利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

5 条记录 (耗时 0.013 秒)

    PLATING APPARATUS, PLATING METHOD, AND SUBSTRATE HOLDER
    1.
    发明申请
    PLATING APPARATUS, PLATING METHOD, AND SUBSTRATE HOLDER 审中-公开

    公开(公告)号：US20190249326A1

    公开(公告)日：2019-08-15

    申请号：US16396384

    申请日：2019-04-26

    申请人： EBARA CORPORATION

    发明人： Junko MINE ,  Tsutomu NAKADA ,  Mitsutoshi YAHAGI

    IPC分类号： C25D17/06 ,  H01L23/00 ,  H01L21/687 ,  C25D17/00 ,  C25D21/12 ,  C25D5/18

    摘要： In-plane uniformity of a film that is plated on a polygonal substrate is enhanced. An anode holder configured to hold an anode, a substrate holder configured to hold a polygonal substrate, a plating bath for accommodating the anode holder and the substrate holder, and dipping the anode and the substrate in a plating solution, and a control device for controlling a current that flows between the anode and the substrate are included. The substrate holder has a plurality of power feeding members that are disposed along respective sides of the polygonal substrate. The control device is configured to be able to control the current so that currents of at least two different values are simultaneously supplied to the plurality of power feeding members.

    SUBSTRATE ELECTROLYTIC PROCESSING APPARATUS AND PADDLE FOR USE IN SUCH SUBSTRATE ELECTROLYTIC PROCESSING APPARATUS
    2.
    发明申请
    SUBSTRATE ELECTROLYTIC PROCESSING APPARATUS AND PADDLE FOR USE IN SUCH SUBSTRATE ELECTROLYTIC PROCESSING APPARATUS 有权
    基板电解处理设备和用于此类基板电解处理设备的平板

    公开(公告)号：US20150368825A1

    公开(公告)日：2015-12-24

    申请号：US14718829

    申请日：2015-05-21

    申请人： Ebara Corporation

    发明人： Junko MINE

    IPC分类号： C25D21/10

    CPC分类号： C25D21/10 ,  C25D17/00 ,  C25F3/02 ,  C25F7/00

    摘要： A substrate electrolytic processing apparatus capable of leveling an electric-field shielding rate with no need to increase its size is disclosed. The substrate electrolytic processing apparatus includes a processing bath for holding a processing solution, a substrate holder for holding a substrate and capable of locating the substrate in the processing bath, a counter electrode disposed in the processing bath and serving as an electrode opposite to the substrate, and a paddle disposed between the counter electrode and the substrate and configured to reciprocate parallel to a surface of the substrate so as to agitate the processing solution. The paddle includes agitation rods disposed in an inner region of the paddle and agitation rods disposed in an outer region of the paddle, and gaps between the agitation rods disposed in the outer region is smaller than gaps between the agitation rods disposed in the inner region.

    摘要翻译： 公开了一种能够使电场屏蔽率平坦化而不需要增加其尺寸的基板电解处理装置。 基板电解处理装置包括用于保持处理溶液的处理槽，用于保持基板并能够将基板定位在处理槽中的基板保持器，设置在处理槽中并用作与基板相对的电极的对置电极 以及设置在所述对电极和所述基板之间并且被配置为平行于所述基板的表面往复运动以便搅拌所述处理溶液的桨叶。 桨叶包括设置在桨叶的内部区域中的搅拌棒和设置在桨的外部区域中的搅拌棒，并且设置在外部区域中的搅拌棒之间的间隙小于设置在内部区域中的搅拌棒之间的间隙。

    PLATING APPARATUS, PLATING METHOD, AND SUBSTRATE HOLDER
    4.
    发明申请
    PLATING APPARATUS, PLATING METHOD, AND SUBSTRATE HOLDER 审中-公开
    镀层装置，镀层方法和基板支架

