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公开(公告)号：US20080142930A1
公开(公告)日：2008-06-19
申请号：US12035047
申请日：2008-02-21
申请人： Eric Connor , James P. Godschalx , Craig J. Hawker , James L. Hedrick , Victor Yee-Way Lee , Teddie P. Magbitang , Robert D. Miller , Q. Jason Niu , Willi Volksen
发明人： Eric Connor , James P. Godschalx , Craig J. Hawker , James L. Hedrick , Victor Yee-Way Lee , Teddie P. Magbitang , Robert D. Miller , Q. Jason Niu , Willi Volksen
CPC分类号： H01L21/02203 , B29C67/202 , C08J9/0014 , C08J9/26 , C08J2201/046 , C08J2365/00 , H01L21/02118 , H01L21/312 , H01L21/31695
摘要： A low-k organic dielectric material having stable nano-sized porous is provided as well as a method of fabricating the same. The porous low-k organic dielectric material is made from a composition of matter having a vitrification temperature (Tv-comp) which includes a b-staged thermosetting resin having a vitrification temperate (Tv-resin), a pore generating material, and a reactive additive. The reactive additive lowers Tv-comp below Tv-resin.
摘要翻译： 提供了具有稳定的纳米尺寸多孔的低k有机介电材料及其制造方法。 多孔低k有机介电材料由具有玻璃化温度（Tv-comp）的物质组合物制成，其包括具有玻璃化温度（Tv-树脂），孔产生材料和反应性的B阶热固性树脂 添加剂。 反应性添加剂降低Tv-resin以下的Tv-comp。
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公开(公告)号：US07368483B2
公开(公告)日：2008-05-06
申请号：US10827694
申请日：2004-04-19
申请人： Eric Connor , James P. Godschalx , Craig J. Hawker , James L. Hedrick , Victor Yee-Way Lee , Teddie P. Magbitang , Robert D. Miller , Q. Jason Niu , Willi Volksen
发明人： Eric Connor , James P. Godschalx , Craig J. Hawker , James L. Hedrick , Victor Yee-Way Lee , Teddie P. Magbitang , Robert D. Miller , Q. Jason Niu , Willi Volksen
CPC分类号： H01L21/02203 , B29C67/202 , C08J9/0014 , C08J9/26 , C08J2201/046 , C08J2365/00 , H01L21/02118 , H01L21/312 , H01L21/31695
摘要： A low-k organic dielectric material having stable nano-sized porous is provided as well as a method of fabricating the same. The porous low-k organic dielectric material is made from a composition of matter having a vitrification temperature (Tv-comp) which includes a b-staged thermosetting resin having a vitrification temperate (Tv-resin), a pore generating material, and a reactive additive. The reactive additive lowers Tv-comp below Tv-resin.
摘要翻译： 提供了具有稳定的纳米尺寸多孔的低k有机介电材料及其制造方法。 多孔低k有机介电材料由具有玻璃化温度（Tv-comp）的物质组合物制成，其包括具有玻璃化温度（Tv-树脂），孔产生材料和反应性的B阶热固性树脂 添加剂。 反应性添加剂降低Tv-resin以下的Tv-comp。
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3.发明授权Sliders bonded by a debondable encapsulant comprising different polymers formed via in situ polymerization 有权通过包含通过原位聚合形成的不同聚合物的可剥离密封剂结合的滑块公开(公告)号：US07196872B2
公开(公告)日：2007-03-27
申请号：US10835845
申请日：2004-04-29
申请人： Michael W. Chaw , Dan J. Dawson , Craig J. Hawker , James L. Hedrick , Wesley L. Hillman , Teddie P. Magbitang , Dennis R. McKean , Robert D. Miller , Willi Volksen
发明人： Michael W. Chaw , Dan J. Dawson , Craig J. Hawker , James L. Hedrick , Wesley L. Hillman , Teddie P. Magbitang , Dennis R. McKean , Robert D. Miller , Willi Volksen
CPC分类号： G11B5/6082 , Y10T29/49032 , Y10T29/4905 , Y10T156/11
摘要： A slider assembly is provided comprising a plurality of sliders bonded by a debondable solid encapsulant comprised of different first and second polymers The solid encapsulant is comprised of a polymer prepared by polymerizing an encapsulant fluid comprising a homogeneous mixture of first and second constituents. The first constituent is comprised of a first monomer suitable for in situ polymerization to form the first polymer. The second constituent is comprised of the second polymer or a second monomer suitable for in situ polymerization to form the second polymer. The first constituent does not substantially react with the second constituent. Each slider has a surface that is free from the encapsulant. The encapsulant-free surfaces are coplanar to each other. Also provided are methods for forming the assembly and methods for patterning a slider surface using the encapsulant.
