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    ANODE UNIT AND PLATING APPARATUS HAVING SUCH ANODE UNIT
    2.
    发明申请
    ANODE UNIT AND PLATING APPARATUS HAVING SUCH ANODE UNIT 有权
    阳极单元和具有这种阳极单元的电镀设备

    公开(公告)号：US20150275390A1

    公开(公告)日：2015-10-01

    申请号：US14629453

    申请日：2015-02-23

    申请人： EBARA CORPORATION

    发明人： Junichiro TSUJINO ,  Tsutomu NAKADA ,  Yusuke TAMARI ,  Mitsutoshi YAHAGI ,  Akira OWATARI

    IPC分类号： C25D17/12 ,  C25D17/00

    CPC分类号： C25D17/12 ,  C25D17/001 ,  C25D17/007

    摘要： An anode unit capable of forming a metal film having a uniform thickness on a substrate is disclosed. The anode unit includes an anode, a first feeding portion connected to a central portion of the anode, a second feeding portion located on a central axis of the anode and located away from the anode, and arms extending radially from the second feeding portion. The arms are connected to a periphery of the anode.

    摘要翻译： 公开了能够在基板上形成均匀厚度的金属膜的阳极单元。 阳极单元包括阳极，连接到阳极的中心部分的第一馈电部分，位于阳极的中心轴线上并且远离阳极定位的第二馈电部分以及从第二馈电部分径向延伸的臂。 臂连接到阳极的周边。

    ELECTROLESS PLATING APPARATUS
    3.
    发明申请
    ELECTROLESS PLATING APPARATUS 审中-公开
    电镀镀膜设备

    公开(公告)号：US20160160352A1

    公开(公告)日：2016-06-09

    申请号：US15043425

    申请日：2016-02-12

    申请人： EBARA CORPORATION

    发明人： Hiroyuki KANDA ,  Junichiro TSUJINO ,  Junko MINE ,  Makoto KUBOTA ,  Tsutomu NAKADA ,  Kenichiro ARAI

    IPC分类号： C23C18/16

    CPC分类号： C23C18/163 ,  C23C18/1628 ,  C23C18/1632 ,  C23C18/1642 ,  C23C18/1651 ,  C23C18/1669 ,  C23C18/1675 ,  C23C18/168 ,  C23C18/1682 ,  C23C18/1683 ,  C23C18/32 ,  C23C18/54 ,  H01L21/76838 ,  H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/11464 ,  H01L2224/742 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/05552

    摘要： There is provided an electroless plating apparatus which, despite using a high-productivity batch processing method, can reduce the amount of a liquid chemical brought out of a processing tank, thereby reducing the cleaning time in a cleaning step, and can perform flushing easily and quickly. The electroless plating apparatus includes a pre-plating treatment module including a pre-plating treatment tank, a plating module, and an inter-module substrate transport device. The pre-plating treatment tank is provided with a pre-plating treatment solution circulation line having a temperature control function for a pre-plating treatment solution. The plating tank is provided with a plating solution circulation line having a filter and a temperature control function for a plating solution. The plating solution circulation line is connected to a flushing line for flushing the interior of the plating solution circulation line and the interior of the plating tank.

    摘要翻译： 提供了一种化学镀设备，尽管使用高生产率批量处理方法，但是可以减少从处理槽中排出的液体化学物质的量，从而减少清洁步骤中的清洁时间，并且可以容易地进行冲洗， 很快。 无电解电镀装置包括预镀处理模块，其包括预镀处理槽，镀覆模块和模块间基板输送装置。 预镀处理槽设置有预镀处理液循环管线，其具有用于预镀处理溶液的温度控制功能。 电镀槽具有电镀液循环管线，其具有用于电镀液的过滤器和温度控制功能。 电镀液循环管线连接到用于冲洗电镀液循环管线内部和镀槽内部的冲洗管线。

    ANODE HOLDER AND PLATING APPARATUS
    4.
    发明申请
    ANODE HOLDER AND PLATING APPARATUS 审中-公开
    阳极灯座和电镀设备

    公开(公告)号：US20160369421A1

    公开(公告)日：2016-12-22

    申请号：US15118036

    申请日：2015-02-05

    申请人： EBARA CORPORATION

    发明人： Mitsutoshi YAHAGI ,  Masaaki KIMURA ,  Junichiro TSUJINO

    IPC分类号： C25D17/10 ,  C25D17/04 ,  C25D17/06 ,  C25D17/00

    CPC分类号： C25D17/10 ,  C25D17/00 ,  C25D17/001 ,  C25D17/002 ,  C25D17/04 ,  C25D17/06

    摘要： To provide an anode holder and a plating apparatus including the same, the anode holder being configured to prevent additives and black films from spreading by moving between an internal space in which an anode is provided and an external space.An anode holder 60 according to the present invention includes: an internal space 61 that houses an anode therein; a diaphragm configured so as to cover a front face of the internal space 61; a hole 71 that is formed on an external surface of the anode holder and which communicates with the internal space 61; and a valve 91 that seals the hole 71 shut.

    摘要翻译： 根据本发明的阳极保持器60包括：内部容纳阳极的内部空间61; 隔膜，其构造成覆盖所述内部空间61的前表面; 孔71，形成在阳极保持件的外表面上并与内部空间61连通; 以及密封孔71关闭的阀91。

    COPPER ELECTROPLATING APPARATUS
    5.
    发明申请
    COPPER ELECTROPLATING APPARATUS 审中-公开
    铜电镀设备

    公开(公告)号：US20140360865A1

    公开(公告)日：2014-12-11

    申请号：US14296366

    申请日：2014-06-04

    申请人： EBARA CORPORATION

    发明人： Masaaki KIMURA ,  Mitsutoshi YAHAGI ,  Junichiro TSUJINO

    IPC分类号： C25D17/12 ,  C25D7/12

    CPC分类号： C25D17/12 ,  C25D3/38 ,  C25D17/001 ,  C25D17/002 ,  C25D17/008 ,  C25D17/10 ,  C25D21/10

    摘要： A copper electroplating apparatus is disclosed. The copper electroplating apparatus includes: a plating bath configured to hold a plating solution therein; a soluble anode of phosphorus-containing copper; a substrate holder configured to hold a substrate; an anode bag that surrounds the anode, the anode bag being formed of mesh; a regulation plate configured to regulate an electric field, the regulation plate having an opening and being disposed between the anode and the substrate held by the substrate holder; and a diaphragm disposed so as to dose the opening of the regulation plate, the diaphragm being configured to allow permeation of metal ions therethrough and not allow permeation of additives contained in the plating solution.

    摘要翻译： 公开了一种铜电镀装置。 铜电镀装置包括：电镀液，其被配置为在其中保持电镀液; 含磷铜的可溶性阳极; 衬底保持器，其构造成保持衬底; 阳极袋围绕阳极，阳极袋由网状物形成; 配置为调节电场的调节板，所述调节板具有开口并且设置在所述阳极和由所述衬底保持器保持的所述衬底之间; 以及设置成对调节板的开口施加剂量的隔膜，所述隔膜被构造成允许金属离子渗透，并且不允许包含在电镀溶液中的添加剂渗透。