Method for epitaxial bipolar BiCMOS
    1.
    发明授权
    Method for epitaxial bipolar BiCMOS 失效
    外延双极BiCMOS的方法

    公开(公告)号:US06448124B1

    公开(公告)日:2002-09-10

    申请号:US09439067

    申请日:1999-11-12

    IPC分类号: H01L218238

    摘要: A method of forming a BiCMOS integrated circuit is provided which comprises the steps of: (a) forming a first portion of a bipolar device in first regions of a substrate; (b) forming a first protective layer over said first regions to protect said first portion of said bipolar devices; (c) forming field effect transistor devices in second regions of said substrate; (d) forming a second protective layer over said second regions of said substrate to protect said field effect transistor devices; (e) removing said first protective layer; (f) forming a second portion of said bipolar devices in said first regions of said substrate; and (g) removing said second protective layer.

    摘要翻译: 提供一种形成BiCMOS集成电路的方法,其包括以下步骤:(a)在衬底的第一区域中形成双极器件的第一部分; (b)在所述第一区域上形成第一保护层以保护所述双极器件的所述第一部分; (c)在所述衬底的第二区域中形成场效应晶体管器件; (d)在所述衬底的所述第二区域上形成第二保护层以保护所述场效应晶体管器件; (e)去除所述第一保护层; (f)在所述衬底的所述第一区域中形成所述双极器件的第二部分; 和(g)去除所述第二保护层。

    BIPOLAR JUNCTION TRANSISTOR WITH A SELF-ALIGNED EMITTER AND BASE
    3.
    发明申请
    BIPOLAR JUNCTION TRANSISTOR WITH A SELF-ALIGNED EMITTER AND BASE 有权
    具有自对准发射器和基极的双极性JUNCTION TRANSISTOR

    公开(公告)号:US20120228611A1

    公开(公告)日:2012-09-13

    申请号:US13042902

    申请日:2011-03-08

    IPC分类号: H01L29/73 H01L21/331

    摘要: Methods for fabricating bipolar junction transistors with self-aligned emitter and extrinsic base, bipolar junction transistors made by the methods, and design structures for a BiCMOS integrated circuit. The bipolar junction transistor is fabricated using a sacrificial emitter pedestal that provides a sacrificial mandrel promoting self-alignment between the emitter and the extrinsic base. The sacrificial emitter pedestal is subsequently removed to open an emitter window extending to the intrinsic base. An emitter is formed in the emitter window that lands on the intrinsic base.

    摘要翻译: 用于制造具有自对准发射极和非本征基极的双极结型晶体管的方法,通过该方法制造的双极结型晶体管以及用于BiCMOS集成电路的设计结构。 使用牺牲发射器基座制造双极结型晶体管,该牺牲发射器基座提供牺牲的心轴,以促进发射极和外部基极之间的自对准。 随后去除牺牲发射器基座以打开延伸到本征基底的发射器窗口。 在发射器窗口中形成发射极,其位于本征基极上。

    Methods of fabricating a bipolar junction transistor with a self-aligned emitter and base
    4.
    发明授权
    Methods of fabricating a bipolar junction transistor with a self-aligned emitter and base 有权
    制造具有自对准发射极和基极的双极结型晶体管的方法

    公开(公告)号:US08492237B2

    公开(公告)日:2013-07-23

    申请号:US13042902

    申请日:2011-03-08

    IPC分类号: H01L21/8222

    摘要: Methods for fabricating bipolar junction transistors with self-aligned emitter and extrinsic base, bipolar junction transistors made by the methods, and design structures for a BiCMOS integrated circuit. The bipolar junction transistor is fabricated using a sacrificial emitter pedestal that provides a sacrificial mandrel promoting self-alignment between the emitter and the extrinsic base. The sacrificial emitter pedestal is subsequently removed to open an emitter window extending to the intrinsic base. An emitter is formed in the emitter window that lands on the intrinsic base.

