公开(公告)号：US06492725B1

公开(公告)日：2002-12-10

申请号：US09498311

申请日：2000-02-04

申请人： Ban Poh Loh ,  Douglas P. Woolverton ,  Wayne L. Snyder

发明人： Ban Poh Loh ,  Douglas P. Woolverton ,  Wayne L. Snyder

IPC分类号： H01L2348

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/00014

摘要： A concentrically leaded power semiconductor package includes two or more generally concentric conductors. An inner conductor may provide an attachment point for one or more semiconductor devices at an end of the inner conductor and an electrical connection at an opposite end. An outer conductor may be pressed onto the inner conductor and may be separated by an electrical insulator. A semiconductor device, such as a light emitting diode (LED), may be attached to the inner conductor by epoxy gluing or by soldering, and may be attached to the outer conductor by a bonding wire. The package may be cylindrical or a rectangular solid. The package may incorporate additional semiconductor mounting surfaces and more than two conductors.

摘要翻译： 同心引线的功率半导体封装包括两个或更多个大致同心的导体。 内部导体可以在内部导体的端部处提供用于一个或多个半导体器件的连接点和在相对端的电连接。 外部导体可以被压到内部导体上并且可以被电绝缘体分开。 诸如发光二极管（LED）的半导体器件可以通过环氧树脂胶合或通过焊接附接到内部导体，并且可以通过接合线附接到外部导体。 包装可以是圆柱形或矩形固体。 封装可以包含另外的半导体安装表面和多于两个的导体。

公开(公告)号：US07130056B2

公开(公告)日：2006-10-31

申请号：US10783199

申请日：2004-02-20

申请人： William Clay Schluchter ,  Louis F. Mueller ,  Douglas P. Woolverton ,  Jeffrey A. Young ,  Alan B. Ray ,  David C. Chu

发明人： William Clay Schluchter ,  Louis F. Mueller ,  Douglas P. Woolverton ,  Jeffrey A. Young ,  Alan B. Ray ,  David C. Chu

IPC分类号： G01B11/02

CPC分类号： G03F7/70775

摘要： A system and method for acquiring position information of a movable apparatus relevant to a specific axis is disclosed. In one embodiment, an interferometer generates first and second beams and various beam-steering members are located to define beam path segments for the two beams, but no beam path segment varies in length in unity with displacements of the movable apparatus along the specific axis. In another or the same embodiment, each beam path segment in which the first beam either impinges or has been reflected from the movable apparatus is symmetrical to a corresponding beam path segment of the second beam. The movable apparatus may be a wafer stage in which the “specific axis” is the exposure axis of a projection lens, but with all optical members which cooperate with the stage being located beyond the ranges of the wafer stage in directions perpendicular to the lithographic exposure axis.

摘要翻译： 公开了一种用于获取与特定轴相关的可移动装置的位置信息的系统和方法。 在一个实施例中，干涉仪产生第一和第二光束，并且定位各种光束转向构件以限定用于两个光束的光束路径段，但是没有光束路径段随着可移动装置沿特定轴线的位移而在长度上变化。 在另一个或相同的实施例中，其中第一光束撞击或已经从可移动装置反射的每个光束路径段与第二光束的相应光束路径段对称。 可移动装置可以是其中“特定轴线”是投影透镜的曝光轴线的晶片台，但是与垂直于光刻曝光的方向的晶片台的位置超出晶片台的范围的所有光学构件 轴。

公开(公告)号：US5519596A

公开(公告)日：1996-05-21

申请号：US442724

申请日：1995-05-16

申请人： Douglas P. Woolverton

发明人： Douglas P. Woolverton

IPC分类号： H01L33/00 ,  F21S8/10 ,  G09F9/33 ,  H01L25/13 ,  F21V21/14

CPC分类号： F21S48/215 ,  G09F9/33 ,  H01L25/13 ,  H01L2924/0002 ,  Y10S362/80

摘要： A module comprised of a plurality of light emitting diode ("LED") lamps or other light emitting devices and a metal nesting frame with flexible joints between each row of LED bus bars is described. The flexible joint between the rows of LED bus bars allows the module to be assembled flat, which eases its manufacture. After the LED lamps or other light emitting devices have been mounted on the nesting frame, the flexible joints allow the module to be formed to fit within or on a complex three dimensional space. After forming, the metal nesting frame is still rigid enough to support the finished module in the desired shape.

