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公开(公告)号：US06824665B2
公开(公告)日：2004-11-30
申请号：US09978797
申请日：2001-10-17
IPC分类号： C23C2802
CPC分类号： H01L21/76868 , C23C18/1671 , C23C18/38 , C23C18/405 , H01L21/288 , H01L21/2885 , H01L21/76843 , H01L21/76874 , H01L2221/1089 , H05K3/181 , H05K3/388 , H05K3/422 , Y10S205/916
摘要： Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.
摘要翻译： 公开了在具有导电层的基板上沉积铜籽晶层的方法。 这种方法特别适用于在具有小孔径的基底上沉积铜籽晶层，并且优选地非常小的孔。
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公开(公告)号：US06804881B1
公开(公告)日：2004-10-19
申请号：US09569767
申请日：2000-05-12
IPC分类号： H05K336
CPC分类号： C25D5/54 , C25D5/022 , H05K3/0023 , H05K3/0032 , H05K3/107 , H05K3/205 , H05K3/3473 , H05K3/465 , H05K2201/0376 , H05K2203/1407 , Y10T29/49126 , Y10T29/49149 , Y10T29/49155
摘要： A method for manufacture of a multilayer board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.
摘要翻译： 一种用于制造多层板的方法和由该方法形成的板。 该方法包括依次选择性地镀金属加强件，焊接垫，信号线和互连。 所得板最好不含玻璃纤维增强层。
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公开(公告)号：US06759596B1
公开(公告)日：2004-07-06
申请号：US09569553
申请日：2000-05-12
IPC分类号： H05K103
CPC分类号： H05K1/0271 , H05K3/205 , H05K3/421 , H05K3/465 , H05K3/4682 , H05K2201/09781 , H05K2201/2009 , H05K2203/0152 , H05K2203/0733 , Y10T29/4913 , Y10T29/49156
摘要： The invention provides multilayer circuit boards and methods for formation of a sequential build circuit board. Among other things, glass fiber reinforced copper clad epoxy substrates, required to provide strength or rigidity to prior boards, are not required for preferred circuit boards of the invention. Preferred methods of the invention include applying a dielectric coating onto a support; forming recesses in the dielectric coating that define openings including opening for at least one reinforcing member; depositing copper metal into the recesses to form a first layer; applying a second dielectric coating onto the first circuit layer; forming recesses in the second dielectric coating that define openings including openings for at least one reinforcing member in registration with the one or more reinforcing members in the first layer; depositing metal into the recesses in the dielectric coating to form the second layer; and repeating the process to form sequential build board having the desired number of layers.
摘要翻译： 本发明提供了用于形成顺序构建电路板的多层电路板和方法。 除了其它方面，对于本发明的优选电路板，不需要为现有板提供强度或刚性所需的玻璃纤维增强铜包覆环氧树脂基板。 本发明的优选方法包括将介电涂层施加到载体上; 在所述电介质涂层中形成限定开口的凹部，所述开口包括用于至少一个加强构件的开口; 将铜金属沉积到所述凹部中以形成第一层; 将第二电介质涂层施加到所述第一电路层上; 在所述第二电介质涂层中形成限定开口的凹部，所述开口包括用于与所述第一层中的所述一个或多个加强构件对准的至少一个加强构件的开口; 将金属沉积到介电涂层中的凹槽中以形成第二层; 并重复该过程以形成具有所需数量层的顺序构建板。
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公开(公告)号：US20010006759A1
公开(公告)日：2001-07-05
申请号：US09149318
申请日：1998-09-08
IPC分类号： G03F007/027 , G03F007/028 , G03F007/033 , G03F007/038 , G03F007/09 , G03F007/30 , G03F007/40 , C08J003/24 , B32B025/16 , B32B027/16
CPC分类号： H01L23/5329 , C09D163/08 , G03F7/0045 , G03F7/038 , H01L23/49894 , H01L2924/0002 , H05K3/287 , C08L2666/02 , H01L2924/00
摘要： Radiation sensitive compositions, processes for using the compositions, and articles of manufacture comprising the compositions. The compositions of the invention are use to form flexible coatings having a dielectric constant of 3 or less. The compositions comprise a resin binder and a polybutadiene that comprises one or more internal epoxide groups. In preferred aspect of the invention, the compositions of the invention further comprise a crosslinking agent capable of solvating the remaining constituents of the composition. The coatings are used for the manufacture of electronic and other devices.
摘要翻译： 辐射敏感组合物，使用组合物的方法和包含该组合物的制品。 本发明的组合物用于形成介电常数为3或更小的柔性涂层。 组合物包含树脂粘合剂和包含一个或多个内部环氧基团的聚丁二烯。 在本发明的优选方面，本发明的组合物还包含能够溶解组合物的剩余组分的交联剂。 涂层用于制造电子和其他设备。
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公开(公告)号：US5691395A
公开(公告)日：1997-11-25
申请号：US274099
申请日：1994-07-12
IPC分类号： C08G59/68 , C08G59/00 , C09D163/00 , C09D163/08 , G03F7/004 , G03F7/027 , G03F7/038 , H05K3/18 , H05K3/28 , B32B3/10 , C08F2/50 , C08J7/04
CPC分类号： G03F7/038 , G03F7/0045 , H05K3/287 , Y02P20/582 , Y10T428/24917
摘要： Radiation sensitive compositions, processes for using the compositions, and articles of manufacture comprising the compositions. The photoimageable compositions of the invention comprises a radiation sensitive component, a resin binder and a polybutadiene that comprises one or more internal epoxide groups. In preferred aspects, the compositions of the invention further comprise a crosslinking agent such as a melamine or an epoxidized material, or mixtures thereof.