    公开(公告)号：US20170058423A1

    公开(公告)日：2017-03-02

    申请号：US15248248

    申请日：2016-08-26

    申请人： EBARA CORPORATION

    发明人： Junko MINE ,  Tsutomu NAKADA ,  Mitsutoshi YAHAGI

    IPC分类号： C25D17/00 ,  H01L23/00 ,  C25D17/06 ,  H01L21/687 ,  C25D7/12 ,  C25D5/18 ,  H01L21/288 ,  H01L21/768

    CPC分类号： C25D17/06 ,  C25D5/18 ,  C25D17/001 ,  C25D17/005 ,  C25D17/008 ,  C25D21/12 ,  H01L21/68785 ,  H01L24/11 ,  H01L2224/11462 ,  H01L2224/13147

    摘要： In-plane uniformity of a film that is plated on a polygonal substrate is enhanced. An anode holder configured to hold an anode, a substrate holder configured to hold a polygonal substrate, a plating bath for accommodating the anode holder and the substrate holder, and dipping the anode and the substrate in a plating solution, and a control device for controlling a current that flows between the anode and the substrate are included. The substrate holder has a plurality of power feeding members that are disposed along respective sides of the polygonal substrate. The control device is configured to be able to control the current so that currents of at least two different values are simultaneously supplied to the plurality of power feeding members.

    摘要翻译： 电镀在多边形基板上的膜的面内均匀性增强。 阳极保持器，其构造成保持阳极，衬底保持器构造成保持多边形衬底，用于容纳阳极保持器和衬底保持器的镀浴，以及将阳极和衬底浸入电镀溶液中;以及控制装置， 包括在阳极和衬底之间流动的电流。 基板保持器具有沿多边形基板的各侧设置的多个供电部件。 控制装置被配置为能够控制电流，使得至少两个不同值的电流同时被提供给多个供电部件。

    ELECTROLESS PLATING APPARATUS
    5.
    发明申请
    ELECTROLESS PLATING APPARATUS 审中-公开
    电镀镀膜设备

    公开(公告)号：US20160160352A1

    公开(公告)日：2016-06-09

    申请号：US15043425

    申请日：2016-02-12

    申请人： EBARA CORPORATION

    发明人： Hiroyuki KANDA ,  Junichiro TSUJINO ,  Junko MINE ,  Makoto KUBOTA ,  Tsutomu NAKADA ,  Kenichiro ARAI

    IPC分类号： C23C18/16

    CPC分类号： C23C18/163 ,  C23C18/1628 ,  C23C18/1632 ,  C23C18/1642 ,  C23C18/1651 ,  C23C18/1669 ,  C23C18/1675 ,  C23C18/168 ,  C23C18/1682 ,  C23C18/1683 ,  C23C18/32 ,  C23C18/54 ,  H01L21/76838 ,  H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/11464 ,  H01L2224/742 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/05552

    摘要： There is provided an electroless plating apparatus which, despite using a high-productivity batch processing method, can reduce the amount of a liquid chemical brought out of a processing tank, thereby reducing the cleaning time in a cleaning step, and can perform flushing easily and quickly. The electroless plating apparatus includes a pre-plating treatment module including a pre-plating treatment tank, a plating module, and an inter-module substrate transport device. The pre-plating treatment tank is provided with a pre-plating treatment solution circulation line having a temperature control function for a pre-plating treatment solution. The plating tank is provided with a plating solution circulation line having a filter and a temperature control function for a plating solution. The plating solution circulation line is connected to a flushing line for flushing the interior of the plating solution circulation line and the interior of the plating tank.

    摘要翻译： 提供了一种化学镀设备，尽管使用高生产率批量处理方法，但是可以减少从处理槽中排出的液体化学物质的量，从而减少清洁步骤中的清洁时间，并且可以容易地进行冲洗， 很快。 无电解电镀装置包括预镀处理模块，其包括预镀处理槽，镀覆模块和模块间基板输送装置。 预镀处理槽设置有预镀处理液循环管线，其具有用于预镀处理溶液的温度控制功能。 电镀槽具有电镀液循环管线，其具有用于电镀液的过滤器和温度控制功能。 电镀液循环管线连接到用于冲洗电镀液循环管线内部和镀槽内部的冲洗管线。