Sputtering apparatus for forming thin films
    1.
    发明授权
    Sputtering apparatus for forming thin films 失效
    用于形成薄膜的溅射装置

    公开(公告)号:US5085755A

    公开(公告)日:1992-02-04

    申请号:US450461

    申请日:1989-12-14

    CPC分类号: H01J37/3402 C23C14/35

    摘要: An apparatus for forming a thin film of a given material on one or more substrates comprises a vacuum vessel, a first electrode which is provided in the vacuum vessel for holding a target plate of the given material thereon, a second electrode which is provided opposite to the first electrode in the vacuum vessel to form a discharge space between the first and second electrodes and holds the substrate(s) thereon, a gas conduit for supplying a sputtering gas into the discharge space, power sources for applying a discharge voltage between the first and second electrodes to generate a discharge plasma of the sputtering gas, and a magnetic field generating device which is provided to surround the discharge space and generates a magnetic field effective to prevent the discharge plasma from diffusing to the outside of the discharge space.

    摘要翻译: 用于在一个或多个基底上形成给定材料的薄膜的装置包括真空容器,设置在真空容器中用于保持给定材料的靶板的第一电极,与第一电极相对设置的第二电极 所述真空容器中的第一电极在所述第一和第二电极之间形成放电空间并保持其上的衬底,用于将溅射气体供应到放电空间中的气体导管,用于在第一和第二电极之间施加放电电压的电源 以及用于产生溅射气体的放电等离子体的第二电极,以及设置成围绕放电空间产生有效地防止放电等离子体扩散到放电空间外部的磁场的磁场产生装置。

    Film forming system using high frequency power and power supply unit for
the same
    2.
    发明授权
    Film forming system using high frequency power and power supply unit for the same 失效
    使用高频电源的成膜系统和相同的电源单元

    公开(公告)号:US5116482A

    公开(公告)日:1992-05-26

    申请号:US587034

    申请日:1990-09-24

    摘要: A film forming system including an evacuating unit, a pair of opposed electrodes and an RF voltage supplying unit for suppling RF voltages to the respective electrodes to generate a discharge between the electrodes to form a film. The film forming system includes: a discharge variation detecting unit for detecting an amount of a variation in the discharge as a voltage from each of the electrodes; and a phase adjusting unit for detecting the difference in phase between the RF voltages supplied to the electrodes, and for adjusting the phase difference of the RF voltages supplied to the electrodes, according to the difference between the detected phase difference and a preset value.

    摘要翻译: 一种成膜系统,包括排气单元,一对相对电极和RF电压供应单元,用于向各个电极提供RF电压以在电极之间产生放电以形成膜。 成膜系统包括:放电变化检测单元,用于检测作为每个电极的电压的放电变化量; 以及相位调整单元,用于根据所检测的相位差和预设值之间的差异,检测供给到电极的RF电压之间的相位差,并且用于调整提供给电极的RF电压的相位差。

    Magnetron sputter apparatus and method for forming films by using the
same apparatus
    3.
    发明授权
    Magnetron sputter apparatus and method for forming films by using the same apparatus 失效
    磁控溅射装置和使用相同装置形成薄膜的方法

    公开(公告)号:US4865709A

    公开(公告)日:1989-09-12

    申请号:US207537

    申请日:1988-06-16

    IPC分类号: C23C14/35 H01J37/34

    摘要: A magnetron sputter apparatus according to the present invention is constructed so as to satisfy a predetermined optimum relationship between the size of the erosion area on the surface of the target and that of a film forming region. Further, the distance between the target and substrates has a value predetermined for the relationship between the size of the erosion area on the surface of the target and that of the film forming region. By using the magnetron sputter apparatus according to the present invention it is possible to form a homogeneous thin film excellent in step coverage and having a film thickness distribution in which variations are small over a large area.

