Method for measuring a thickness of a printed circuit board
    9.
    发明授权
    Method for measuring a thickness of a printed circuit board 失效
    测量印刷电路板厚度的方法

    公开(公告)号:US5212540A

    公开(公告)日:1993-05-18

    申请号:US796465

    申请日:1991-11-22

    申请人: Donald W. Miller

    发明人: Donald W. Miller

    IPC分类号: G01B11/06

    CPC分类号: G01B11/0616 G01B11/06

    摘要: The invention relates to a method for measuring a thickness of a printed circuit board having a plating portion provided on a core portion. The method includes directing a laser beam to the core portion of the printed circuit board, whereby the laser beam at least partially reflects from the core portion. The reflected laser beam is monitored and a thickness of the core portion is determined based upon the reflected laser beam. The plating portion of the printed circuit board is then heated by transferring a selected amount of energy thereto. The thermal characteristics of the heated plating are monitored and a thickness of the plating portion is determined based upon these thermal characteristics.

    摘要翻译: 本发明涉及一种用于测量印刷电路板的厚度的方法,该印刷电路板具有设置在芯部上的电镀部分。 该方法包括将激光束引导到印刷电路板的芯部,由此激光束至少部分地从芯部反射。 监测反射的激光束,并且基于反射的激光束来确定芯部的厚度。 然后通过将选定量的能量转移到印刷电路板的电镀部分来加热。 监测加热电镀的热特性,并根据这些热特性确定电镀部分的厚度。