Abstract:
A CMOS semiconductor device is formed having an N-channel transistor comprising a graded junction with reduced junction capacitance. The graded junction is achieved by forming a second sidewall spacer on the gate electrode, after source/drain implantations, and ion-implanting an N-type impurity with high diffusivity, e.g., P into an A.sub.5 implant, followed by activation annealing.
Abstract:
Semiconductor devices with improved transistor performance are fabricated by forming a composite oxide/nitride liner under a gate electrode sidewall spacer. Embodiments include depositing a conformal oxide layer by decoupled plasma deposition, depositing a conformal nitride layer by decoupled plasma deposition, depositing a spacer layer and then etching.
Abstract:
A method is provided, the method including forming a gate dielectric layer above a substrate layer, forming a gate conductor layer above the gate dielectric layer, forming a first hard mask layer above the gate conductor layer, and forming a second hard mask layer above the first hard mask layer. The method also includes forming a trimmed photoresist mask above the second hard mask layer, and forming a patterned hard mask in the second hard mask layer using the trimmed photoresist mask to remove portions of the second hard mask layer, the patterned hard mask having a first dimension. The method further includes forming a selectively etched hard mask in the first hard mask layer by removing portions of the first hard mask layer adjacent the patterned hard mask, the selectively etched hard mask having a second dimension less than the first dimension, and forming a gate structure using the selectively etched hard mask to remove portions of the gate conductor layer above the gate dielectric layer.
Abstract:
The capacitance between the gate electrode and the source/drain regions of a semiconductor device is reduced by forming sub-spacers of a low dielectric constant (K) material at the corners of the gate electrode above the source/drain regions. Subsequently, insulating sidewall spacers are formed over the sub-spacers to shield-shallow source/drain regions from subsequent impurity implantations. The resulting semiconductor device exhibits reduced capacitance between the gate electrode and the source/drain regions, while maintaining circuit reliability.
Abstract:
A CMOS semiconductor device is formed having an N-channel transistor comprising a drain region with a graded N-LDD junction. The graded N-LDD junction is obtained by plural ion implantations at different implantation dosages, energies and angles. The graded N-LDD junction reduces the electric field around the drain, thereby increasing the HCI lifetime without adversely impacting the short channel effect.
Abstract:
A CMOS semiconductor device is formed having an N-channel transistor comprising a graded junction with reduced junction capacitance. The graded junction is achieved by forming a second sidewall spacer on the gate electrode, after source/drain implantations, and ion-implanting an N-type impurity with high diffusivity, e.g., P into an A.sub.5 implant, followed by activation annealing.
Abstract:
Semiconductor devices having improved contact resistance and methods for fabricating such semiconductor devices are provided. These semiconductor devices include a semiconductor device structure and a contact. The contact is electrically and physically coupled to the semiconductor device structure at both a surface portion and a sidewall portion of the semiconductor device structure.
Abstract:
The methods provided use external fields such as light and electricity as a means of directing the crystallization of concentrated colloidal systems. Not only can nucleation be directed, crystal melting can be carefully controlled and light-induced crystal diffraction used as a means of directing light propagation. A number of factors play a significant role on the crystallization rate and location, including the intensity of the light field, the magnitude of the electric field, the colloid concentration, the colloid size, and the colloid composition. In varying these parameters, kinetics in these processes are extremely fast when compared to traditional colloidal crystallization approaches.
Abstract:
A device has a processor for processing a vertex processing stage, a sub-screen dividing stage and a pixel rendering stage of a three-dimensional (3D) graphics pipeline. The processor includes processing threads which balance the work load of the 3D graphics pipeline by prioritizing processing for the pixel rendering stage over other stages. Each processing thread, operating in parallel and independently, checks a level of tasks in a Task list of sub-screen tasks. If the level is below a threshold value, empty or the sub-screen tasks are all locked, the processing thread loops to the vertex processing stage. Otherwise, the processing thread processes a sub-screen task during the pixel rendering stage.
Abstract:
An advertising decorative and protecting structure for a base of a game machine, the structure has a base provided therein with a cash box, the base is provided on its top surface with members such as a display screen and a top light box as the components of the main body of the game machine; the base is provided beneath the top and on the rear of the front face thereof with a liftable transparent door plate; this liftable transparent door plate is assembled on the rear of it at least with an integrally formed illumination device, so that it can generate an illumination function by which light is penetrable to the outside during operating the game machine, and also can form a covering and protecting structure for the entire base. The structure can elevate the effect of decoration of the base of the game machine in order to attract consumers, and further to enhance the function of protection of the cash box.