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公开(公告)号:US20110186345A1
公开(公告)日:2011-08-04
申请号:US12794563
申请日:2010-06-04
申请人: David Pakula , Richard Hung Minh Dinh , Scott Myers , Tan Yew Tan
发明人: David Pakula , Richard Hung Minh Dinh , Scott Myers , Tan Yew Tan
CPC分类号: H05K7/14 , B29L2031/3481 , G02B7/02 , G02B13/001 , G06F1/1626 , G06F1/1637 , G06F1/1656 , G06F1/1658 , H04M1/0202 , H04M1/0266 , H04N5/2252 , H04N5/2254 , H05K5/0086 , H05K5/03 , Y10T29/49002 , Y10T156/10
摘要: Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.
摘要翻译: 公开了用于电子设备的外壳。 根据一个方面,电子设备外壳的邻接表面可以安装或布置成使得邻接的表面以高精度齐平。 电子设备可以是便携式的,并且在某些情况下是手持的。
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公开(公告)号:US09185816B2
公开(公告)日:2015-11-10
申请号:US13541617
申请日:2012-07-03
CPC分类号: H05K7/14 , B29L2031/3481 , G02B7/02 , G02B13/001 , G06F1/1626 , G06F1/1637 , G06F1/1656 , G06F1/1658 , H04M1/0202 , H04M1/0266 , H04N5/2252 , H04N5/2254 , H05K5/0086 , H05K5/03 , Y10T29/49002 , Y10T156/10
摘要: Improved housings for electronic devices are disclosed. In one embodiment, an electronic device housing can have one or more outer members (e.g., exposed major surfaces), such as front or back surfaces, that are formed of glass. The one or more glass surfaces can be part of outer member assemblies that can be secured to other portions of the electronic device housing. In other embodiments, apparatus, systems and methods for robustly attaching a cover portion of an electronic device to a bottom portion, e.g., a housing portion, of the electronic device are described. The electronic device can be portable and in some cases handheld.
摘要翻译: 公开了改进的电子设备外壳。 在一个实施例中,电子设备外壳可以具有由玻璃形成的一个或多个外部构件(例如,暴露的主表面),例如前表面或后表面。 一个或多个玻璃表面可以是可以固定到电子设备外壳的其它部分的外部构件组件的一部分。 在其他实施例中,描述了用于将电子设备的盖部分牢固地附接到电子设备的底部(例如,壳体部分)的装置,系统和方法。 电子设备可以是便携式的,并且在某些情况下是手持的。
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公开(公告)号:US08551283B2
公开(公告)日:2013-10-08
申请号:US12794563
申请日:2010-06-04
CPC分类号: H05K7/14 , B29L2031/3481 , G02B7/02 , G02B13/001 , G06F1/1626 , G06F1/1637 , G06F1/1656 , G06F1/1658 , H04M1/0202 , H04M1/0266 , H04N5/2252 , H04N5/2254 , H05K5/0086 , H05K5/03 , Y10T29/49002 , Y10T156/10
摘要: Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.
摘要翻译: 公开了用于电子设备的外壳。 根据一个方面,电子设备外壳的邻接表面可以安装或布置成使得邻接的表面以高精度齐平。 电子设备可以是便携式的,并且在某些情况下是手持的。
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公开(公告)号:US20110188180A1
公开(公告)日:2011-08-04
申请号:US12794646
申请日:2010-06-04
CPC分类号: H05K7/14 , B29L2031/3481 , G02B7/02 , G02B13/001 , G06F1/1626 , G06F1/1637 , G06F1/1656 , G06F1/1658 , H04M1/0202 , H04M1/0266 , H04N5/2252 , H04N5/2254 , H05K5/0086 , H05K5/03 , Y10T29/49002 , Y10T156/10
摘要: Improved housings for electronic devices are disclosed. In one embodiment, an electronic device housing can have one or more outer members (e.g., exposed major surfaces), such as front or back surfaces, that are formed of glass. The one or more glass surfaces can be part of outer member assemblies that can be secured to other portions of the electronic device housing. In other embodiments, apparatus, systems and methods for robustly attaching a cover portion of an electronic device to a bottom portion, e.g., a housing portion, of the electronic device are described. The electronic device can be portable and in some cases handheld.
