-
公开(公告)号：US20130200411A1
公开(公告)日：2013-08-08
申请号：US13703075
申请日：2011-05-24
IPC分类号： H01L33/48
CPC分类号： H01L33/483 , H01L33/44 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/45139 , H01L2224/48227 , H01L2924/00011
摘要： An optoelectronic component includes a circuit board having a top side with a chip connection region, an optoelectronic semiconductor chip fixed to the chip connection region, a housing body fixed to the circuit board at the top side of the circuit board and having a reflector region, wherein the reflector region includes an opening in the housing body, the optoelectronic semiconductor chip being arranged in the opening, and the housing body is formed with a plastics material which is metallized at least in selected locations in the reflector region.
摘要翻译： 光电部件包括具有芯片连接区域的顶侧的电路板，固定到芯片连接区域的光电子半导体芯片，固定到电路板顶侧的电路板并具有反射器区域的壳体主体， 其中所述反射器区域包括在所述壳体中的开口，所述光电子半导体芯片布置在所述开口中，并且所述壳体主体形成有至少在所述反射器区域中的选定位置被金属化的塑料材料。
-
公开(公告)号：US08759862B2
公开(公告)日：2014-06-24
申请号：US13703075
申请日：2011-05-24
IPC分类号： H01L33/00
CPC分类号： H01L33/483 , H01L33/44 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/45139 , H01L2224/48227 , H01L2924/00011
摘要： An optoelectronic component includes a circuit board having a top side with a chip connection region, an optoelectronic semiconductor chip fixed to the chip connection region, a housing body fixed to the circuit board at the top side of the circuit board and having a reflector region, wherein the reflector region includes an opening in the housing body, the optoelectronic semiconductor chip being arranged in the opening, and the housing body is formed with a plastics material which is metallized at least in selected locations in the reflector region.
摘要翻译： 光电部件包括具有芯片连接区域的顶侧的电路板，固定到芯片连接区域的光电子半导体芯片，固定到电路板顶侧的电路板并具有反射器区域的壳体主体， 其中所述反射器区域包括在所述壳体中的开口，所述光电子半导体芯片布置在所述开口中，并且所述壳体主体形成有至少在所述反射器区域中的选定位置被金属化的塑料材料。
-
公开(公告)号：US20140191253A1
公开(公告)日：2014-07-10
申请号：US14118367
申请日：2011-05-19
申请人： Stephan Haslbeck , Markus Foerste , Michael Schwind , Martin Haushalter , Hubert Halbritter , Frank Möllmer
发明人： Stephan Haslbeck , Markus Foerste , Michael Schwind , Martin Haushalter , Hubert Halbritter , Frank Möllmer
IPC分类号： H01L25/16 , H01L31/0203 , H01L33/48
CPC分类号： H01L25/167 , H01L25/0753 , H01L31/0203 , H01L31/02162 , H01L31/0232 , H01L31/02325 , H01L31/167 , H01L33/483 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48227 , H01L2224/48091 , H01L2924/00014
摘要： An optoelectronic device includes an optoelectronic component that receives or generates radiation, a frame having a cavity, the optoelectronic component being arranged in said cavity, a connection carrier to which the optoelectronic component is fixed, and a cover covering the cavity and forming a radiation passage area for the radiation, wherein a beam path from the optoelectronic component to the radiation passage area is free of an encapsulation material for the optoelectronic component.
摘要翻译： 光电子器件包括接收或产生辐射的光电子部件，具有空腔的框架，所述光电子部件布置在所述空腔中，固定有光电子部件的连接载体以及覆盖空腔并形成辐射通道 用于辐射的区域，其中从光电子部件到辐射通道区域的光束路径没有用于光电子部件的封装材料。
-
公开(公告)号：US09281301B2
公开(公告)日：2016-03-08
申请号：US14118367
申请日：2011-05-19
申请人： Stephan Haslbeck , Markus Foerste , Michael Schwind , Martin Haushalter , Hubert Halbritter , Frank Möllmer
发明人： Stephan Haslbeck , Markus Foerste , Michael Schwind , Martin Haushalter , Hubert Halbritter , Frank Möllmer
IPC分类号： H01L33/48 , H01L25/16 , H01L31/0203 , H01L31/0216 , H01L31/0232 , H01L31/167 , H01L33/58 , H01L33/60 , H01L25/075 , H01L33/62
CPC分类号： H01L25/167 , H01L25/0753 , H01L31/0203 , H01L31/02162 , H01L31/0232 , H01L31/02325 , H01L31/167 , H01L33/483 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48227 , H01L2224/48091 , H01L2924/00014
摘要： An optoelectronic device includes an optoelectronic component that receives or generates radiation, a frame having a cavity, the optoelectronic component being arranged in said cavity, a connection carrier to which the optoelectronic component is fixed, and a cover covering the cavity and forming a radiation passage area for the radiation, wherein a beam path from the optoelectronic component to the radiation passage area is free of an encapsulation material for the optoelectronic component.
摘要翻译： 光电子器件包括接收或产生辐射的光电子部件，具有空腔的框架，所述光电子部件布置在所述空腔中，固定有光电子部件的连接载体以及覆盖空腔并形成辐射通道 用于辐射的区域，其中从光电子部件到辐射通道区域的光束路径没有用于光电子部件的封装材料。
-
-
-
搜索结果
4 条记录 (耗时 0.04 秒)
