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16 条记录 (耗时 0.023 秒)

    Heat exchanger
    1.
    发明授权
    Heat exchanger 有权
    热交换器

    公开(公告)号：US07032651B2

    公开(公告)日：2006-04-25

    申请号：US10601385

    申请日：2003-06-23

    申请人： David T. Winslow ,  Michael Runyan ,  Scott T. Johnson

    发明人： David T. Winslow ,  Michael Runyan ,  Scott T. Johnson

    IPC分类号： F28F7/02

    CPC分类号： H05K7/20254 ,  F28F3/086 ,  F28F3/12

    摘要： A heat exchanger apparatus including a two-dimensional array of heat exchanging conduits, wherein each conduit includes an inlet and an outlet, and a manifold for providing heat exchanging fluid to the inputs of the heat exchanging conduits and for receiving heat exchanging fluid from the outputs of the heat exchanging conduits.

    摘要翻译： 一种热交换器装置，其包括二维阵列的热交换导管，其中每个导管包括入口和出口，以及用于向热交换导管的输入端提供热交换流体并用于从输出端接收热交换流体的歧管 的热交换管道。

    Cold plate assembly
    2.
    发明授权
    Cold plate assembly 有权
    冷板组装

    公开(公告)号：US07201217B2

    公开(公告)日：2007-04-10

    申请号：US11135683

    申请日：2005-05-24

    申请人： Scott T. Johnson ,  David T. Winslow

    发明人： Scott T. Johnson ,  David T. Winslow

    IPC分类号： F28F3/12

    CPC分类号： H05K7/20254

    摘要： A cold plate assembly, which in one embodiment includes a manifold layer comprising one or more input coolant sub-manifold channels and one or more output coolant sub-manifold channels. A metering plate having a plurality of orifices defined there through is disposed adjacent the manifold layer in spaced relation to a cover plate. A core layer is disposed between the metering plate and cover plate, the core layer comprising corrugated fin material. The input sub-manifold channels and output sub-manifold channels are in fluid communication through fluid paths passing through the orifices in the metering plate and the core layer.

    摘要翻译： 冷板组件，其在一个实施例中包括包括一个或多个输入冷却剂子歧管通道和一个或多个输出冷却剂子歧管通道的歧管层。 具有限定在其中的多个孔的计量盘以与盖板间隔开的关系设置在歧管层附近。 核心层设置在计量板和盖板之间，芯层包括波纹状翅片材料。 输入子歧管通道和输出子歧管通道通过穿过计量板和芯层中的孔的流体路径流体连通。

    Lightweight antenna attachment structure
    4.
    发明授权
    Lightweight antenna attachment structure 有权
    轻便天线附件结构

    公开(公告)号：US08274446B2

    公开(公告)日：2012-09-25

    申请号：US12793448

    申请日：2010-06-03

    申请人： Kyle W. Maxhimer ,  David T. Winslow ,  Larry L. Lai ,  Derek Pruden

    发明人： Kyle W. Maxhimer ,  David T. Winslow ,  Larry L. Lai ,  Derek Pruden

    IPC分类号： H01Q1/12 ,  H01Q21/00

    CPC分类号： H01Q1/1292 ,  Y10T156/10

    摘要： The present invention relates to lightweight antenna arrays and more particularly to an attachment mechanism for attaching a lightweight antenna array to a structure. In one embodiment, an antenna structure includes a platform having a first coefficient of thermal expansion; an antenna panel having a second coefficient of thermal expansion different from the first coefficient, and having first and second opposite ends; and a support structure mounting the panel to the platform. The support structure includes a first spacer element with a first height at the first end of the panel, and a second spacer element with a second height less than the first height between the first and second ends of the panel; a first adhesive layer adhering each spacer element to the platform; and a second adhesive layer adhering each spacer element to the antenna panel. A yield strength of the adhesive layers is less than a yield strength of the spacer elements.

    摘要翻译： 本发明涉及轻质天线阵列，更具体地说，涉及一种用于将轻型天线阵列附接到结构的附接机构。 在一个实施例中，天线结构包括具有第一热膨胀系数的平台; 天线面板，其具有与所述第一系数不同的第二热膨胀系数，并且具有第一和第二相对端; 以及将面板安装到平台的支撑结构。 支撑结构包括在面板的第一端处具有第一高度的第一间隔元件和具有小于面板的第一和第二端之间的第一高度的第二高度的第二间隔元件; 将每个间隔元件粘附到平台上的第一粘合剂层; 以及将每个间隔元件粘附到天线面板上的第二粘合剂层。 粘合剂层的屈服强度小于间隔元件的屈服强度。

    Fiber optic package
    6.
    发明授权
    Fiber optic package 失效
    光纤封装

    公开(公告)号：US5233677A

    公开(公告)日：1993-08-03

    申请号：US842821

    申请日：1992-02-27

    申请人： David T. Winslow

    发明人： David T. Winslow

    IPC分类号： G02B6/38 ,  G02B6/43

    CPC分类号： G02B6/3829 ,  G02B6/3869 ,  G02B6/3897 ,  G02B6/43 ,  G02B6/3887

    摘要： A fiber optic package in which a plurality of fiber optic cables are encapsulated in a layer of flexible material which in turn is bonded to the surface of a low mass, low profile, apertured stiffener member. A portion of the encapsulating material extends beyond the edge of the stiffener and is configured into a plurality of tongues that encapsulate individual ones of the fiber optic cables. The stiffener member is fastened to an apertured backplane. Fittings on the ends of the fiber optic cables extend through the clearance apertures in the stiffener member and the backplane to feed the fiber optic cable to the front face of the backplane for coupling to an associated optical component.

