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17 条记录 (耗时 0.017 秒)

    Thermally stable dual metal coated laminate products made from polyimide film
    7.
    发明授权
    Thermally stable dual metal coated laminate products made from polyimide film 失效
    由聚酰亚胺膜制成的耐热稳定双金属涂层叠层产品

    公开(公告)号：US4992144A

    公开(公告)日：1991-02-12

    申请号：US413309

    申请日：1989-09-27

    申请人： Daniel P. Walsh ,  Philip D. Knudsen

    发明人： Daniel P. Walsh ,  Philip D. Knudsen

    IPC分类号： C23C18/22 ,  H05K3/02 ,  H05K3/18 ,  H05K3/38

    CPC分类号： H05K3/381 ,  C23C18/22 ,  H05K3/181 ,  H05K3/38 ,  H05K2201/0154 ,  H05K2201/0344 ,  H05K2203/122 ,  H05K3/022

    摘要： Both surfaces of a polyimide sheet are coated with a layer of electroless nickel or cobalt and can also be coated with a thin electroless copper layer on the Ni. or Co. This tenaciously bonded coating is subsequently treated in such a way so as to increase its permeability or porosity without substantially altering its resistive properties. The induced porosity allows water and other volatiles trapped in the dielectric polyimide sheet to be removed while the preserved electrical continuity of the metal layer is sufficient to support electrolytic copper plating which serves the dual purpose of providing a copper thickness useful for the subsequent production of electronic circuitry and preventing the readsorption of water into the dielectric core by permanently sealing or coating the porous metal layer.

    摘要翻译： 聚酰亚胺薄片的两个表面涂覆有一层无电镍或钴，并且还可以在Ni上涂覆薄的无电镀铜层。 或Co.这种顽固粘合的涂层随后以这样的方式进行处理，以增加其渗透性或孔隙率，而基本上不改变其电阻性质。 诱导的孔隙率允许除去电介质聚酰亚胺片中捕获的水和其它挥发物，同时金属层的保持的电连续性足以支持电解铜电镀，其用于提供用于随后生产电子的铜厚度的双重目的 电路并且通过永久地密封或涂覆多孔金属层来防止水再次吸收到介质芯中。

    Coating composition
    9.
    发明授权
    Coating composition 失效
    涂料组成

    公开(公告)号：US5076841A

    公开(公告)日：1991-12-31

    申请号：US531440

    申请日：1990-05-31

    申请人： Jensheng Chen ,  Philip D. Knudsen

    发明人： Jensheng Chen ,  Philip D. Knudsen

    IPC分类号： C23C18/30 ,  H05K3/18 ,  H05K3/38

    CPC分类号： C23C18/30 ,  H05K3/181 ,  H05K3/387

    摘要： The invention discloses a new electroless plating catalyst and a process of using the same for selective plating. The catalyst and process are especially adapted for formation of EMI shielding for electronic components. The electroless plating catalyst comprises particulates dispersed in a liquid film forming composition which particulates are coated with a hydrous oxide that is reduced to a catalytic metal in contact with an electroless plating solution.

    摘要翻译： 本发明公开了一种新的化学镀催化剂及其选择性镀覆方法。 催化剂和工艺特别适用于形成电子部件的EMI屏蔽。 化学镀催化剂包含分散在液体成膜组合物中的颗粒，其中微粒被氧化还原成与化学镀溶液接触的催化金属。

    Thermally stable dual metal coated laminate products made from textured polyimide film
    10.
    发明授权
    Thermally stable dual metal coated laminate products made from textured polyimide film 失效
    耐热稳定的双金属涂层层压制品由纹理聚酰亚胺薄膜制成

    公开(公告)号：US4894124A

    公开(公告)日：1990-01-16

    申请号：US268246

    申请日：1988-10-31

    申请人： Daniel P. Walsh ,  Philip D. Knudsen

    发明人： Daniel P. Walsh ,  Philip D. Knudsen

    IPC分类号： C23C18/22 ,  C25D5/56 ,  H05K1/03 ,  H05K3/38

    CPC分类号： H05K3/38 ,  C23C18/22 ,  C25D5/56 ,  H05K1/0346 ,  H05K2203/122 ,  Y10S205/926

    摘要： Both surfaces of a uniformly and completely textured polyimide sheet are coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The copper and nickel or cobalt layers are strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion, as well as a modification of IPC test 2.4.9 method E for resistance to thermal cycling.

    摘要翻译： 均匀且完全织构化的聚酰亚胺片的两个表面涂覆有一层无电镍或钴，以及随后的电解铜层，产生用于生产电子电路的无粘合层压板。 铜和镍或钴层牢固地结合到织构化的聚酰亚胺片材上，以达到层压板超过粘结强度要求的程度，如通过目前的初始和后期互连与封装电子电路研究所（IPC）的标准剥离强度试验测量的。 焊料浮渣粘附，以及IPC测试2.4.9方法E对耐热循环的修改。