30
申请号：US12946185
申请日：2010-11-15
IPC分类号： H01L23/48
CPC分类号： H01L24/29 , C09J5/00 , C09J7/20 , C09J2203/326 , C09J2205/302 , C09J2205/31 , C09J2433/00 , C09J2463/00 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01056 , H01L2924/01074 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/10329 , H01L2924/14 , H01L2924/19043 , Y10S438/928 , Y10T156/10 , Y10T428/1452 , Y10T428/1486 , Y10T428/28 , Y10T428/287 , Y10T428/2891 , H01L2924/00
摘要： Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.
摘要翻译： 提供了一种胶带，装置和方法，其通常涉及用作切割胶带的单层粘合剂，以及用于在半导体器件制造中切割薄化晶片和芯片附着操作的芯片附着粘合剂。 胶带，装置和方法包括具有包括图案的表面改性的背衬。
-
公开(公告)号：US20110064948A1
公开(公告)日：2011-03-17
申请号：US12946185
申请日：2010-11-15
IPC分类号： B32B7/12
CPC分类号： H01L24/29 , C09J5/00 , C09J7/20 , C09J2203/326 , C09J2205/302 , C09J2205/31 , C09J2433/00 , C09J2463/00 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01056 , H01L2924/01074 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/10329 , H01L2924/14 , H01L2924/19043 , Y10S438/928 , Y10T156/10 , Y10T428/1452 , Y10T428/1486 , Y10T428/28 , Y10T428/287 , Y10T428/2891 , H01L2924/00
摘要： Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.
摘要翻译： 提供了一种胶带，装置和方法，其通常涉及用作切割胶带的单层粘合剂，以及用于在半导体器件制造中切割薄化晶片和芯片附着操作的芯片附着粘合剂。 胶带，装置和方法包括具有包括图案的表面改性的背衬。
-
公开(公告)号：US20090227089A1
公开(公告)日：2009-09-10
申请号：US12399054
申请日：2009-03-06
IPC分类号： H01L21/302 , B32B33/00 , C09J133/08
CPC分类号： H01L24/29 , C09J5/00 , C09J7/20 , C09J2203/326 , C09J2205/302 , C09J2205/31 , C09J2433/00 , C09J2463/00 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01056 , H01L2924/01074 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/10329 , H01L2924/14 , H01L2924/19043 , Y10S438/928 , Y10T156/10 , Y10T428/1452 , Y10T428/1486 , Y10T428/28 , Y10T428/287 , Y10T428/2891 , H01L2924/00
摘要： Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.
摘要翻译： 提供了一种胶带，装置和方法，其通常涉及用作切割胶带的单层粘合剂，以及用于在半导体器件制造中切割薄化晶片和芯片附着操作的芯片附着粘合剂。 胶带，装置和方法包括具有包括图案的表面改性的背衬。
-
公开(公告)号：US07858499B2
公开(公告)日：2010-12-28
申请号：US12399054
申请日：2009-03-06
IPC分类号： H01L21/00
CPC分类号： H01L24/29 , C09J5/00 , C09J7/20 , C09J2203/326 , C09J2205/302 , C09J2205/31 , C09J2433/00 , C09J2463/00 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01056 , H01L2924/01074 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/10329 , H01L2924/14 , H01L2924/19043 , Y10S438/928 , Y10T156/10 , Y10T428/1452 , Y10T428/1486 , Y10T428/28 , Y10T428/287 , Y10T428/2891 , H01L2924/00
摘要： Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.
摘要翻译： 提供了一种胶带，装置和方法，其通常涉及用作切割胶带的单层粘合剂，以及用于在半导体器件制造中切割薄化晶片和芯片附着操作的芯片附着粘合剂。 胶带，装置和方法包括具有包括图案的表面改性的背衬。
-
公开(公告)号：US08022145B2
公开(公告)日：2011-09-20
申请号：US12530692
申请日：2008-03-07
CPC分类号： H01L21/6836 , C08L63/00 , C08L2666/02 , C08L2666/14 , C09J7/20 , C09J133/08 , C09J2203/326 , C09J2433/00 , C09J2463/00 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/83855 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01047 , H01L2924/01056 , H01L2924/01073 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/10329 , H01L2924/14 , Y10T428/2852 , Y10T428/287 , Y10T428/2878 , Y10T428/2891 , H01L2924/00
摘要： Provided is a single layer adhesive that provides the appropriate balance of adhesion and clean release required for a wafer dicing function and also provides the necessary bond required in a subsequent die attach step. The adhesive composition comprises an acrylate ester polymer having a functional group, a multi-functional thermosetting resin, wherein the acrylate ester polymer and the thermosetting resin are capable of reacting with each other, a multi-functional acrylate ester, an acrylate ester polymerization catalyst or curing agent, a thermally-latent catalyst suitable for curing the multi-functional thermosetting resin, and an acrylic acid salt.