摘要翻译： 提供了一种滑块组件，其包括由不同的第一和第二聚合物组成的可脱粘固体密封剂结合的多个滑块。固体密封剂由通过聚合包含第一和第二组分的均匀混合物的密封剂流体制备的聚合物组成。 第一组分由适于原位聚合以形成第一聚合物的第一单体组成。 第二组分由第二聚合物或适于原位聚合形成第二聚合物的第二单体组成。 第一组分基本上不与第二组分反应。 每个滑块具有没有密封剂的表面。 无密封剂的表面彼此共面。 还提供了用于形成组件的方法和使用密封剂来图案化滑块表面的方法。
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4.发明授权Sliders bonded by a debondable encapsulant containing styrene and butadiene polymers 失效滑块由含有苯乙烯和丁二烯聚合物的可剥离密封剂粘合公开(公告)号：US07209324B2
公开(公告)日：2007-04-24
申请号：US10611673
申请日：2003-06-30
申请人： Phillip J. Brock , Michael W. Chaw , Dan J. Dawson , Craig J. Hawker , James L. Hedrick , Teddie P. Magbitang , Dennis R. McKean , Robert D. Miller , Richard I. Palmisano , Willi Volksen
发明人： Phillip J. Brock , Michael W. Chaw , Dan J. Dawson , Craig J. Hawker , James L. Hedrick , Teddie P. Magbitang , Dennis R. McKean , Robert D. Miller , Richard I. Palmisano , Willi Volksen
IPC分类号： G11B5/60
CPC分类号： G11B5/6005
摘要： The invention relates generally to the bonding of one or more sliders in styrene and butadiene polymers. More particularly, the invention relates to planarized slider assemblies formed by using debondable solid encapsulants comprised of styrene and butadiene polymers. The invention also relates to methods that use such encapsulants in conjunction with resists to produce magnetic head sliders having patterned air-bearing surfaces.
摘要翻译： 本发明一般涉及一种或多种滑块在苯乙烯和丁二烯聚合物中的结合。 更具体地，本发明涉及通过使用由苯乙烯和丁二烯聚合物组成的可分离固体密封剂形成的平面化滑块组件。 本发明还涉及将这种密封剂与抗蚀剂结合使用以产生具有图案化空气轴承表面的磁头滑块的方法。
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5.发明授权Sliders bonded by a debondable encapsulant containing styrene and acrylate polymers 失效滑块由含有苯乙烯和丙烯酸酯聚合物的可分散的密封剂粘合公开(公告)号：US07064929B2
公开(公告)日：2006-06-20
申请号：US10611317
申请日：2003-06-30
申请人： Dennis R. McKean , Robert D. Miller , Teddie P. Magbitang , James L. Hedrick , Craig J. Hawker , Willi Volksen , Phillip J. Brock , Dan J. Dawson , Michael W. Chaw , Richard I. Palmisano
发明人： Dennis R. McKean , Robert D. Miller , Teddie P. Magbitang , James L. Hedrick , Craig J. Hawker , Willi Volksen , Phillip J. Brock , Dan J. Dawson , Michael W. Chaw , Richard I. Palmisano
IPC分类号： G11B21/16
CPC分类号： B29C33/14 , B29C39/10 , B29C39/36 , B29K2025/00 , B29K2033/12 , B29K2105/0073 , G11B5/127 , G11B5/4853 , Y10T156/1092 , Y10T428/24752
摘要： The invention relates generally to the bonding of one or more sliders in styrene and acrylate polymers. More particularly, the invention relates to planarized slider assemblies formed by using debondable solid encapsulants comprised of styrene and acrylate polymers. The invention also relates to methods that use such encapsulants in conjunction with resists to produce magnetic head sliders having patterned air-bearing surfaces.
