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公开(公告)号:US20050247755A1
公开(公告)日:2005-11-10
申请号:US10900161
申请日:2004-07-27
申请人: Edward Laurent , Dan Mironescu
发明人: Edward Laurent , Dan Mironescu
CPC分类号: G01R1/06705 , G01R1/06711
摘要: A tool for attaching fine preformed probes to a substrate for use with a vacuum source is disclosed. The apparatus comprises a body portion; a tip portion disposed at one end of the body portion; a first orifice extending from a first end of the body portion to the working tip; and at least one second orifice extending from an outer portion of the working tip and communicating with the first orifice, wherein the vacuum source is coupled to the body portion so that a vacuum generated by the vacuum source is provided to the at least one second orifice.
摘要翻译: 公开了一种用于将精细预成型探针附着到用于真空源的基底上的工具。 该装置包括主体部分; 设置在所述主体部的一端的前端部; 从主体部分的第一端延伸到工作尖端的第一孔; 以及从所述工作尖端的外部部分延伸并与所述第一孔口连通的至少一个第二孔口,其中所述真空源联接到所述主体部分,使得由所述真空源产生的真空设置在所述至少一个第二孔口 。
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公开(公告)号:US07479794B2
公开(公告)日:2009-01-20
申请号:US11712797
申请日:2007-02-28
申请人: Dov Chartarifsky , Avi Pollak , Dan Mironescu
发明人: Dov Chartarifsky , Avi Pollak , Dan Mironescu
IPC分类号: G01R31/02
CPC分类号: G01R1/07342 , G01R1/06722 , G01R3/00 , Y10T29/49117
摘要: A method and apparatus for constructing a probe card assembly is provided. A probe pin is inserted into an aperture of an inverted socket enclosure to cause a probe pin shoulder of the probe pin to make contact with an aperture shoulder of the aperture. An upper end of the probe pin protrudes from the aperture after the probe pin shoulder makes contact with the aperture shoulder. A compressible member is inserted into the aperture to position an upper end of the compressible member to make contact with a lower portion of the probe pin. A substrate is aligned over the inverted socket enclosure so that the lower end of the compressible member is in contact with a substrate contact located on the substrate. The substrate is affixed in a non-permanent manner to the inverted socket enclosure.
摘要翻译: 提供一种用于构造探针卡组件的方法和装置。 探头针插入反向插座外壳的孔中,使探针的探针针脚与孔的孔肩接触。 在探头针肩与孔肩接触后,探针的上端从孔径突出。 将可压缩构件插入到孔中以定位可压缩构件的上端以与探针的下部接触。 衬底在倒置的插座外壳上对准,使得可压缩构件的下端与位于衬底上的衬底触点接触。 基板以非永久性方式固定在倒置的插座外壳上。
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公开(公告)号:US20050121494A1
公开(公告)日:2005-06-09
申请号:US11037431
申请日:2005-01-18
申请人: Gil Perlberg , Arie Bahalul , Dan Mironescu , Moshe Amsalem , Jon Brunner
发明人: Gil Perlberg , Arie Bahalul , Dan Mironescu , Moshe Amsalem , Jon Brunner
IPC分类号: H01L21/60 , B23K20/00 , B23K31/02 , H01L21/603
CPC分类号: H01L24/85 , B23K20/004 , B23K20/007 , B23K2101/32 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48451 , H01L2224/78302 , H01L2224/85201 , H01L2224/85205 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/04953 , H01L2924/14 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/20751 , H01L2924/20752 , H01L2924/00015
摘要: A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes an annular chamfer formed at an inner portion of the end of the working tip, the inner annular chamfer having an angle of less than about 60 degrees. The inner annular chamfer is coupled to a lower portion of a cylindrical passage formed in the bonding tool.