摘要翻译: 公开了改进的电子设备外壳。 在一个实施例中,电子设备外壳可以具有由玻璃形成的一个或多个外部构件(例如,暴露的主表面),例如前表面或后表面。 一个或多个玻璃表面可以是可以固定到电子设备外壳的其它部分的外部构件组件的一部分。 在其他实施例中,描述了用于将电子设备的盖部分牢固地附接到电子设备的底部(例如,壳体部分)的装置,系统和方法。 电子设备可以是便携式的,并且在某些情况下是手持的。
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公开(公告)号:US08797721B2
公开(公告)日:2014-08-05
申请号:US12794646
申请日:2010-06-04
CPC分类号: H05K7/14 , B29L2031/3481 , G02B7/02 , G02B13/001 , G06F1/1626 , G06F1/1637 , G06F1/1656 , G06F1/1658 , H04M1/0202 , H04M1/0266 , H04N5/2252 , H04N5/2254 , H05K5/0086 , H05K5/03 , Y10T29/49002 , Y10T156/10
摘要: Improved housings for electronic devices are disclosed. In one embodiment, an electronic device housing can have one or more outer members (e.g., exposed major surfaces), such as front or back surfaces, that are formed of glass. The one or more glass surfaces can be part of outer member assemblies that can be secured to other portions of the electronic device housing. In other embodiments, apparatus, systems and methods for robustly attaching a cover portion of an electronic device to a bottom portion, e.g., a housing portion, of the electronic device are described. The electronic device can be portable and in some cases handheld.
摘要翻译: 公开了改进的电子设备外壳。 在一个实施例中,电子设备外壳可以具有由玻璃形成的一个或多个外部构件(例如,暴露的主表面),例如前表面或后表面。 一个或多个玻璃表面可以是可以固定到电子设备外壳的其它部分的外部构件组件的一部分。 在其他实施例中,描述了用于将电子设备的盖部分牢固地附接到电子设备的底部(例如,壳体部分)的装置,系统和方法。 电子设备可以是便携式的,并且在某些情况下是手持的。
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公开(公告)号:US20120275100A1
公开(公告)日:2012-11-01
申请号:US13541617
申请日:2012-07-03
IPC分类号: H05K7/00
CPC分类号: H05K7/14 , B29L2031/3481 , G02B7/02 , G02B13/001 , G06F1/1626 , G06F1/1637 , G06F1/1656 , G06F1/1658 , H04M1/0202 , H04M1/0266 , H04N5/2252 , H04N5/2254 , H05K5/0086 , H05K5/03 , Y10T29/49002 , Y10T156/10
摘要: Improved housings for electronic devices are disclosed. In one embodiment, an electronic device housing can have one or more outer members (e.g., exposed major surfaces), such as front or back surfaces, that are formed of glass. The one or more glass surfaces can be part of outer member assemblies that can be secured to other portions of the electronic device housing. In other embodiments, apparatus, systems and methods for robustly attaching a cover portion of an electronic device to a bottom portion, e.g., a housing portion, of the electronic device are described. The electronic device can be portable and in some cases handheld.