摘要翻译： 本发明一般涉及在苯乙烯和丙烯酸酯聚合物中粘合一个或多个滑块。 更具体地说，本发明涉及通过使用由苯乙烯和丙烯酸酯聚合物组成的可剥离固体密封剂形成的平面化滑块组件。 本发明还涉及将这种密封剂与抗蚀剂结合使用以产生具有图案化空气轴承表面的磁头滑块的方法。
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公开(公告)号：US07125467B2
公开(公告)日：2006-10-24
申请号：US10611528
申请日：2003-06-30
申请人： Phillip Joe Brock , Michael William Chaw , Dan J. Dawson , Craig J. Hawker , James L. Hedrick , Wesley L. Hillman , Teddie P. Magbitang , Dennis R. McKean , Robert D. Miller , Richard I. Palmisano , Jila Tabib , Mark C. Thurber , Willi Volksen
发明人： Phillip Joe Brock , Michael William Chaw , Dan J. Dawson , Craig J. Hawker , James L. Hedrick , Wesley L. Hillman , Teddie P. Magbitang , Dennis R. McKean , Robert D. Miller , Richard I. Palmisano , Jila Tabib , Mark C. Thurber , Willi Volksen
CPC分类号： C09D5/20 , Y10T29/49032 , Y10T29/49041
摘要： A process for fabricating sliders where the sliders are held in place during processing by a solid matrix material is described. A thin coating of a release-layer material is applied on the sliders before encapsulation in the matrix material. The release-layer material is polyvinyl alcohol and more preferably high molecular weight polyvinyl alcohol which is highly hydrolyzed. Use of the release-layer of the invention maintains the process resistance while providing the advantage of allowing easier removal of the matrix material after it is no longer needed. The release-layer can be applied to encapsulant materials including epoxies, acrylates, polyimides, silsesquioxanes and others. After the selected fabrication process such as the formation of air-bearing features an appropriate solvent is applied to soften the polyvinyl alcohol film and allow clean debonding of the sliders.
摘要翻译： 描述了一种用于制造滑块的方法，其中滑块在由固体基质材料处理期间保持就位。 剥离层材料的薄涂层在封装在基质材料中之前施加在滑块上。 剥离层材料是聚乙烯醇，更优选高度水解的高分子量聚乙烯醇。 本发明的释放层的使用保持了工艺阻力，同时提供了在不再需要基质材料之后容易去除基质材料的优点。 释放层可以应用于包括环氧树脂，丙烯酸酯，聚酰亚胺，倍半硅氧烷等的包封材料。 在选择的制造方法如形成空气轴承特征之后，施加适当的溶剂以软化聚乙烯醇膜并允许滑块的清洁脱粘。
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7.发明授权Stable encapsulant fluid capable of undergoing reversible Diels-Alder polymerization 有权稳定的密封剂流体能够进行可逆的Diels-Alder聚合公开(公告)号：US07309754B2
公开(公告)日：2007-12-18
申请号：US10673052
申请日：2003-09-26
申请人： Phillip Joe Brock , Michael W. Chaw , Dan Dawson , Craig Hawker , James L. Hedrick , Teddie P. Magbitang , Dennis McKean , Robert D. Miller , Richard I. Palmisano , Willi Volksen
发明人： Phillip Joe Brock , Michael W. Chaw , Dan Dawson , Craig Hawker , James L. Hedrick , Teddie P. Magbitang , Dennis McKean , Robert D. Miller , Richard I. Palmisano , Willi Volksen
CPC分类号： G11B5/102
摘要： An encapsulant fluid is provided comprising a mixture of a diene-containing compound and a dienophilic compound. At least one of the diene-containing and the dienophilic compounds is protected so that the compounds do not substantially react with each other at room temperature. The diene-containing and the dienophilic compounds undergo a reversible Diels-Alder polymerization reaction at a polymerization temperature above room temperature to form a solid debondable polymeric encapsulant. Also provided are methods for forming slider assemblies and methods for patterning a slider surface using the encapsulant.
摘要翻译： 提供了包含含二烯的化合物和二亲性化合物的混合物的密封剂流体。 至少一种含二烯和二亲性化合物被保护，使得化合物在室温下基本上不会彼此反应。 含二烯和二亲性化合物在聚合温度高于室温的条件下进行可逆的狄尔斯 - 阿尔德聚合反应，形成固体可分散的聚合物密封剂。 还提供了用于形成滑块组件的方法和使用该密封剂来构图滑块表面的方法。
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公开(公告)号：US07077970B2
公开(公告)日：2006-07-18
申请号：US10672011
申请日：2003-09-25
申请人： Nicholas I. Buchan , Michael W. Chaw , Sean Clemenza , Dan Dawson , Craig Hawker , James L. Hedrick , Wesley L. Hillman , Teddie P. Magbitang , Willi Volksen , Dennis McKean , Robert D. Miller
发明人： Nicholas I. Buchan , Michael W. Chaw , Sean Clemenza , Dan Dawson , Craig Hawker , James L. Hedrick , Wesley L. Hillman , Teddie P. Magbitang , Willi Volksen , Dennis McKean , Robert D. Miller
IPC分类号： B44C1/22
摘要： A slider assembly is provided comprising a plurality of sliders bonded by a debondable solid encapsulant. The solid encapsulant is comprised of a polymer prepared by polymerizing a mixture of first and second monomers in a nonstoichiometric ratio effective to render the encapsulant debondable. Each slider has a surface that is free from the encapsulant. The encapsulant-free surfaces are coplanar to each other. Also provided are methods for forming the assembly and methods for patterning a slider surface using the encapsulant.