    摘要翻译: 用于制造具有自对准发射极和非本征基极的双极结型晶体管的方法,通过该方法制造的双极结型晶体管以及用于BiCMOS集成电路的设计结构。 使用牺牲发射器基座制造双极结型晶体管,该牺牲发射器基座提供牺牲的心轴,以促进发射极和外部基极之间的自对准。 随后去除牺牲发射器基座以打开延伸到本征基底的发射器窗口。 在发射器窗口中形成发射极,其位于本征基极上。

    TRANSISTOR STRUCTURE WITH A SIDEWALL-DEFINED INTRINSIC BASE TO EXTRINSIC BASE LINK-UP REGION AND METHOD OF FORMING THE STRUCTURE
    5.
    发明申请
    TRANSISTOR STRUCTURE WITH A SIDEWALL-DEFINED INTRINSIC BASE TO EXTRINSIC BASE LINK-UP REGION AND METHOD OF FORMING THE STRUCTURE 有权
    具有侧向定义的内部基极到极端基底连接区域的晶体管结构及形成结构的方法

    公开(公告)号:US20110309471A1

    公开(公告)日:2011-12-22

    申请号:US12817249

    申请日:2010-06-17

    IPC分类号: H01L29/73 H01L21/331

    摘要: Disclosed are embodiments of an improved transistor structure (e.g., a bipolar transistor (BT) structure or heterojunction bipolar transistor (HBT) structure) and a method of forming the transistor structure. The structure embodiments can incorporate a dielectric layer sandwiched between an intrinsic base layer and a raised extrinsic base layer to reduce collector-base capacitance Ccb, a sidewall-defined conductive strap for an intrinsic base layer to extrinsic base layer link-up region to reduce base resistance Rb and a dielectric spacer between the extrinsic base layer and an emitter layer to reduce base-emitter Cbe capacitance. The method embodiments allow for self-aligning of the emitter to base regions and further allow the geometries of different features (e.g., the thickness of the dielectric layer, the width of the conductive strap, the width of the dielectric spacer and the width of the emitter layer) to be selectively adjusted in order to optimize transistor performance.

    摘要翻译: 公开了改进的晶体管结构(例如,双极晶体管(BT)结构或异质结双极晶体管(HBT)结构)的实施例以及形成晶体管结构的方法。 结构实施例可以包括夹在本征基极层和凸起的非本征基极层之间的电介质层,以将集电极 - 基极电容Ccb,用于本征基极层的侧壁限定导电带限制到外部基极层连接区域以减少基极 电阻Rb和外部基极层和发射极层之间的介电间隔物,以减少基极 - 发射极的Cbe电容。 该方法实施例允许发射极与基极区域的自对准,并进一步允许不同特征的几何形状(例如,电介质层的厚度,导电带的宽度,电介质间隔物的宽度和介电隔离物的宽度 发射极层)进行选择性调整,以优化晶体管性能。

    Transistor structure with a sidewall-defined intrinsic base to extrinsic base link-up region and method of forming the structure
    7.
    发明授权
    Transistor structure with a sidewall-defined intrinsic base to extrinsic base link-up region and method of forming the structure 有权
    具有侧壁限定的内在基极到外部基极连接区域的晶体管结构和形成该结构的方法

    公开(公告)号:US08405186B2

    公开(公告)日:2013-03-26

    申请号:US12817249

    申请日:2010-06-17

    IPC分类号: H01L21/70

    摘要: Disclosed are embodiments of an improved transistor structure (e.g., a bipolar transistor (BT) structure or heterojunction bipolar transistor (HBT) structure) and a method of forming the transistor structure. The structure embodiments can incorporate a dielectric layer sandwiched between an intrinsic base layer and a raised extrinsic base layer to reduce collector-base capacitance Ccb, a sidewall-defined conductive strap for an intrinsic base layer to extrinsic base layer link-up region to reduce base resistance Rb and a dielectric spacer between the extrinsic base layer and an emitter layer to reduce base-emitter Cbe capacitance. The method embodiments allow for self-aligning of the emitter to base regions and further allow the geometries of different features (e.g., the thickness of the dielectric layer, the width of the conductive strap, the width of the dielectric spacer and the width of the emitter layer) to be selectively adjusted in order to optimize transistor performance.