摘要翻译： 提供了单层粘合剂，其提供了晶片切割功能所需的粘合和清洁释放的适当平衡，并且还提供随后的管芯附着步骤中所需的必要的粘合。 粘合剂组合物包括具有官能团的丙烯酸酯聚合物，多官能热固性树脂，其中丙烯酸酯聚合物和热固性树脂能够彼此反应，多官能丙烯酸酯，丙烯酸酯聚合催化剂或 固化剂，适于固化多官能热固性树脂的热潜催化剂和丙烯酸盐。
-
公开(公告)号：US20100056725A1
公开(公告)日：2010-03-04
申请号：US12530692
申请日：2008-03-07
CPC分类号： H01L21/6836 , C08L63/00 , C08L2666/02 , C08L2666/14 , C09J7/20 , C09J133/08 , C09J2203/326 , C09J2433/00 , C09J2463/00 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/83855 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01047 , H01L2924/01056 , H01L2924/01073 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/10329 , H01L2924/14 , Y10T428/2852 , Y10T428/287 , Y10T428/2878 , Y10T428/2891 , H01L2924/00
摘要： Provided is a single layer adhesive that provides the appropriate balance of adhesion and clean release required for a wafer dicing function and also provides the necessary bond required in a subsequent die attach step. The adhesive composition comprises an acrylate ester polymer having a functional group, a multi-functional thermosetting resin, wherein the acrylate ester polymer and the thermosetting resin are capable of reacting with each other, a multi-functional acrylate ester, an acrylate ester polymerization catalyst or curing agent, a thermally-latent catalyst suitable for curing the multi-functional thermosetting resin, and an acrylic acid salt.
摘要翻译： 提供了单层粘合剂，其提供了晶片切割功能所需的粘合和清洁释放的适当平衡，并且还提供随后的管芯附着步骤中所需的必要的粘合。 粘合剂组合物包括具有官能团的丙烯酸酯聚合物，多官能热固性树脂，其中丙烯酸酯聚合物和热固性树脂能够彼此反应，多官能丙烯酸酯，丙烯酸酯聚合催化剂或 固化剂，适于固化多官能热固性树脂的热潜催化剂和丙烯酸盐。
-
7.发明申请CURABLE COMPOSITION, ARTICLES COMPRISING THE CURABLE COMPOSITION, AND METHOD OF MAKING THE SAME 有权可固化组合物，包含可固化组合物的制品及其制备方法公开(公告)号：US20130295311A1
公开(公告)日：2013-11-07
申请号：US13461957
申请日：2012-05-02
申请人： Eric G. Larson
发明人： Eric G. Larson
CPC分类号： B32B7/12 , B32B27/38 , B32B2405/00 , B32B2457/14 , C08G59/4284 , C08K3/08 , C08K2003/085 , C08L33/068 , C08L63/00 , Y10T156/10 , Y10T428/14 , Y10T428/2848 , Y10T428/31511 , C08L67/00 , C08F2220/1825 , C08F2220/325
摘要： A curable composition includes polyepoxide, high-melting metal particles having a melting point above 300° C., low-melting metallic particles having a melting point of less than or equal to 300° C., and a fluxing curing agent comprising a fluxing curing agent comprising: a hydroxyalkyl-substituted tertiary amine, and at least one diacid compound represented by the formula: HO2C—Z1—CH2CH2CH2—Z2—CO2H wherein Z1 and Z2 independently represent a covalent bond or an aliphatic hydrocarbylene group. The at least one diacid compound comprises at least 50 percent of the total weight of carboxylic acids and anhydrides present in the curable composition. Articles comprising the curable composition, and methods of making the same are also disclosed.
