Holder, system, and process for improving overlay in lithography
    1.
    发明授权
    Holder, system, and process for improving overlay in lithography 失效
    保持器,系统和改进光刻贴面的工艺

    公开(公告)号:US06847433B2

    公开(公告)日:2005-01-25

    申请号:US10159268

    申请日:2002-06-03

    摘要: A deformable holder, system, and process where long range errors (any of lithography, metrology, or overlay errors) between the image of a mask and an existing pattern on a wafer from a number of potential sources are corrected. The long range errors are determined using either a through-the-lens alignment metrology system or an around-the-lens metrology system. Deformation values are determined to compensate for the longe range errors. The deformation values are determined by either solving simultaneous equations or by finite-element linear-stress-analysis (FEA). The mask or wafer is then distorted, in-plane, by an amount related to the determined deformation values using an actuator such an a piezoelectric ceramic to push or pull the mask or wafer to substantially realign the projected image of the mask and the existing pattern on the wafer.

    摘要翻译: 一种可变形保持器,系统和工艺,其中修正了掩模图像与来自多个潜在源的晶片上的现有图案之间的长距离误差(任何光刻,测量或重叠误差)。 远距离误差使用透镜对准测量系统或镜片周围测量系统来确定。 确定变形值以补偿长度范围误差。 变形值通过求解联立方程或有限元线性应力分析(FEA)来确定。 然后使用诸如压电陶瓷的致动器来将掩模或晶片在平面内扭曲与所确定的变形值相关的量,以推动或拉动掩模或晶片以基本上重新调整掩模的投影图像和现有图案 在晶圆上。

    Device fabrication entailing plasma-derived x-ray delineation
    3.
    发明授权
    Device fabrication entailing plasma-derived x-ray delineation 失效
    器件制造需要等离子体衍生的x线描绘

    公开(公告)号:US5339346A

    公开(公告)日:1994-08-16

    申请号:US65331

    申请日:1993-05-20

    申请人: Donald L. White

    发明人: Donald L. White

    摘要: Submicron device fabrication entailing ringfield x-ray pattern delineation is facilitated by use of a condenser including a faceted collector lens. The collector lens is constituted of paired facets, symmetrically placed about an axis of a laser-pumped plasma source. Each of the members of a pair produce an image of the entire illumination field so that inhomogeneities in illumination intensity are compensated within each composite image as produced by a particular pair.

    摘要翻译: 通过使用包括刻面收集透镜的聚光体,促进了引起环形x射线图案描绘的亚微米器件制造。 收集透镜由成对的小面构成,围绕激光泵浦等离子体源的轴对称放置。 一对的每个成员产生整个照明场的图像,使得在由特定对产生的每个合成图像内的照明强度的不均匀性被补偿。

    Fluoresence imaging
    4.
    发明授权
    Fluoresence imaging 失效
    荧光成像

    公开(公告)号:US5498923A

    公开(公告)日:1996-03-12

    申请号:US177500

    申请日:1994-01-05

    CPC分类号: G02F2/02 G03F1/24 G03F1/84

    摘要: A single crystal fluorescent material is used in the conversion of a short wavelength image. Conversion to a long wavelength image in the visible spectrum permits use of conventional glass optics for visual observation of UV and x-ray images. An illustrative use is in inspection of masks designed for use in fabrication of large scale integrated circuitry built to submicron design rules.

    摘要翻译: 在短波长图像的转换中使用单晶荧光材料。 在可见光谱中转换成长波长图像允许使用传统的玻璃光学器件来目视观察UV和X射线图像。 一个说明性的用途是检查设计用于制造基于亚微米设计规则的大规模集成电路的掩模。

    Sub-micron device fabrication with a phase shift mask having multiple
values of phase delay
    5.
    发明授权
    Sub-micron device fabrication with a phase shift mask having multiple values of phase delay 失效
    具有相位延迟的多个值的相位移动面板的子麦克风装置制造

    公开(公告)号:US5229255A

    公开(公告)日:1993-07-20

    申请号:US673614

    申请日:1991-03-22

    申请人: Donald L. White

    发明人: Donald L. White

    IPC分类号: G03F1/28 G03F1/30 H01L21/027

    CPC分类号: G03F1/30 G03F1/28

    摘要: Fabrication of integrated circuits--electronic, photonic or hydrid--permits attainment of higher device density. Pattern delineation with smaller design rules than previously associated with delineating radiation of given wavelength is the consequence of use of phase masks. Compared with earlier used, binary valued phase masks, the multiple values of those on which this fabrication depends permits improved effectiveness in lessening of edge-smearing radiation of consequence (of diffraction-scattered delineating radiation at feature edges). Phase masking may provide, as well, for feature generation by interference, and for reduced intensity of unwanted image hot spots by diffraction.

