摘要:
Devices built to design rules .ltoreq.0.25 .mu.m are pattern delineated by use of synchrotron-emitted x-ray radiation using a condenser which collects over a collection arc of at least 100 mrad. Condenser designs provide for processing of collected radiation to tailor characteristics such as direction and divergence. Pattern delineation by proximity printing as well as by projection printing is described. Forms of projection printing include reduction ringfield projection as by 5:1 mask:image reduction.
摘要:
Submicron device fabrication entailing ringfield x-ray pattern delineation is facilitated by use of a condenser including a faceted collector lens. The collector lens is constituted of paired facets, symmetrically placed about an axis of a laser-pumped plasma source. Each of the members of a pair produce an image of the entire illumination field so that inhomogeneities in illumination intensity are compensated within each composite image as produced by a particular pair.
摘要:
A deformable holder, system, and process where long range errors (any of lithography, metrology, or overlay errors) between the image of a mask and an existing pattern on a wafer from a number of potential sources are corrected. The long range errors are determined using either a through-the-lens alignment metrology system or an around-the-lens metrology system. Deformation values are determined to compensate for the longe range errors. The deformation values are determined by either solving simultaneous equations or by finite-element linear-stress-analysis (FEA). The mask or wafer is then distorted, in-plane, by an amount related to the determined deformation values using an actuator such an a piezoelectric ceramic to push or pull the mask or wafer to substantially realign the projected image of the mask and the existing pattern on the wafer.
摘要:
A single crystal fluorescent material is used in the conversion of a short wavelength image. Conversion to a long wavelength image in the visible spectrum permits use of conventional glass optics for visual observation of UV and x-ray images. An illustrative use is in inspection of masks designed for use in fabrication of large scale integrated circuitry built to submicron design rules.
摘要:
Fabrication of integrated circuits--electronic, photonic or hydrid--permits attainment of higher device density. Pattern delineation with smaller design rules than previously associated with delineating radiation of given wavelength is the consequence of use of phase masks. Compared with earlier used, binary valued phase masks, the multiple values of those on which this fabrication depends permits improved effectiveness in lessening of edge-smearing radiation of consequence (of diffraction-scattered delineating radiation at feature edges). Phase masking may provide, as well, for feature generation by interference, and for reduced intensity of unwanted image hot spots by diffraction.
摘要:
In an optical lithographical system (e.g., 100) for printing features of a patterned mask (e.g., 103) into a workpiece (e.g., 120), such as in a semiconductor device, a one- or two-dimensional (depending on the features of the mask) optical transmission phase-shift diffracting device (e.g., 107) is inserted between an optical condensor (e.g., 105) and the patterned mask whose features are to be printed into the workpiece. The diffracting device is designed so as to enable an imaging lens system (e.g., 102) to collect more than merely a single order of the resulting diffraction patterns of the features of the mask and, by varying the spatial periodicity of the diffracting device, to tailor the illumination incident on the mask in accordance with the features (e.g., 114, 115) of the mask.
摘要:
The fabrication of integrated circuit devices built to design rules of 0.18 .mu.m and below uses patterning radiation in the EUV spectrum. Optimized processing conditions take advantage of independently developed EUV characteristics such as short resist absorption lengths.
摘要:
Expedient fabrication of phase masks providing for many values of phase delay for exiting pattern delineating radiation depends upon a two-step procedure. Such masks offer improvement in ultimate device fabrication relative to that offered by prior binary-valued masks. In the first step, which may be carried out coincident with introduction of device feature information, apertures of appropriate size and distribution are produced in the relevant mask layer; in the second step material surrounding such apertures is heated to result in backflow-filling. The consequential layer thinning is such as to introduce the desired local change in phase delay.
摘要:
A method for lithographic alignment utilized in the manufacture of integrated circuits is described. The procedure includes an initial calibration through the lens system to expose a calibration material in a diffraction grating pattern. An interference pattern is produced above the grating with intersecting laser beams. By adjusting the path and/or phase of these beams the interference pattern is aligned with the diffraction pattern to establish a calibration point corresponding to a reference intensity in the intensity of the diffracted light. A wafer to be exposed is then placed in the exposure tool and is aligned by observing the diffraction pattern from a diffraction grating fiducial mark induced by the calibrated interference pattern.
摘要:
Zone plate patterns (12,20,61,62) formed on spaced-apart mask and wafer members (10,60) are utilized for alignment purposes in the fabrication of integrated circuits. By providing off-axis illumination of the patterns, a significant mask-to-wafer alignment capability is provided in an X-ray lithographic system. This capability includes being able to correct for so-called magnification errors that arise from physical distortions in the mask and/or wafer or in other components of the system. These errors are compensated for by utilizing the zone plate patterns to form alignment marks that serve as a basis for adjusting the mask-to-wafer separation.