摘要翻译： 可固化组合物包括聚环氧化物，熔点高于300℃的高熔点金属颗粒，熔点小于或等于300℃的低熔点金属颗粒，以及包含助熔固化剂 其包含：羟烷基取代的叔胺和由式HO2C-Z1-CH2CH2CH2-Z2-CO2H表示的至少一种二酸化合物，其中Z1和Z2独立地表示共价键或脂族亚烃基。 所述至少一种二酸化合物包含可固化组合物中存在的羧酸和酸酐的总重量的至少50％。 还公开了包含可固化组合物的制品及其制备方法。
-
8.发明授权Abrasive articles having abrasive layer bond system derived from solid, dry-coated binder precursor particles having a fusible, radiation curable component 有权具有研磨层结合系统的磨料制品衍生自具有可熔，可辐射固化组分的固体，干涂层粘合剂前体颗粒公开(公告)号：US06441058B2
公开(公告)日：2002-08-27
申请号：US09761371
申请日：2001-01-16
申请人： Ernest L. Thurber , Eric G. Larson , Gregg D. Dahlke , Robert J. DeVoe , Alan R. Kirk , Mark R. Meierotto , Roy Stubbs
发明人： Ernest L. Thurber , Eric G. Larson , Gregg D. Dahlke , Robert J. DeVoe , Alan R. Kirk , Mark R. Meierotto , Roy Stubbs
IPC分类号： C09D503
CPC分类号： B24D11/001 , B24D3/28 , B24D3/344 , B24D11/005 , Y10T428/24372 , Y10T428/24413
摘要： The present invention involves the use of powder coating methods to form coated abrasives. In one embodiment, the powder is in the form of a multiplicity of binder precursor particles comprising a radiation curable component. In other embodiments, the powder comprises at least one metal salt of a fatty acid and optionally an organic component that may be a thermoplastic macromolecule, a radiation curable component, and/or a thermally curable macromolecule. In either embodiment, the powder exists as a solid under the desired dry coating conditions, but is easily melted at relatively low temperatures and then solidified also at reasonably low processing temperatures. The principles of the present invention can be applied to form make coats, size coats, and/or supersize coats, as desired.
摘要翻译： 本发明涉及使用粉末涂覆方法来形成涂覆的磨料。 在一个实施方案中，粉末是包含可辐射固化组分的多种粘合剂前体颗粒的形式。 在其它实施方案中，粉末包含至少一种脂肪酸金属盐和任选的可以是热塑性高分子的有机组分，可辐射固化组分和/或可热固化的大分子。 在任一实施方案中，粉末在所需的干涂层条件下以固体形式存在，但在相对低的温度下容易熔化，然后在相当低的加工温度下固化。 根据需要，本发明的原理可以应用于制造外衣，尺码外套和/或超大包衣。
-
9.发明授权Abrasive articles incorporating addition polymerizable resins and reactive diluents 失效加入可聚合树脂和反应性稀释剂的磨料制品
公开(公告)号：US5580647A
公开(公告)日：1996-12-03
申请号：US522610
申请日：1995-09-01
申请人： Eric G. Larson , Ernest L. Thurber , Alan R. Kirk , Gregg D. Dahlke , Elizabeth C. Edblom , Don H. Kincaid
发明人： Eric G. Larson , Ernest L. Thurber , Alan R. Kirk , Gregg D. Dahlke , Elizabeth C. Edblom , Don H. Kincaid
CPC分类号： B24D3/344 , B24D11/00 , B24D3/28 , Y10T442/699
摘要： Abrasive articles made using a coatable, addition polymerizable binder precursor composition are described, as well as methods of making same. The compositions comprise a reactive diluent compound and preferably an addition polymerizable resin, the reactive diluent being an organic compound selected to be especially effective in solubilizing aminoplast resins.
摘要翻译： 描述了使用可涂覆的可加成聚合的粘合剂前体组合物制成的研磨制品，以及制备它们的方法。 组合物包含反应性稀释剂化合物，优选加成可加聚树脂，反应性稀释剂是选择在增溶氨基塑料树脂中特别有效的有机化合物。
-
公开(公告)号：US5451446A
公开(公告)日：1995-09-19
申请号：US83215
申请日：1993-06-25
IPC分类号： B24D3/28 , B24D11/02 , C08G59/02 , C08G59/20 , C08G59/40 , C08J5/14 , C08K3/00 , C08L63/00 , C08L101/00 , C09K3/14 , D06N7/04
CPC分类号： B24D3/28 , Y10T428/24372 , Y10T428/24413 , Y10T428/24421 , Y10T442/2107
摘要： The invention relates to an abrasive article comprising:(a) a plurality of abrasive grains; and(b) at least one binder for the abrasive grains,wherein the binder comprises a cured epoxy resin containing a polycyclic aryl, polycyclic alkyl, or cycloalkyl structure. The abrasive articles can comprise bonded, non-woven or coated abrasive articles.
摘要翻译： 本发明涉及一种磨料制品，包括：（a）多个磨粒; 和（b）用于磨料颗粒的至少一种粘合剂，其中所述粘合剂包含含有多环芳基，多环烷基或环烷基结构的固化环氧树脂。 研磨制品可以包括粘合的，非织造的或涂覆的磨料制品。
-
-
-
-
-
-
-
-
-
搜索结果
46 条记录 (耗时 0.031 秒)
