摘要:
The present invention relates to low dielectric constant nanoporous silica films and to processes for their manufacture. A substrate, e.g., a wafer suitable for the production of an integrated circuit, having a plurality of raised lines and/or electronic elements present on its surface, is provided with a relatively high porosity, low dielectric constant, silicon-containing polymer film composition.
摘要:
The present invention relates to nanoporous dielectric films and to a process for their manufacture. A substrate having a plurality of raised lines on its surface is provided with a relatively high porosity, low dielectric constant, silicon containing polymer composition positioned between the raised lines and a relatively low porosity, high dielectric constant, silicon containing composition positioned on the lines.
摘要:
The present invention relates to nanoporous dielectric films and to a process for their manufacture. Such films are useful in the production of integrated circuits. A precursor of an alkoxysilane, and low and high volatility solvents are mixed at a pH of about 2-5, raised to a pH of about 8 or above with a low volatility base and deposited on a semiconductor substrate. After exposure to atmospheric moisture, a nanoporous dielectric film is produced on the substrate.
摘要:
A process for forming a nanoporous dielectric coating on a substrate. The process follows the steps of blending an alkoxysilane with a solvent composition and optional water; depositing the mixture onto a substrate while evaporating at least a portion of the solvent composition; placing the substrate in a sealed chamber and evacuating the chamber to a pressure below atmospheric pressure; exposing the substrate to water vapor at a pressure below atmospheric pressure and then exposing the substrate to base vapor.
摘要:
The present invention relates to low dielectric constant nanoporous silica films and to processes for their manufacture. A substrate, e.g., a wafer suitable for the production of an integrated circuit, having a plurality of raised lines and/or electronic elements present on its surface, is provided with a relatively high porosity, low dielectric constant, silicon-containing polymer film composition.
摘要:
A process for the manufacture of nanoporous silica dielectric films by vapor deposition of silica precursors on a substrate. The process provides for vaporizing at least one alkoxysilane composition; depositing the vaporized alkoxysilane composition onto a substrate; exposing the deposited alkoxysilane composition to a water vapor, and either an acid or a base vapor; and drying the exposed alkoxysilane composition, thereby forming a relatively high porosity, low dielectric constant, silicon containing polymer composition on the substrate.
摘要:
Novel sorption cooling devices capable of providing cooling over an extended period of time are disclosed. The sorption cooling devices are particularly useful for temperature-controlled shipping containers that are required to maintain a temperature below ambient for a time sufficient to complete delivery of the container and its contents. The shipping containers can be utilized to cost-effectively transport temperature-sensitive products.
摘要:
A method and apparatus for the rapid cooling of a container and its contents, such as a beverage container. A heat transfer fluid is thermally contacted with the beverage container, where the heat transfer fluid has a temperature of less than 0° C. The heat transfer fluid can be physically separated from the container, such as by flowing the heat transfer fluid through a heat exchanger that surrounds the container. The cooling parameters can be controlled such that the container and its contents are rapidly cooled without freezing of the contents.
摘要:
A temperature-controlled container utilizing a sorption cooling unit to maintain the temperature within the container. The sorption cooling unit cools the interior of the container and rejects waste heat to the exterior. The sorption cooling unit provides a lightweight and low volume alternative to the traditional gel pack cooling systems that are commonly used in the modern shipping industry for shipping containers.
摘要:
A container insert for providing a thermally insulated enclosure. The container insert includes a bottom panel, side panels and end panels that are interconnected by a plastic backing sheet. The side panels and end panels can be pivoted upwardly to form side walls and end walls. The plastic backing sheet covers the seams between adjacent insulation panels to provide a moisture barrier. The plastic backing sheet can also urge adjacent panels together to reduce the gap between adjacent panels and improve thermal performance.