LOW POWER MICRO SEMICONDUCTOR GAS SENSOR AND METHOD OF MANUFACTURING THE SAME
    6.
    发明申请
    LOW POWER MICRO SEMICONDUCTOR GAS SENSOR AND METHOD OF MANUFACTURING THE SAME 审中-公开
    低功率微型半导体气体传感器及其制造方法

    公开(公告)号:US20150021716A1

    公开(公告)日:2015-01-22

    申请号:US14271808

    申请日:2014-05-07

    IPC分类号: G01N27/403 H01L21/283

    CPC分类号: G01N27/128

    摘要: Provided are a low power micro semiconductor gas sensor and a method of manufacturing the same. The micro semiconductor gas sensor includes a substrate having an air gap, a peripheral portion provided on the substrate and comprising electrode pads, a sensor portion comprising sensing electrodes connected from the electrode pads and a sensing film on the sensing electrodes and floating on the air gap, and a connection portion comprising conductive wires electrically connecting the electrode pads and the sensing electrodes to each other, and connecting the peripheral portion and the sensor portion to one another. In this case, the air gap penetrates the substrate, and a thermal isolation area extended from the air gap to a space between the peripheral portion and the sensor portion is provided.

    摘要翻译: 提供一种低功率微半导体气体传感器及其制造方法。 微型半导体气体传感器包括具有气隙的基板,设置在基板上并包括电极焊盘的周边部分,传感器部分包括从电极焊盘连接的感测电极和感测电极上的浮动在气隙上的感测膜 以及连接部分,其包括将电极焊盘和感测电极彼此电连接并将周边部分和传感器部分彼此连接的导线。 在这种情况下,气隙穿透基板,并且设置从气隙延伸到周边部分和传感器部分之间的空间的热隔离区域。

    APPARATUS FOR ANALYZING BIO-MATERIAL
    10.
    发明申请

    公开(公告)号:US20180088030A1

    公开(公告)日:2018-03-29

    申请号:US15686081

    申请日:2017-08-24

    IPC分类号: G01N21/27 G01N21/01

    摘要: Provided is an apparatus for analyzing a bio-material. According to an embodiment of the inventive concept, the apparatus may include a light distribution part having grooves, a reflective layer provided on the grooves, and a light emitting part configured to emit light to the light distribution part. The grooves may be recessed from a top surface of the light distribution part, and sidewalls of the grooves may be inclined with respect to the top surface of the light distribution part. The grooves may include a first groove and a second groove. A distance between the light emitting part and the second groove may be greater than that between the light emitting part and the first groove, and a bottom surface of the second groove may be disposed at a level lower than that of a bottom surface of the first groove.