    Optical lithographical imaging system including optical transmission
diffraction devices
    6.
    再颁专利
    Optical lithographical imaging system including optical transmission diffraction devices 失效
    光学光学成像系统包括光学透射衍射装置

    公开(公告)号:USRE35753E

    公开(公告)日:1998-03-24

    申请号:US648796

    申请日:1996-05-16

    IPC分类号: G03F7/20 H01L21/027 G03F9/00

    摘要: In an optical lithographical system (e.g., 100) for printing features of a patterned mask (e.g., 103) into a workpiece (e.g., 120), such as in a semiconductor device, a one- or two-dimensional (depending on the features of the mask) optical transmission phase-shift diffracting device (e.g., 107) is inserted between an optical condensor (e.g., 105) and the patterned mask whose features are to be printed into the workpiece. The diffracting device is designed so as to enable an imaging lens system (e.g., 102) to collect more than merely a single order of the resulting diffraction patterns of the features of the mask and, by varying the spatial periodicity of the diffracting device, to tailor the illumination incident on the mask in accordance with the features (e.g., 114, 115) of the mask.

    摘要翻译: 在用于将图案化掩模(例如,103)的特征打印到工件(例如,120)中的光学系统(例如,100)中,例如在半导体器件中,一维或二维(取决于特征 的光传输相移衍射装置(例如,107)被插入在光学聚光器(例如,105)和其特征被打印到工件中的图案化掩模之间。 衍射装置被设计成使得成像透镜系统(例如,102)能够收集不仅仅是掩模的特征的所得到的衍射图案的单个顺序,并且通过将衍射装置的空间周期性改变为 根据掩模的特征(例如,114,115)调整入射在掩模上的照明。

    Sub-micron device fabrication
    8.
    发明授权
    Sub-micron device fabrication 失效
    子麦克风设备制造

    公开(公告)号:US5217831A

    公开(公告)日:1993-06-08

    申请号:US673626

    申请日:1991-03-22

    申请人: Donald L. White

    发明人: Donald L. White

    IPC分类号: G03F1/28 H01L21/027

    CPC分类号: G03F1/28

    摘要: Expedient fabrication of phase masks providing for many values of phase delay for exiting pattern delineating radiation depends upon a two-step procedure. Such masks offer improvement in ultimate device fabrication relative to that offered by prior binary-valued masks. In the first step, which may be carried out coincident with introduction of device feature information, apertures of appropriate size and distribution are produced in the relevant mask layer; in the second step material surrounding such apertures is heated to result in backflow-filling. The consequential layer thinning is such as to introduce the desired local change in phase delay.

    Alignment of lithographic system
    9.
    发明授权
    Alignment of lithographic system 失效
    光刻系统的对准

    公开(公告)号:US4923301A

    公开(公告)日:1990-05-08

    申请号:US199106

    申请日:1988-05-26

    申请人: Donald L. White

    发明人: Donald L. White

    IPC分类号: G03F9/00 H01L21/027 H01L21/30

    CPC分类号: G03F9/7049

    摘要: A method for lithographic alignment utilized in the manufacture of integrated circuits is described. The procedure includes an initial calibration through the lens system to expose a calibration material in a diffraction grating pattern. An interference pattern is produced above the grating with intersecting laser beams. By adjusting the path and/or phase of these beams the interference pattern is aligned with the diffraction pattern to establish a calibration point corresponding to a reference intensity in the intensity of the diffracted light. A wafer to be exposed is then placed in the exposure tool and is aligned by observing the diffraction pattern from a diffraction grating fiducial mark induced by the calibrated interference pattern.

    Method and apparatus for aligning mask and wafer members
    10.
    发明授权
    Method and apparatus for aligning mask and wafer members 失效
    用于对准掩模和晶片构件的方法和装置

    公开(公告)号:US4326805A

    公开(公告)日:1982-04-27

    申请号:US139544

    申请日:1980-04-11

    CPC分类号: G03F9/7076 G03F9/703

    摘要: Zone plate patterns (12,20,61,62) formed on spaced-apart mask and wafer members (10,60) are utilized for alignment purposes in the fabrication of integrated circuits. By providing off-axis illumination of the patterns, a significant mask-to-wafer alignment capability is provided in an X-ray lithographic system. This capability includes being able to correct for so-called magnification errors that arise from physical distortions in the mask and/or wafer or in other components of the system. These errors are compensated for by utilizing the zone plate patterns to form alignment marks that serve as a basis for adjusting the mask-to-wafer separation.

    摘要翻译: 形成在间隔开的掩模和晶片构件(10,60)上的区域板图案(12,20,61,62)用于集成电路制造中的对准目的。 通过提供图案的离轴照明,在X射线光刻系统中提供了显着的掩模到晶片对准能力。 该能力包括能够校正由掩模和/或晶片或系统的其它部件中的物理失真引起的所谓放大误差。 这些误差通过利用区域板图案来补偿,以形成用作调整掩模到晶片间隔的基础的对准标记。