摘要翻译: 公开了改进的电子设备外壳。 在一个实施例中,电子设备外壳可以具有由玻璃形成的一个或多个外部构件(例如,暴露的主表面),例如前表面或后表面。 一个或多个玻璃表面可以是可以固定到电子设备外壳的其它部分的外部构件组件的一部分。 在其他实施例中,描述了用于将电子设备的盖部分牢固地附接到电子设备的底部(例如,壳体部分)的装置,系统和方法。 电子设备可以是便携式的,并且在某些情况下是手持的。
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公开(公告)号:US08610822B2
公开(公告)日:2013-12-17
申请号:US12794664
申请日:2010-06-04
申请人: Trent Weber , Scott Myers , David A. Pakula , Matthew Hill , Erik L. Wang , Richard Hung Minh Dinh
发明人: Trent Weber , Scott Myers , David A. Pakula , Matthew Hill , Erik L. Wang , Richard Hung Minh Dinh
IPC分类号: H04N5/225
CPC分类号: G03B17/02 , B23K26/351 , H04N5/2251
摘要: An electronic device may be provided with a housing. A camera module may be mounted within the housing. The housing may have a camera window with which a lens in the camera module is aligned. To rotationally and laterally align the camera module with respect to the camera window and the electronic device housing, an alignment structure may be mounted to the housing in alignment with the camera window and housing. The alignment structure may be formed form a ring-shaped structure with an opening. The alignment structures may have sidewalls that form an alignment groove for the camera module. The camera window may be formed from a circular opening in a layer of opaque material deposited on a transparent housing member such as a planar layer of glass. During the process, a laser tool may be used to trim the opening in the opaque material.
摘要翻译: 电子设备可以设置有壳体。 相机模块可以安装在壳体内。 外壳可以具有相机窗口,照相机模块中的透镜与其对准。 为了相对于照相机窗口和电子设备外壳旋转和横向对准照相机模块,对准结构可以安装到壳体上,与摄像机窗口和外壳对准。 对准结构可以形成为具有开口的环形结构。 对准结构可以具有形成相机模块的对准凹槽的侧壁。 相机窗口可以由沉积在诸如平面玻璃层的透明外壳构件上的不透明材料层中的圆形开口形成。 在该过程中,可以使用激光工具来修整不透明材料中的开口。
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公开(公告)号:US20110255000A1
公开(公告)日:2011-10-20
申请号:US12794664
申请日:2010-06-04
申请人: Trent Weber , Scott Myers , David A. Pakula , Matthew Hill , Erik L. Wang , Richard Hung Minh Dinh
发明人: Trent Weber , Scott Myers , David A. Pakula , Matthew Hill , Erik L. Wang , Richard Hung Minh Dinh
CPC分类号: G03B17/02 , B23K26/351 , H04N5/2251
摘要: An electronic device may be provided with a housing. A camera module may be mounted within the housing. The housing may have a camera window with which a lens in the camera module is aligned. To rotationally and laterally align the camera module with respect to the camera window and the electronic device housing, an alignment structure may be mounted to the housing in alignment with the camera window and housing. The alignment structure may be formed form a ring-shaped structure with an opening. The alignment structures may have sidewalls that form an alignment groove for the camera module. The camera window may be formed from a circular opening in a layer of opaque material deposited on a transparent housing member such as a planar layer of glass. During the process, a laser tool may be used to trim the opening in the opaque material.
摘要翻译: 电子设备可以设置有壳体。 相机模块可以安装在壳体内。 外壳可以具有相机窗口,照相机模块中的透镜与其对准。 为了相对于照相机窗口和电子设备外壳旋转和横向对准照相机模块,对准结构可以安装到壳体上,与摄像机窗口和外壳对准。 对准结构可以形成为具有开口的环形结构。 对准结构可以具有形成相机模块的对准凹槽的侧壁。 相机窗口可以由沉积在诸如平面玻璃层的透明外壳构件上的不透明材料层中的圆形开口形成。 在该过程中,可以使用激光工具来修整不透明材料中的开口。
