公开(公告)号：US09117866B2

公开(公告)日：2015-08-25

申请号：US13563066

申请日：2012-07-31

申请人： David Marquardt ,  John Shugrue

发明人： David Marquardt ,  John Shugrue

IPC分类号： G01B11/14 ,  H01L21/68 ,  F27D3/00 ,  H01L21/67

CPC分类号： H01L21/681 ,  F27D3/0084 ,  G01B11/14 ,  H01L21/67259

摘要： An apparatus for processing a wafer including a reaction chamber having a reaction space for processing the wafer, a susceptor positioned within the reaction chamber and having a sidewall, at least one light source positioned outside of the reaction space, at least one window in the reaction chamber, and wherein the at least one light source is directed through the at least one window to contact the sidewall.

摘要翻译： 一种用于处理晶片的装置，包括具有用于处理晶片的反应空间的反应室，位于反应室内并具有侧壁的基座，位于反应空间外部的至少一个光源，反应中的至少一个窗口 室，并且其中所述至少一个光源被引导通过所述至少一个窗口以接触所述侧壁。

公开(公告)号：US20140036274A1

公开(公告)日：2014-02-06

申请号：US13563066

申请日：2012-07-31

申请人： David Marquardt ,  John Shugrue

发明人： David Marquardt ,  John Shugrue

IPC分类号： F27D11/00 ,  G01B11/14

CPC分类号： H01L21/681 ,  F27D3/0084 ,  G01B11/14 ,  H01L21/67259

摘要： An apparatus for processing a wafer including a reaction chamber having a reaction space for processing the wafer, a susceptor positioned within the reaction chamber and having a sidewall, at least one light source positioned outside of the reaction space, at least one window in the reaction chamber, and wherein the at least one light source is directed through the at least one window to contact the sidewall.

摘要翻译： 一种用于处理晶片的装置，包括具有用于处理晶片的反应空间的反应室，位于反应室内并具有侧壁的基座，位于反应空间外部的至少一个光源，反应中的至少一个窗口 室，并且其中所述至少一个光源被引导通过所述至少一个窗口以接触所述侧壁。

公开(公告)号：US06758939B2

公开(公告)日：2004-07-06

申请号：US09943699

申请日：2001-08-31

申请人： David Marquardt ,  Wayne Lougher ,  Stephen C. Schultz

发明人： David Marquardt ,  Wayne Lougher ,  Stephen C. Schultz

IPC分类号： B24B100

CPC分类号： B24B37/30 ,  B24B37/32

摘要： A laminated wear ring for a chemical mechanical planarization (CMP) apparatus provides improved control of the removal rate of material from the edge of a wafer during a polishing/planarization operation. The laminated wear ring includes a high stiffness stainless steel base and a plastic laminate. The high stiffness stainless steel base avoids flexing of the wear ring during polishing and thus provides control of the flexing of a polish pad against which the wafer surface is pressed. The plastic laminate protects the stainless steel base from attack by the polishing slurry and provides a buffer that protects the stainless steel base from mechanically damaging the wafer and vice versa.

摘要翻译： 用于化学机械平面化（CMP）装置的层压耐磨环提供了在抛光/平坦化操作期间对晶片边缘的材料的去除速率的改进的控制。 层压耐磨环包括高刚度不锈钢基座和塑料层压板。 高刚度不锈钢底座避免了抛光过程中磨损环的弯曲，从而提供了对晶片表面进行加压的抛光垫的弯曲的控制。 塑料层压板保护不锈钢基体免受抛光浆料的侵蚀，并提供缓冲液，保护不锈钢基体免受机械损伤晶片，反之亦然。

公开(公告)号：US07229339B2

公开(公告)日：2007-06-12

申请号：US10884371

申请日：2004-07-02

申请人： John F. Stumpf ,  Franklin D. Root ,  Brian Severson ,  David Marquardt ,  John Derwood Herb ,  James Jed Crawford ,  Rand Conner ,  Jasent Montano ,  Kevin Bertsch ,  Robert Marshall Stowell ,  Edmund Minshall ,  Timothy Cleary

发明人： John F. Stumpf ,  Franklin D. Root ,  Brian Severson ,  David Marquardt ,  John Derwood Herb ,  James Jed Crawford ,  Rand Conner ,  Jasent Montano ,  Kevin Bertsch ,  Robert Marshall Stowell ,  Edmund Minshall ,  Timothy Cleary

IPC分类号： B24B5/00

CPC分类号： B24B37/345

摘要： Methods and apparatus are provided for the chemical mechanical planarization (CMP) of a surface of a work piece. In accordance with one embodiment of the invention the apparatus comprises a plurality of CMP systems, a plurality of load cups for loading unprocessed work pieces into and unloading processed work pieces from the plurality of CMP systems, a plurality of cleaning stations for cleaning processed work pieces unloaded from the CMP systems, and a single robot configured to transfer unprocessed work pieces to the plurality of load cups and to transfer processed work pieces from the load cups to the plurality of cleaning stations.