    摘要翻译： 一种光纤封装，其中多个光纤电缆被封装在柔性材料层中，该柔性材料层又结合到低质量，低轮廓，有孔的加强构件的表面。 封装材料的一部分延伸超过加强件的边缘，并且被配置成多个舌片，其封装单个光纤电缆。 加强件被固定到有孔背板上。 光纤电缆端部的配件延伸穿过加强件和背板中的间隙孔，以将光纤电缆馈送到背板的前表面，以耦合到相关的光学部件。

    Blind mate non-crimp pin RF connector
    9.
    发明授权
    Blind mate non-crimp pin RF connector 有权
    盲配非压接针RF连接器

    公开(公告)号：US6166615A

    公开(公告)日：2000-12-26

    申请号：US154000

    申请日：1998-09-16

    申请人： David T. Winslow ,  Clifton Quan ,  Hernan E. Romero ,  Claudio S. Howard ,  Edward L. Robertson

    发明人： David T. Winslow ,  Clifton Quan ,  Hernan E. Romero ,  Claudio S. Howard ,  Edward L. Robertson

    IPC分类号： H01P1/04

    CPC分类号： H01P1/04

    摘要： An RF connector includes male and female connector components. The male component has a multi-diameter dielectric housing cylinder with a metal center conductor extending through an opening in the housing. The center pin extends from each end of the dielectric housing. The center pin and the dielectric housing are sized appropriately to provide a matched impedance at microwave frequencies for the use environment to which the male component is connected. The female connector component includes a dielectric body having a center cavity formed therein. A compressible wire bundle forming a compressible conductor member is recessed into the cavity. The compressible conductor protrudes from the far end of the female cavity allowing contact to a mating circuitry. The male connector component is assembled with the female component, the male center pin being brought into electrical contact with the compressible conductor member. The female connector component is not mechanically mounted to the next level of interconnect, but instead the protruding compressible conductor is brought into compressive electrical contact with a mating circuitry on the next interconnect level.

    摘要翻译： RF连接器包括阳连接器和阴连接器部件。 阳部件具有多直径电介质容纳圆柱体，金属中心导体延伸穿过壳体中的开口。 中心销从电介质外壳的每一端延伸。 中心销和电介质外壳的尺寸适当，以在阳性部件连接到的使用环境中在微波频率处提供匹配的阻抗。 阴连接器部件包括其中形成有中心腔的电介质体。 形成可压缩导体部件的可压缩线束被凹入到空腔中。 可压缩导体从母腔的远端突出，允许与配合电路接触。 阳连接器部件与阴部件组装，阳中心销与可压缩导体部件电接触。 母连接器部件不是机械地安装到下一级互连，而是突出的可压缩导体与下一个互连级别上的匹配电路压缩电接触。

    Large non-hermetic multichip module package
    10.
    发明授权
    Large non-hermetic multichip module package 失效
    大型非密封多芯片模块封装

    公开(公告)号：US6018463A

    公开(公告)日：2000-01-25

    申请号：US918535

    申请日：1997-08-22

    申请人： David T. Winslow ,  Manny Tansavatdi

    发明人： David T. Winslow ,  Manny Tansavatdi

    IPC分类号： H01L23/04 ,  H05K1/11 ,  H05K1/14 ,  H01L23/538

    CPC分类号： H01L23/04 ,  H05K1/142 ,  H01L2224/05644 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19107 ,  H05K1/117

    摘要： A large non-hermetic packaging approach that produces a large multichip module or SuperMCM package. The present invention integrates a plurality of multichip module technologies including removable and/or standard high density multilayer interconnect (HDMI) decal substrates, and a reworkable chip on board coating, housed in a mechanically sound, thermally conductive non-hermetic multichip package. A metal substrate has an HDMI substrate and one or more edge printed wiring boards bonded thereto which are interconnected using wire bonds. The HDMI substrate has one or more electronic chips bonded thereto that are connected thereto using wire bonds or other attachment scheme. Components on the one or more edge printed wiring boards are connected to the using edge printed wiring boards wire bonds. The edge printed wiring boards have external attachment pads exposed at their outside edges. A removable cover is disposed over the package except for the external attachment pads at the edges of the package.

    摘要翻译： 一种大型非密封封装方法，可生产大型多芯片模块或SuperMCM封装。 本发明集成了多个多芯片模块技术，包括可拆卸和/或标准的高密度多层互连（HDMI）贴花基板，以及可机加工的片上涂层，容纳在机械声传导的非密封多芯片封装中。 金属基板具有HDMI基板和与其接合的一个或多个边缘印刷线路板，其使用引线接合互连。 HDMI基板具有连接到其上的一个或多个电子芯片，其使用引线键或其他附接方案与其连接。 一个或多个边缘印刷线路板上的部件连接到使用边缘印刷线路板引线接合。 边缘印刷线路板在其外部边缘处露出外部附接垫。 除了包装边缘处的外部附接垫之外，可拆卸的盖布置在包装之上。