    摘要翻译: 公开了改进的晶体管结构(例如,双极晶体管(BT)结构或异质结双极晶体管(HBT)结构)的实施例以及形成晶体管结构的方法。 结构实施例可以包括夹在本征基极层和凸起的非本征基极层之间的电介质层,以将集电极 - 基极电容Ccb,用于本征基极层的侧壁限定导电带限制到外部基极层连接区域以减少基极 电阻Rb和外部基极层和发射极层之间的介电间隔物,以减少基极 - 发射极的Cbe电容。 该方法实施例允许发射极与基极区域的自对准,并进一步允许不同特征的几何形状(例如,电介质层的厚度,导电带的宽度,电介质间隔物的宽度和介电隔离物的宽度 发射极层)进行选择性调整,以优化晶体管性能。

    Method of collector formation in BiCMOS technology
    8.
    发明授权
    Method of collector formation in BiCMOS technology 有权
    BiCMOS技术中收集器形成的方法

    公开(公告)号:US07491985B2

    公开(公告)日:2009-02-17

    申请号:US11288843

    申请日:2005-11-29

    摘要: A heterobipolar transistor (HBT) for high-speed BiCMOS applications is provided in which the collector resistance, Rc, is lowered by providing a buried refractory metal silicide layer underneath the shallow trench isolation region on the subcollector of the device. Specifically, the HBT of the present invention includes a substrate including at least a subcollector; a buried refractory metal silicide layer located on the subcollector; and a shallow trench isolation region located on a surface of the buried refractory metal silicide layer. The present invention also provides a method of fabricating such a HBT. The method includes forming a buried refractory metal silicide underneath the shallow trench isolation region on the subcollector of the device.

    摘要翻译: 提供了用于高速BiCMOS应用的异步双极晶体管(HBT),其中通过在器件的子集电极上的浅沟槽隔离区域的下面提供掩埋难熔金属硅化物层来降低集电极电阻Rc。 具体地,本发明的HBT包括至少包括子集电极的基板; 位于子集电极上的埋置难熔金属硅化物层; 以及位于掩埋难熔金属硅化物层的表面上的浅沟槽隔离区域。 本发明还提供一种制造这种HBT的方法。 该方法包括在器件的子集电极上的浅沟槽隔离区域的下面形成埋置难熔金属硅化物。

    BIPOLAR TRANSISTOR STRUCTURE AND METHOD INCLUDING EMITTER-BASE INTERFACE IMPURITY
    10.
    发明申请
    BIPOLAR TRANSISTOR STRUCTURE AND METHOD INCLUDING EMITTER-BASE INTERFACE IMPURITY 有权
    双极晶体管结构和方法,其中包括发射极基底界面强度

    公开(公告)号:US20100320571A1

    公开(公告)日:2010-12-23

    申请号:US12488899

    申请日:2009-06-22

    IPC分类号: H01L29/73 H01L21/331

    摘要: A bipolar transistor structure and a method for fabricating the bipolar transistor structure include: (1) a collector structure located at least in-part within a semiconductor substrate; (2) a base structure contacting the collector structure; and (3) an emitter structure contacting the base structure. The interface of the emitter structure and the base structure includes an oxygen impurity and at least one impurity selected from the group consisting of a fluorine impurity and a carbon impurity, to enhance performance of a bipolar transistor within the bipolar transistor structure. The impurities may be introduced into the interface by plasma etch treatment, or alternatively a thermal treatment followed by an anhydrous ammonia and hydrogen fluoride treatment, of a base material from which is comprised the base structure.

    摘要翻译: 双极晶体管结构和制造双极晶体管结构的方法包括:(1)至少部分地位于半导体衬底内的集电极结构; (2)与收集器结构接触的基部结构; 和(3)与基底结构接触的发射体结构。 发射极结构和基极结构的界面包括氧杂质和选自氟杂质和碳杂质的至少一种杂质,以增强双极晶体管结构内的双极晶体管的性能。 杂质可以通过等离子体蚀刻处理或者替代地进行无水氨和氟化氢处理的热处理而引入到界面中,其中基体材料由基底结构组成。