摘要翻译： 辐射敏感组合物，使用组合物的方法和包含该组合物的制品。 本发明的可光成像组合物包含辐射敏感组分，树脂粘合剂和包含一个或多个内部环氧基团的聚丁二烯。 在优选的方面，本发明的组合物还包含交联剂如三聚氰胺或环氧化物质，或其混合物。
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公开(公告)号：US5563011A
公开(公告)日：1996-10-08
申请号：US50847
申请日：1993-04-21
申请人： Charles R. Shipley
发明人： Charles R. Shipley
CPC分类号： G03F7/0007 , G02B5/201 , G03F7/0045 , G02F2001/133519
摘要： A color filter assembly comprising a topcoat layer which comprises a composition, wherein the composition in general comprises a crosslinking agent and a reactive resin binder, i.e., a resin that can undergo self-condensation and/or crosslinking with one or more other components of the composition upon thermal treatment or other activation. Preferred resin binders include those resins that contain pendant polar functional groups, particularly acidic moieties such as carboxyl (COOH) and/or hydroxyl (OH). Acrylic resins containing such groups are particularly preferred. Compositions of the invention exhibit low thickness loss and have exceptional light transmission properties. Compositions of the invention are also useful as carriers for pigments and dyes for forming color filter elements.
摘要翻译： 一种滤色器组件，其包括包含组合物的面漆层，其中所述组合物通常包含交联剂和反应性树脂粘合剂，即可以与所述组合物的一种或多种其它组分进行自缩合和/或交联的树脂 组合物经热处理或其它活化。 优选的树脂粘合剂包括那些含有极性官能团的树脂，特别是酸性部分如羧基（COOH）和/或羟基（OH）。 含有这些基团的丙烯酸树脂是特别优选的。 本发明的组合物表现出低的厚度损失并具有优异的透光性。 本发明的组合物还可用作用于形成滤色器元件的颜料和染料的载体。
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公开(公告)号：US5334488A
公开(公告)日：1994-08-02
申请号：US59912
申请日：1993-05-10
CPC分类号： H05K3/205 , H05K3/465 , H05K3/4661 , H05K3/4682 , H05K2201/09563 , H05K2203/0565 , H05K2203/1407 , H05K3/0023 , H05K3/184
摘要： The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and imaging of dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using imaging techniques.
摘要翻译： 本发明用于形成多层电路板，其中使用选择性电镀技术顺序地形成层，并且对介电材料进行成像以实现细线分辨率和电路之间的互连。 本发明允许使用成像技术顺序地形成更高密度的多层。
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公开(公告)号：US5262280A
公开(公告)日：1993-11-16
申请号：US862343
申请日：1992-04-02
IPC分类号： C08G59/68 , C08G59/00 , C09D163/00 , C09D163/08 , G03F7/004 , G03F7/027 , G03F7/038 , H05K3/18 , H05K3/28 , G03C1/73 , G03C5/16
CPC分类号： G03F7/038 , G03F7/0045 , H05K3/287 , Y02P20/582 , Y10T428/24917
摘要： Radiation sensitive compositions, processes for using the compositions, and articles of manufacture comprising the compositions. The photoimageable compositions of the invention comprises a radiation sensitive component, a resin binder and a polybutadiene that comprises one or more internal epoxide groups. In preferred aspects, the compositions of the invention further comprise a crosslinking agent such as a melamine or an epoxidized material, or mixtures thereof.
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公开(公告)号：US5246817A
公开(公告)日：1993-09-21
申请号：US462607
申请日：1990-01-09
CPC分类号： H05K3/465 , H05K3/205 , H05K3/4661 , H05K2201/09563 , H05K2203/0565 , H05K2203/1407 , H05K3/0023 , H05K3/184
摘要： The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and imaging of dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using imaging techniques.
摘要翻译： 本发明用于形成多层电路板，其中使用选择性电镀技术顺序地形成层，并且对介电材料进行成像以实现细线分辨率和电路之间的互连。 本发明允许使用成像技术顺序地形成更高密度的多层。
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公开(公告)号：US4902610A
公开(公告)日：1990-02-20
申请号：US54102
申请日：1987-05-20
申请人： Charles R. Shipley
发明人： Charles R. Shipley
CPC分类号： H05K3/465 , H05K3/205 , H05K3/4661 , H05K3/4682 , H05K2201/09563 , H05K2203/0565 , H05K2203/1407 , H05K3/0023 , H05K3/184
摘要： The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and photoimaging of permanent dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using photoimaging techniques.
摘要翻译： 本发明用于形成多层电路板，其中使用选择性电镀技术顺序形成层，并且通过永久介电材料的光成像来实现细线分辨率和电路之间的互连。 本发明允许使用光成像技术顺序形成更高密度的多层。
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