摘要翻译: 公开了一种用于将细线接合到具有非常细间距的接合焊盘的接合工具。 接合工具在其末端包括工作尖端。 工作尖端包括形成在工作尖端的端部的内部的环形倒角,内环形倒角具有小于约60度的角度。 内环形倒角联接到形成在接合工具中的圆柱形通道的下部。
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公开(公告)号:US20080258746A1
公开(公告)日:2008-10-23
申请号:US11885107
申请日:2006-02-16
IPC分类号: G01R1/073
CPC分类号: G01R1/06716 , G01R1/0675 , G01R1/07357
摘要: A probe configured for use in the testing of integrated circuits includes a first end portion terminating in a foot (42), the foot defining a substantially flat surface configured to be connected to a substrate (400), a second end portion terminating in a tip (50), the tip being configured to contact an integrated circuit during testing of the integrated circuit, and a curved body portion (56) extending between the first end portion and the second end portion.
摘要翻译: 构造成用于集成电路测试的探针包括终止于脚部(42)的第一端部部分,所述脚部限定基本上平坦的表面,所述基本上平坦的表面被配置为连接到基底(400),第二端部终止于尖端 (50),所述尖端构造成在所述集成电路的测试期间与集成电路接触,以及在所述第一端部和所述第二端部之间延伸的弯曲主体部分(56)。
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公开(公告)号:US07311239B2
公开(公告)日:2007-12-25
申请号:US10900161
申请日:2004-07-27
申请人: Edward T. Laurent , Dan Mironescu
发明人: Edward T. Laurent , Dan Mironescu
IPC分类号: B23K37/00
CPC分类号: G01R1/06705 , G01R1/06711
摘要: A tool for attaching fine preformed probes to a substrate for use with a vacuum source is disclosed. The apparatus comprises a body portion; a tip portion disposed at one end of the body portion; a first orifice extending from a first end of the body portion to the working tip; and at least one second orifice extending from an outer portion of the working tip and communicating with the first orifice, wherein the vacuum source is coupled to the body portion so that a vacuum generated by the vacuum source is provided to the at least one second orifice.
摘要翻译: 公开了一种用于将精细预成型探针附着到用于真空源的基底上的工具。 该装置包括主体部分; 设置在所述主体部的一端的前端部; 从主体部分的第一端延伸到工作尖端的第一孔; 以及从所述工作尖端的外部部分延伸并与所述第一孔口连通的至少一个第二孔口,其中所述真空源联接到所述主体部分,使得由所述真空源产生的真空设置在所述至少一个第二孔口 。
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公开(公告)号:US20050121493A1
公开(公告)日:2005-06-09
申请号:US11004772
申请日:2004-12-03
申请人: Dan Mironescu , Ziv Atzmon , Gil Perlberg
发明人: Dan Mironescu , Ziv Atzmon , Gil Perlberg
CPC分类号: H01L24/85 , B23K20/007 , B23K2101/40 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48463 , H01L2224/78268 , H01L2224/78302 , H01L2224/85045 , H01L2224/85205 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/0106 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/04953 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00015
摘要: A bonding tool for bonding a wire to a substrate. The bonding tool has a cylindrical body portion formed from a first material and a conical tip portion separately formed from a second material. The conical tip portion is coupled to one end of the body portion.
摘要翻译: 用于将导线接合到基板的接合工具。 接合工具具有由第一材料形成的圆柱形主体部分和由第二材料分开形成的锥形尖端部分。 锥形尖端部分连接到主体部分的一端。
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公开(公告)号:US20080204061A1
公开(公告)日:2008-08-28
申请号:US11712797
申请日:2007-02-28
申请人: Dov Chartarifsky , Avi Pollak , Dan Mironescu
发明人: Dov Chartarifsky , Avi Pollak , Dan Mironescu
CPC分类号: G01R1/07342 , G01R1/06722 , G01R3/00 , Y10T29/49117
摘要: A method and apparatus for constructing a probe card assembly is provided. A probe pin is inserted into an aperture of an inverted socket enclosure to cause a probe pin shoulder of the probe pin to make contact with an aperture shoulder of the aperture. An upper end of the probe pin protrudes from the aperture after the probe pin shoulder makes contact with the aperture shoulder. A compressible member is inserted into the aperture to position an upper end of the compressible member to make contact with a lower portion of the probe pin. A substrate is aligned over the inverted socket enclosure so that the lower end of the compressible member is in contact with a substrate contact located on the substrate. The substrate is affixed in a non-permanent manner to the inverted socket enclosure.