摘要翻译： 提供了用于工件表面的化学机械平坦化（CMP）的方法和装置。 根据本发明的一个实施例，该装置包括多个CMP系统，用于将未处理的工件装载到多个CMP系统中并从其卸载加工的工件的多个装载杯;多个用于清洁加工件的清洁站 从CMP系统卸载的单个机器人和被配置为将未处理的工件传送到多个装载杯并将加工的工件从加载杯传送到多个清洁站的单个机器人。

公开(公告)号：US20060003671A1

公开(公告)日：2006-01-05

申请号：US10884371

申请日：2004-07-02

申请人： John Stumpf ,  Franklin Root ,  Brian Severson ,  David Marquardt ,  John Herb ,  James Crawford ,  Rand Conner ,  Jasent Montano ,  Kevin Bertsch ,  Robert Stowell ,  Edmund Minshall ,  Timothy Cleary

发明人： John Stumpf ,  Franklin Root ,  Brian Severson ,  David Marquardt ,  John Herb ,  James Crawford ,  Rand Conner ,  Jasent Montano ,  Kevin Bertsch ,  Robert Stowell ,  Edmund Minshall ,  Timothy Cleary

IPC分类号： B24B49/00

CPC分类号： B24B37/345

摘要： Methods and apparatus are provided for the chemical mechanical planarization (CMP) of a surface of a work piece. In accordance with one embodiment of the invention the apparatus comprises a plurality of CMP systems, a plurality of load cups for loading unprocessed work pieces into and unloading processed work pieces from the plurality of CMP systems, a plurality of cleaning stations for cleaning processed work pieces unloaded from the CMP systems, and a single robot configured to transfer unprocessed work pieces to the plurality of load cups and to transfer processed work pieces from the load cups to the plurality of cleaning stations.

摘要翻译： 提供了用于工件表面的化学机械平坦化（CMP）的方法和装置。 根据本发明的一个实施例，该装置包括多个CMP系统，用于将未处理的工件装载到多个CMP系统中并从其卸载加工的工件的多个装载杯;多个用于清洁加工件的清洁站 从CMP系统卸载的单个机器人和被配置为将未处理的工件传送到多个装载杯并将加工的工件从加载杯传送到多个清洁站的单个机器人。

公开(公告)号：US06732116B2

公开(公告)日：2004-05-04

申请号：US09886194

申请日：2001-06-21

申请人： Dwip N. Banerjee ,  David Marquardt

发明人： Dwip N. Banerjee ,  David Marquardt

IPC分类号： G06F1730

CPC分类号： G06F9/5016 ,  Y10S707/99943

摘要： A method and system for providing and dynamically managing the size of a storage space containing data structures depending on a current network load. The present invention expands the size of a storage space when the amount of data therein is large, thereby reducing the time spent searching for values within the data structure. When the amount of data within the storage space is small, the present invention contracts the size of the storage space to reduce the memory needed to maintain the storage space. In this manner, the present invention dynamically adjusts the size of the storage space in response to changing network loads to ensure that network performance remains optimized.

摘要翻译： 一种用于根据当前网络负载提供并动态地管理包含数据结构的存储空间大小的方法和系统。 本发明在数据量大的情况下扩大了存储空间的大小，从而减少了在数据结构中搜索值的时间。 当存储空间内的数据量小时，本发明收缩存储空间的大小以减少维持存储空间所需的存储空间。 以这种方式，本发明响应于网络负载的变化动态调整存储空间的大小，以确保网络性能保持优化。

公开(公告)号：US20050227595A1

公开(公告)日：2005-10-13

申请号：US10821758

申请日：2004-04-09

申请人： David Marquardt ,  Joe Koeth ,  James Crawford ,  James Ekberg ,  Antoni Jakubiec ,  Michael Smigel ,  John Stumpf

发明人： David Marquardt ,  Joe Koeth ,  James Crawford ,  James Ekberg ,  Antoni Jakubiec ,  Michael Smigel ,  John Stumpf

IPC分类号： B23Q3/18 ,  B23Q7/04 ,  B24B5/00 ,  B24B37/04

CPC分类号： B24B37/345 ,  B23Q3/18 ,  B23Q7/04 ,  Y10S414/136 ,  Y10S414/141

摘要： In accordance with one embodiment of the invention, a load cup mechanism is provided for loading and unloading apparatus such as a CMP apparatus. The load cup mechanism, configured to load a work piece into and to unload a work piece from the apparatus, comprises a load cup arm configured to pivot about an axis between a load position aligned with the apparatus and an off-load position. A work piece platform is coupled to an end of the load cup arm and a plurality of lift fingers and a plurality of guide fingers, configured to support and center a work piece, are spaced about the work piece platform. A plurality of guide posts are spaced apart about the periphery of the work piece platform and are configured to align the work piece platform, in the load position, to the processing apparatus.

摘要翻译： 根据本发明的一个实施例，提供了用于装载和卸载诸如CMP装置的装置的装载杯机构。 负载杯机构构造成将工件装载到装置中并从工具卸载工件，包括负载杯臂，其配置成围绕与该装置对准的负载位置和卸载位置之间的轴线枢转。 工件平台联接到负载杯臂的端部，并且构造成支撑和居中工件的多个提升指和多个引导指在工件平台周围间隔开。 多个引导柱围绕工件平台的周边间隔开，并且被构造成使处于装载位置的工件平台对准处理装置。

公开(公告)号：US06796887B2

公开(公告)日：2004-09-28

申请号：US10293875

申请日：2002-11-13

申请人： David Marquardt

发明人： David Marquardt

IPC分类号： B24B100

CPC分类号： B24B37/32

摘要： A wear ring assembly is provided for use in a workpiece (e.g. a semiconductor wafer) polishing apparatus. The wear ring assembly comprises a wear element and a backing ring. The backing ring includes a fulcrum and is configured to transfer a component of pressure applied to the backing ring to the wear element via the fulcrum. In this manner, a substantially uniform vertical displacement of the wear ring is achieved.

摘要翻译： 提供了用于工件（例如半导体晶片）抛光装置的耐磨环组件。 磨损环组件包括磨损元件和背衬环。 背衬环包括支点并且构造成经由支点将施加到衬垫环的压力分量传递到磨损元件。 以这种方式，实现了磨损环的基本均匀的垂直位移。