    摘要翻译: 根据本发明的磁控溅射装置被构造成满足目标表面上的侵蚀区域的大小与成膜区域的预定最佳关系。 此外,靶和基板之间的距离具有对于靶的表面上的侵蚀区域的尺寸与成膜区域的尺寸之间的关系预定的值。 通过使用根据本发明的磁控溅射装置,可以形成具有优异的台阶覆盖率并且具有在大面积上变化小的膜厚度分布的均匀薄膜。

    Thin film deposition system
    4.
    发明授权
    Thin film deposition system 失效
    薄膜沉积系统

    公开(公告)号:US4986890A

    公开(公告)日:1991-01-22

    申请号:US513763

    申请日:1990-04-24

    摘要: A thin film deposition system for depositing a thin film on a substrate by sputtering is characterized in that a substrate holder for holding thereon the substrate is transferred by a transfer mechanism from or to a film deposition position to or from another position such as another chamber different from the film deposition chamber, an electrode for applying bias voltage of radio frequency to the substrate or substrate holder is axially movable relatively to the substrate holder so that the electrode can be contacted with or discontact from the substrate holder, and a grounded shield is provided so as to cover the electrode and the substrate holder with a gap thereby shielding radio frequency from the electrode and the substrate holder to prevent formation of glow discharge between a wall of the vacuum chamber and the electrode or the substrate holder.

    摘要翻译: 用于通过溅射在衬底上沉积薄膜的薄膜沉积系统的特征在于,用于保持其上的衬底的衬底保持器通过转移机构从或从膜沉积位置转移到另一个位置,例如另一个室 从成膜室,用于向衬底或衬底保持器施加射频偏压的电极可相对于衬底保持器轴向移动,使得电极可与衬底保持器接触或脱离,并且提供接地屏蔽 以便以间隙覆盖电极和衬底保持器,从而屏蔽来自电极和衬底保持器的射频,以防止在真空室的壁与电极或衬底保持器之间形成辉光放电。

    Sputtering apparatus for production of thin films of magnetic materials
    5.
    发明授权
    Sputtering apparatus for production of thin films of magnetic materials 失效
    用于生产磁性材料薄膜的溅射装置

    公开(公告)号:US4911815A

    公开(公告)日:1990-03-27

    申请号:US281777

    申请日:1988-12-09

    摘要: A magnetic film deposition chamber having Helmholtz coils and a preliminary chamber are connected through a gate valve. Two magnetic plates are fixed to the magnetic film deposition chamber near the both ends thereof. Substrates overlying apertures of a substrate holder are moved by a conveyer together with the substrate holder. The conveyor moves from the preliminary chamber to the film deposition chamber through the gate valve. The substrates then positioned over and between the magnetic plates and are located above the target in the magnetic film deposition chamber.

    摘要翻译: 具有亥姆霍兹线圈和初级室的磁性成膜室通过闸阀连接。 两个磁性板固定在磁性膜沉积室的两端附近。 覆盖衬底保持器的孔的衬底通过输送机与衬底保持器一起移动。 输送机通过闸阀从预备室移动到成膜室。 然后将基板放置在磁性板之间并位于磁性板之间并且位于磁性膜沉积室中的靶上方。

    Sputtering apparatus, device for exchanging target and method for the
same
    7.
    发明授权
    Sputtering apparatus, device for exchanging target and method for the same 失效
    溅射装置,用于交换目标的装置及其方法

    公开(公告)号:US5429729A

    公开(公告)日:1995-07-04

    申请号:US616868

    申请日:1990-11-21

    IPC分类号: C23C14/34 C23C14/56

    CPC分类号: C23C14/3407 C23C14/56

    摘要: In accordance with the present invention, in order to exchange a target under a vacuum condition without communicating a film-forming chamber with the atmosphere for exchange of the target, a substrate is located in a vacuum vessel and an opening portion is provided on a wall surface of the vacuum vessel opposite to the substrate which is formed with a thin film on its surface. A target exchanging chamber is disposed adjacent to the vacuum vessel so as to be communicated therewith through the opening portion. During film-formation, the interior of the vacuum vessel is maintained in a vacuum state by closing the opening portion with the target while the target exchanging chamber is communicated with the atmosphere and a spare target is contained therein. When exchanging the target, the air in the target exchanging chamber is exhausted to maintain the chamber in a vacuum state and the target is replaced with the spare target.

    摘要翻译: 根据本发明,为了在真空条件下更换靶,而不使成膜室与用于更换靶的气氛相通,则基板位于真空容器中,开口部分设置在壁上 表面与在其表面上形成有薄膜的基板相对的真空容器的表面。 目标交换室邻近真空容器设置,以便通过开口部与其连通。 在成膜期间,通过在目标交换室与大气连通并且备用目标物被容纳在其中的同时通过用目标物关闭开口部分将真空容器的内部保持在真空状态。 当更换目标时,目标交换室中的空气被排出以将室维持在真空状态,并且目标被替换为备用目标。