摘要翻译: 提供一种用于构造探针卡组件的方法和装置。 探头针插入反向插座外壳的孔中,使探针的探针针脚与孔的孔肩接触。 在探头针肩与孔肩接触后,探针的上端从孔径突出。 将可压缩构件插入到孔中以定位可压缩构件的上端以与探针的下部接触。 衬底在倒置的插座外壳上对准,使得可压缩构件的下端与位于衬底上的衬底触点接触。 基板以非永久性方式固定在倒置的插座外壳上。
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公开(公告)号:US07249702B2
公开(公告)日:2007-07-31
申请号:US11004772
申请日:2004-12-03
申请人: Dan Mironescu , Ziv Atzmon , Gil Perlberg
发明人: Dan Mironescu , Ziv Atzmon , Gil Perlberg
CPC分类号: H01L24/85 , B23K20/007 , B23K2101/40 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48463 , H01L2224/78268 , H01L2224/78302 , H01L2224/85045 , H01L2224/85205 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/0106 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/04953 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00015
摘要: A bonding tool for bonding a wire to a substrate. The bonding tool has a cylindrical body portion formed from a first material and a conical tip portion separately formed from a second material. The conical tip portion is coupled to one end of the body portion.
摘要翻译: 用于将导线接合到基板的接合工具。 接合工具具有由第一材料形成的圆柱形主体部分和由第二材料分开形成的锥形尖端部分。 锥形尖端部分连接到主体部分的一端。
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公开(公告)号:US07004369B2
公开(公告)日:2006-02-28
申请号:US11037431
申请日:2005-01-18
申请人: Gil Perlberg , Arie Bahalul , Dan Mironescu , Moshe Amsalem , Jon Brunner
发明人: Gil Perlberg , Arie Bahalul , Dan Mironescu , Moshe Amsalem , Jon Brunner
CPC分类号: H01L24/85 , B23K20/004 , B23K20/007 , B23K2101/32 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48451 , H01L2224/78302 , H01L2224/85201 , H01L2224/85205 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/04953 , H01L2924/14 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/20751 , H01L2924/20752 , H01L2924/00015
摘要: A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes an annular chamfer formed at an inner portion of the end of the working tip, the inner annular chamfer having an angle of less than about 60 degrees. The inner annular chamfer is coupled to a lower portion of a cylindrical passage formed in the bonding tool.
摘要翻译: 公开了一种用于将细线接合到具有非常细间距的接合焊盘的接合工具。 接合工具在其末端包括工作尖端。 工作尖端包括形成在工作尖端的端部的内部的环形倒角,内环形倒角具有小于约60度的角度。 内环形倒角联接到形成在接合工具中的圆柱形通道的下部。
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公开(公告)号:US07808260B2
公开(公告)日:2010-10-05
申请号:US11885107
申请日:2006-02-16
IPC分类号: G01R31/02
CPC分类号: G01R1/06716 , G01R1/0675 , G01R1/07357
摘要: A probe configured for use in the testing of integrated circuits includes a first end portion terminating in a foot (42), the foot defining a substantially flat surface configured to be connected to a substrate (400), a second end portion terminating in a tip (50), the tip being configured to contact an integrated circuit during testing of the integrated circuit, and a curved body portion (56) extending between the first end portion and the second end portion.
摘要翻译: 构造成用于集成电路测试的探针包括终止于脚部(42)的第一端部部分,所述脚部限定基本上平坦的表面,所述基本上平坦的表面被配置为连接到基底(400),第二端部终止于尖端 (50),所述尖端构造成在所述集成电路的测试期间与集成电路接触,以及在所述第一端部和所述第二端部之间延伸的弯曲主体部分(56)。
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