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    OPTOELECTRONIC COMPONENT
    3.
    发明申请
    OPTOELECTRONIC COMPONENT 有权
    光电组件

    公开(公告)号：US20130200411A1

    公开(公告)日：2013-08-08

    申请号：US13703075

    申请日：2011-05-24

    申请人： David O'Brien ,  Martin Haushalter ,  Markus Foerste ,  Frank Möllmer

    发明人： David O'Brien ,  Martin Haushalter ,  Markus Foerste ,  Frank Möllmer

    IPC分类号： H01L33/48

    CPC分类号： H01L33/483 ,  H01L33/44 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2924/00011

    摘要： An optoelectronic component includes a circuit board having a top side with a chip connection region, an optoelectronic semiconductor chip fixed to the chip connection region, a housing body fixed to the circuit board at the top side of the circuit board and having a reflector region, wherein the reflector region includes an opening in the housing body, the optoelectronic semiconductor chip being arranged in the opening, and the housing body is formed with a plastics material which is metallized at least in selected locations in the reflector region.

    摘要翻译： 光电部件包括具有芯片连接区域的顶侧的电路板，固定到芯片连接区域的光电子半导体芯片，固定到电路板顶侧的电路板并具有反射器区域的壳体主体， 其中所述反射器区域包括在所述壳体中的开口，所述光电子半导体芯片布置在所述开口中，并且所述壳体主体形成有至少在所述反射器区域中的选定位置被金属化的塑料材料。

    Optoelectronic component
    4.
    发明授权
    Optoelectronic component 有权
    光电元件

    公开(公告)号：US08759862B2

    公开(公告)日：2014-06-24

    申请号：US13703075

    申请日：2011-05-24

    申请人： David O'Brien ,  Martin Haushalter ,  Markus Foerste ,  Frank Möllmer

    发明人： David O'Brien ,  Martin Haushalter ,  Markus Foerste ,  Frank Möllmer

    IPC分类号： H01L33/00

    CPC分类号： H01L33/483 ,  H01L33/44 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2924/00011

    摘要： An optoelectronic component includes a circuit board having a top side with a chip connection region, an optoelectronic semiconductor chip fixed to the chip connection region, a housing body fixed to the circuit board at the top side of the circuit board and having a reflector region, wherein the reflector region includes an opening in the housing body, the optoelectronic semiconductor chip being arranged in the opening, and the housing body is formed with a plastics material which is metallized at least in selected locations in the reflector region.

    摘要翻译： 光电部件包括具有芯片连接区域的顶侧的电路板，固定到芯片连接区域的光电子半导体芯片，固定到电路板顶侧的电路板并具有反射器区域的壳体主体， 其中所述反射器区域包括在所述壳体中的开口，所述光电子半导体芯片布置在所述开口中，并且所述壳体主体形成有至少在所述反射器区域中的选定位置被金属化的塑料材料。

    Optical encoder for detecting rotary and linear movements
    8.
    发明授权
    Optical encoder for detecting rotary and linear movements 有权
    用于检测旋转和线性运动的光学编码器

    公开(公告)号：US06313460B1

    公开(公告)日：2001-11-06

    申请号：US09401021

    申请日：1999-09-21

    申请人： Heinz Haas ,  Martin Haushalter ,  Frank Möllmer

    发明人： Heinz Haas ,  Martin Haushalter ,  Frank Möllmer

    IPC分类号： G01D534

    CPC分类号： G01D5/34715 ,  G01D5/36

    摘要： An optical device for quantitative detection of linear or rotary movements, in which light beams from two light emitters pass through a grid disk which images the movement and has translucent areas and opaque areas. A single photo receiver is also provided in which the transmitted light strikes the photo receiver. The light emitters are actuated in a pulsed mode. The pulses are separated from one another in an evaluation circuit that is coupled to the photo receiver.

    摘要翻译： 用于定量检测线性或旋转运动的光学装置，其中来自两个发光体的光束通过对运动进行成像并具有半透明区域和不透明区域的格栅盘。 还提供单个照片接收器，其中透射的光照射到光接收器。 光发射器以脉冲模式被致动。 在耦合到光接收器的评估电路中，脉冲彼此分离。

    Method for Producing a Plurality of Optoelectronic Semiconductor Components in Combination, Semiconductor Component Produced in Such a Way, and Use of Said Semiconductor Component
    10.
    发明申请
    Method for Producing a Plurality of Optoelectronic Semiconductor Components in Combination, Semiconductor Component Produced in Such a Way, and Use of Said Semiconductor Component 有权
    组合生产多种光电子半导体元件的方法，以这种方式制造的半导体元件以及所述半导体元件的应用

    公开(公告)号：US20140175462A1

    公开(公告)日：2014-06-26

    申请号：US14127441

    申请日：2012-06-21

    申请人： Markus Lermer ,  Martin Haushalter

    发明人： Markus Lermer ,  Martin Haushalter

    IPC分类号： H01L31/173 ,  H01L31/0203

    CPC分类号： H01L31/173 ,  G01S7/4813 ,  H01L25/167 ,  H01L31/0203 ,  H01L31/167 ,  H01L33/486 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method for producing a plurality of optoelectronic semiconductor components in combination is specified. A plurality of radiation-emitting and radiation-detecting semiconductor chips are applied on a carrier substrate. The semiconductor chips are potted with a respective potting compound. The potting compounds are subsequently severed by sawing between adjacent semiconductor chips. A common frame is subsequently applied to the carrier substrate The common frame has a plurality of chambers open toward the top. The frame is arranged in such a way that a respective semiconductor chip is arranged in a respective chamber of the frame. A semiconductor component produced in such a way and the use of the semiconductor component are furthermore specified.

    摘要翻译： 规定组合多个光电子半导体部件的制造方法。 多个辐射发射和辐射检测半导体芯片被施加在载体衬底上。 半导体芯片用相应的封装化合物封装。 灌封化合物随后通过在相邻的半导体芯片之间锯切而被切断。 随后将一个共同的框架应用于载体基板。公共框架具有朝向顶部开口的多个室。 框架被布置成使得相应的半导体芯片布置在框架的相应室中。 进一步规定以这种方式制造的半导体部件和半导体部件的使用。