摘要翻译： 描述了由多个发光二极管（“LED”）灯或其他发光器件组成的模块和在每排LED母线之间具有柔性接头的金属嵌套框架。 LED母线排之间的柔性接头允许将模块组装成平面，从而简化其制造。 在LED灯或其他发光装置已经安装在嵌套框架上之后，柔性接头允许模块形成为适合于复杂的三维空间内或上。 在成型之后，金属嵌套框架仍然足够坚固以将完成的模块支撑成所需的形状。

公开(公告)号：US07212290B2

公开(公告)日：2007-05-01

申请号：US10900529

申请日：2004-07-28

申请人： Kevin R. Fine ,  Greg C. Felix ,  John J. Bockman ,  Douglas P. Woolverton

发明人： Kevin R. Fine ,  Greg C. Felix ,  John J. Bockman ,  Douglas P. Woolverton

IPC分类号： G01B9/02

CPC分类号： G01J9/0215 ,  G01B9/02003 ,  G01B9/02018 ,  G01B9/02051 ,  G01B2290/70 ,  G01J2009/0261

摘要： An interferometer system includes a rhomboid assembly having a first optical stack and a second optical stack mounted on the first stack. The first stack includes a first prism having an angled face mounted to an angled face of a second prism. The interface between these angled faces includes a first polarizing beam-splitter. The second stack includes a third prism having an angled face mounted to an angled face of the fourth prism. The interface between these angled faces includes a second polarizing beam-splitter. First, second, third, and fourth wave plate elements are located in beam paths between the rhomboid assembly and at least one of a measurement optic and a reference optic. A redirecting optic is located at least adjacent to the vertical faces of the first and the third prisms.

摘要翻译： 干涉仪系统包括具有安装在第一堆叠上的第一光学堆叠和第二光学堆叠的菱形组件。 第一堆叠包括具有安装到第二棱镜的倾斜面的倾斜面的第一棱镜。 这些倾斜面之间的界面包括第一偏振分束器。 第二堆叠包括具有安装到第四棱镜的倾斜面的成角度的第三棱镜。 这些倾斜面之间的界面包括第二偏振分束器。 第一，第二，第三和第四波片元件位于菱形组件与测量光学元件和参考光学元件中的至少一个之间的光束路径中。 重定向光学器件至少邻近第一和第三棱镜的垂直面定位。

公开(公告)号：US06498355B1

公开(公告)日：2002-12-24

申请号：US09974563

申请日：2001-10-09

申请人： Shane Harrah ,  Douglas P. Woolverton

发明人： Shane Harrah ,  Douglas P. Woolverton

IPC分类号： H01L3300

CPC分类号： H01L33/642 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/10106 ,  H01L2924/00014

摘要： A light emitting diode array in accordance with the present invention includes a metal substrate, a dielectric layer disposed above the metal substrate, and a plurality of electrically conductive traces disposed on the dielectric layer. A plurality of vias pass through the dielectric layer. The light emitting diode array also includes a plurality of light emitting diodes, each of which is disposed above a corresponding one of said vias and each of which includes a first electrical contact and a second electrical contact electrically coupled to separate ones of the electrically conductive traces. Each of the vias contains a thermally conductive material in thermal contact with the metal substrate and in thermal contact with the corresponding light emitting diode.

摘要翻译： 根据本发明的发光二极管阵列包括金属基板，设置在金属基板上方的电介质层和设置在电介质层上的多个导电迹线。 多个通孔穿过电介质层。 发光二极管阵列还包括多个发光二极管，每个发光二极管设置在所述通孔中的相应一个之上，每个都包括第一电接触和第二电接触，电耦合以分离导电迹线 。 每个通孔都包含与金属基板热接触并与相应的发光二极管热接触的导热材料。