摘要翻译： 提供了一种滑块组件，其包括通过可剥离固体密封剂结合的多个滑块。 固体密封剂由通过以非化学计量比聚合第一和第二单体的混合物而制备的聚合物有效地使密封剂脱粘。 每个滑块具有没有密封剂的表面。 无密封剂的表面彼此共面。 还提供了用于形成组件的方法和使用密封剂来图案化滑块表面的方法。
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9.发明授权Interconnect dielectric compositions, preparation thereof, and integrated circuit devices fabricated therewith 失效互连电介质组合物，其制备方法和用其制造的集成电路器件公开(公告)号：US06265753B1
公开(公告)日：2001-07-24
申请号：US09330285
申请日：1999-06-11
申请人： Kenneth R. Carter , James L. Hedrick , Victor Yee-Way Lee , Dale C. McHerron , Robert D. Miller
发明人： Kenneth R. Carter , James L. Hedrick , Victor Yee-Way Lee , Dale C. McHerron , Robert D. Miller
IPC分类号： H01L2928
CPC分类号： H01L21/02118 , H01L21/02205 , H01L21/02282 , H01L21/312 , H01L21/76885 , H01L23/5329 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/285 , H01L2924/00
摘要： A novel dielectric composition is provided that is useful in the manufacture of integrated circuit devices and integrated circuit packaging devices. The dielectric composition is prepared by imidizing and curing an oligomeric precursor compound comprised of a central polybenzoxazole, polybezothiazole polyamic acid ester segment end-capped at each terminus with an aryl-substituted acetylene moiety such as an ortho-bis(arylethynyl)aryl group, e.g., 3,4-bis(phenylethynly)phenyl. Integrated circuit devices, integrated circuit packaging devices, and methods of synthesis and manufacture are provided as well.
摘要翻译： 提供了一种新颖的电介质组合物，其可用于制造集成电路器件和集成电路封装器件。 通过酰亚胺化和固化由中间聚苯并恶唑，在每一末端封端的聚异唑啉聚酰胺酸酯链段与芳基取代的乙炔部分如邻 - 双（芳基乙炔基）芳基组成的低聚前体化合物，例如 ，3,4-双（苯基乙炔基）苯基。 还提供集成电路器件，集成电路封装器件以及合成和制造方法。
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10.发明授权Dielectric compositions, preparation thereof, and integrated circuit devices fabricated therewith 失效介电组合物，其制备方法和用其制造的集成电路器件公开(公告)号：US06518392B2
公开(公告)日：2003-02-11
申请号：US09803447
申请日：2001-03-08
申请人： Kenneth R. Carter , James L. Hedrick , Victor Yee-Way Lee , Dale C. McHerron , Robert D. Miller
发明人： Kenneth R. Carter , James L. Hedrick , Victor Yee-Way Lee , Dale C. McHerron , Robert D. Miller
IPC分类号： C08G4300
CPC分类号： H01L21/02118 , H01L21/02205 , H01L21/02282 , H01L21/312 , H01L21/76885 , H01L23/5329 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/285 , H01L2924/00
摘要： A novel dielectric composition is provided that is useful in the manufacture of integrated circuit devices and integrated circuit packaging devices. The dielectric composition is prepared by imidizing and curing an oligomeric precursor compound comprised of a central polybenzoxazole, polybenzothiazole, polyamic acid or polyamic acid ester segment end-capped at each terminus with an aryl-substituted acetylene moiety such as an ortho-bis(arylethynyl)aryl group, e.g., 3,4-bis(phenylethynyl)phenyl. Integrated circuit devices, integrated circuit packaging devices, and methods of synthesis and manufacture are provided as well.
摘要翻译： 提供了一种新颖的电介质组合物，其可用于制造集成电路器件和集成电路封装器件。 通过酰亚胺化和固化由在末端封端的中央聚苯并恶唑，聚苯并噻唑，聚酰胺酸或聚酰胺酸酯链段的寡聚前体化合物与芳基取代的乙炔部分如邻 - 双（芳基乙炔基） 芳基，例如3,4-双（苯基乙炔基）苯基。 还提供集成电路器件，集成电路封装器件以及合成和制造方法。
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