COMPOSITIONS AND PROCESSES FOR IMMERSION LITHOGRAPHY
    6.
    发明申请
    COMPOSITIONS AND PROCESSES FOR IMMERSION LITHOGRAPHY 审中-公开
    组合物和浸没法的方法

    公开(公告)号:US20110255069A1

    公开(公告)日:2011-10-20

    申请号:US13170007

    申请日:2011-06-27

    申请人: Deyan WANG

    发明人: Deyan WANG

    IPC分类号: G03B27/52 G03F7/004

    摘要: New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprise one or more materials that can be substantially non-mixable with a resin component of the resist. Further preferred photoresist compositions of the invention comprise 1) Si substitution, 2) fluorine substitution; 3) hyperbranched polymers; and/or 4) polymeric particles. Particularly preferred photoresists of the invention can exhibit reduced leaching of resist materials into an immersion fluid contacting the resist layer during immersion lithography processing.

    摘要翻译: 提供了可用于浸没式光刻的新的光致抗蚀剂组合物。 本发明优选的光致抗蚀剂组合物包含一种或多种可与抗蚀剂的树脂组分基本上不可混合的材料。 本发明的另外优选的光致抗蚀剂组合物包括1)Si取代,2)氟取代; 3)超支化聚合物; 和/或4)聚合物颗粒。 本发明的特别优选的光致抗蚀剂可以在浸没光刻处理期间将抗蚀剂材料的浸出降低到与抗蚀剂层接触的浸没流体中。

    COMPOSITIONS AND PROCESSES FOR PHOTOLITHOGRAPHY
    7.
    发明申请
    COMPOSITIONS AND PROCESSES FOR PHOTOLITHOGRAPHY 有权
    光刻胶的组成和工艺

    公开(公告)号:US20120264053A1

    公开(公告)日:2012-10-18

    申请号:US13445442

    申请日:2012-04-12

    申请人: Deyan WANG

    发明人: Deyan WANG

    IPC分类号: G03F7/20 G03F7/11 C09D133/16

    摘要: Topcoat layer compositions are provided that are applied above a photoresist composition. The compositions find particular applicability to immersion lithography processing.

    摘要翻译: 提供了在光致抗蚀剂组合物上施加的面漆层组合物。 该组合物特别适用于浸渍光刻加工。