摘要:
An SOI-based optical interconnection arrangement is provided that significantly reduces the size, complexity and power consumption requires of conventional high density electrical interconnections. In particular, a group of optical modulators and wavelength division multiplexers/demultiplexers are used in association with traditional electrical signal paths to “concentrate” a large number of the electrical-pinouts onto one optical waveguide (e.g., fiber). By utilizing a number of such SOI-based signal concentration structures, an optical backplane can be formed that couples all of these concentration structures through one optical substrate and then onto a separate number of output/receiving boards. Additionally, optical gain material may be embedded within the backplane element to further enhance the optical signal quality. The ability to integrate the electrical and optical components within a monolithic SOI-based structure provides for the significant reduction in the overall size of the connection arrangement and, further, reduces the power consumption by about an order of magnitude.
摘要:
An electronic dispersion compensation (EDC) arrangement for a multi-channel optical receive utilizes a time division technique to “share” a common adaptive algorithm block between a plurality of N separate channels. The algorithm block embodies a specific algorithm associated with correcting/updating tap weights for the delay lines forming the equalizing elements, and a time slot assignment element is used in conjunction with the algorithm block to control the access of the various channels to the algorithm block. In situations where certain channels experience a greater degree of dispersion than others, the time slot assignment element may be configured to allot a greater number of time slots to the affected channels.
摘要:
A configuration for routing electrical signals between a conventional electronic integrated circuit (IC) and an opto-electronic subassembly is formed as an array of signal paths carrying oppositely-signed signals on adjacent paths to lower the inductance associated with the connection between the IC and the opto-electronic subassembly. The array of signal paths can take the form of an array of wirebonds between the IC and the subassembly, an array of conductive traces formed on the opto-electronic subassembly, or both.
摘要:
A configuration for routing electrical signals between a conventional electronic integrated circuit (IC) and an opto-electronic subassembly is formed as an array of signal paths carrying oppositely-signed signals on adjacent paths to lower the inductance associated with the connection between the IC and the opto-electronic subassembly. The array of signal paths can take the form of an array of wirebonds between the IC and the subassembly, an array of conductive traces formed on the opto-electronic subassembly, or both.
摘要:
An electronic dispersion compensation (EDC) arrangement for a multi-channel optical receive utilizes a time division technique to “share” a common adaptive algorithm block between a plurality of N separate channels. The algorithm block embodies a specific algorithm associated with correcting/updating tap weights for the delay lines forming the equalizing elements, and a time slot assignment element is used in conjunction with the algorithm block to control the access of the various channels to the algorithm block. In situations where certain channels experience a greater degree of dispersion than others, the time slot assignment element may be configured to allot a greater number of time slots to the affected channels.
摘要:
Computer-aided design (CAD) tools are used to perform the integrated design, verification and layout of electrical and optical components in a monolithic, silicon-based electro-optic chip. Separate top-level behavioral logic designs are prepared for the three different types of elements included within the final, silicon-based monolithic structure: (1) digital electronic integrated circuit elements; (2) analog/mixed signal electronic integrated circuit elements; and (3) opto-electronic elements (including passive and active optical elements). Once the behavioral logic design is completed, the results are combined and co-simulated. A physical layout design is developed and verified for each different type of element in the circuit. The separate physical layouts are then co-verified, to assess the properties of the overall physical design. The results of the co-simulation are compared to the results of the co-verification, with alterations made in the logic design and/or the physical layout until the desired operating parameters are obtained. Once the desired results are generated, conventional wafer-level fabrication operations are then considered to provide a final product (“tape out”).
摘要:
An optical modulator is configured to include multiple modulating sections formed along each arm and create a unary-encoded optical output signal by driving the number of sections required to represent the data value being transmitted (e.g., three sections driven to represent the data value “3”, four sections driven to represent the data value “4”). An auxiliary modulating section, isolated from the optical signal path, is included for creating a path for current flow in situations where only an odd number of modulating sections are required to represent the data. The activation of the auxiliary modulation section minimizes the current imbalance that would otherwise be present along a common node of the arrangement.
摘要:
An optical modulator is configured to include multiple modulating sections formed along each arm and create a unary-encoded optical output signal by driving the number of sections required to represent the data value being transmitted (e.g., three sections driven to represent the data value “3”, four sections driven to represent the data value “4”). An auxiliary modulating section, isolated from the optical signal path, is included for creating a path for current flow in situations where only an odd number of modulating sections are required to represent the data. The activation of the auxiliary modulation section minimizes the current imbalance that would otherwise be present along a common node of the arrangement.
摘要:
An optical modulator is formed to include a plurality of separate electrodes disposed along one arm, the electrodes having different lengths and driven with different signals to provide for multi-level signaling (e.g., PAM-4 signaling). By using separate drivers to energize the different sections, the number of sections energized at a given point in time will define the net phase shift introduced to the optical signal. The total length of the combined modulator sections is associated with a π phase shift (180°). Each section is driven by either a digital “one” or “zero”, so as to create the multi-level modulation. An essentially equal change in power between adjacent transmitted symbols is accomplished by properly adjusting the lengths of each individual section.
摘要:
An apparatus for providing single mode optical signal coupling between an opto-electronic transceiver and a single mode optical fiber array takes the form of a lens array and a ferrule component. The lens array includes a plurality of separate lens element disposed to intercept a like plurality of single mode optical output signal from the opto-electronic transceiver and provide as an output a focused version thereof. The ferrule component includes a plurality of single mode fiber stubs that are passively aligned with the lens array and support the transmission of the focused, single mode optical output signals towards the associated single mode optical fiber array.