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公开(公告)号:US20110255850A1
公开(公告)日:2011-10-20
申请号:US12794601
申请日:2010-06-04
申请人: Richard Hung Minh Dinh , Tang Yew Tan , Jason Sloey , Shayan Malek , Scott Myers , Dennis R. Pyper , Douglas P. Kidd , Ronald W. Dimpflmaier , Andrew B. Just , Trent Weber , Daniel W. Jarvis
发明人: Richard Hung Minh Dinh , Tang Yew Tan , Jason Sloey , Shayan Malek , Scott Myers , Dennis R. Pyper , Douglas P. Kidd , Ronald W. Dimpflmaier , Andrew B. Just , Trent Weber , Daniel W. Jarvis
IPC分类号: G03B15/03 , H01R13/648 , H05K9/00 , H01R13/516
CPC分类号: H05K9/0024 , B32B17/061 , B41F17/00 , G03B15/03 , G06F1/1626 , G06F1/1656 , H01L23/24 , H01L23/296 , H01L23/3737 , H01L23/552 , H01L23/66 , H01L2223/6644 , H01M2/026 , H01M2/0292 , H01M2220/30 , H03F3/195 , H03F3/213 , H03F2200/451 , H04M1/0277 , H05K1/0203 , H05K1/0215 , H05K1/181 , H05K1/189 , H05K3/341 , H05K3/3447 , H05K3/363 , H05K2201/0116 , H05K2201/0162 , H05K2201/056 , H05K2201/10106 , H05K2201/10121 , H05K2201/10371 , H05K2201/10409 , H05K2201/2009 , H05K2203/1316 , Y02P70/613 , Y10T29/4911
摘要: Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Heat sinks and other thermally conductive structures may be used to remove excess component heat. Structures may also be provided in an electronic device to detect moisture. Integrated circuits and other circuitry may be mounted on a printed circuit board under a radio-frequency shielding can.
摘要翻译: 可以提供包括机械和电子部件的电子设备。 连接器可用于连接安装到印刷电路的印刷电路和器件。 印刷电路可以包括刚性印刷电路板和柔性印刷电路板。 散热片和其他导热结构可用于去除多余的部件热量。 也可以在电子设备中提供结构以检测湿气。 集成电路和其他电路可以安装在射频屏蔽罐下的印刷电路板上。
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公开(公告)号:US20110255250A1
公开(公告)日:2011-10-20
申请号:US12794599
申请日:2010-06-04
申请人: Richard Hung Minh Dinh , Tang Yew Tan , Nicholaus Ian Lubinski , Jason Sloey , Shayan Malek , Scott Myers , Wyeman Chen , Dennis R. Pyper , Douglas P. Kidd , Joshua G. Wurzel , David A. Pakula
发明人: Richard Hung Minh Dinh , Tang Yew Tan , Nicholaus Ian Lubinski , Jason Sloey , Shayan Malek , Scott Myers , Wyeman Chen , Dennis R. Pyper , Douglas P. Kidd , Joshua G. Wurzel , David A. Pakula
CPC分类号: H05K9/0024 , B32B17/061 , B41F17/00 , G03B15/03 , G06F1/1626 , G06F1/1656 , H01L23/24 , H01L23/296 , H01L23/3737 , H01L23/552 , H01L23/66 , H01L2223/6644 , H01M2/026 , H01M2/0292 , H01M2220/30 , H03F3/195 , H03F3/213 , H03F2200/451 , H04M1/0277 , H05K1/0203 , H05K1/0215 , H05K1/181 , H05K1/189 , H05K3/341 , H05K3/3447 , H05K3/363 , H05K2201/0116 , H05K2201/0162 , H05K2201/056 , H05K2201/10106 , H05K2201/10121 , H05K2201/10371 , H05K2201/10409 , H05K2201/2009 , H05K2203/1316 , Y02P70/613 , Y10T29/4911
摘要: Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Cosmetic structures such as cowlings may be used to improve device aesthetics. Bumpers may be mounted over rough edges of printed circuit boards to protect flex circuits that are routed over the printed circuit boards. Fasteners may be soldered to solder pad structures on printed circuit boards.
摘要翻译: 可以提供包括机械和电子部件的电子设备。 连接器可用于连接安装到印刷电路的印刷电路和器件。 印刷电路可以包括刚性印刷电路板和柔性印刷电路板。 可以使用诸如整流罩的化妆结构来改善设备的美观性。 缓冲器可以安装在印刷电路板的粗糙边缘上,以保护布线在印刷电路板上的柔性电路。 紧固件可以焊接到印刷电路板上的焊盘结构上。
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