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    Homogeneous porous low dielectric constant materials
    9.
    发明授权
    Homogeneous porous low dielectric constant materials 有权
    均质多孔低介电常数材料

    公开(公告)号：US08314005B2

    公开(公告)日：2012-11-20

    申请号：US13010004

    申请日：2011-01-20

    申请人： Sampath Purushothaman ,  Geraud Jean-Michel Dubois ,  Teddie P. Magbitang ,  Willi Volksen ,  Theo J. Frot

    发明人： Sampath Purushothaman ,  Geraud Jean-Michel Dubois ,  Teddie P. Magbitang ,  Willi Volksen ,  Theo J. Frot

    IPC分类号： H01L21/76

    CPC分类号： H01L21/3105 ,  H01L21/02203 ,  H01L21/7682 ,  H01L2221/1047

    摘要： In one exemplary embodiment, a method includes: providing a structure having a first layer overlying a substrate, where the first layer includes a dielectric material having a plurality of pores; applying a filling material to an exposed surface of the first layer; heating the structure to a first temperature to enable the filling material to homogeneously fill the plurality of pores; after filling the plurality of pores, performing at least one process on the structure; and after performing the at least one process, removing the filling material from the plurality of pores by heating the structure to a second temperature to decompose the filling material.

    摘要翻译： 在一个示例性实施例中，一种方法包括：提供具有覆盖衬底的第一层的结构，其中第一层包括具有多个孔的电介质材料; 将填充材料施加到第一层的暴露表面; 将结构加热到第一温度以使填充材料均匀地填充多个孔; 在填充所述多个孔之后，在所述结构上执行至少一个处理; 并且在执行所述至少一个处理之后，通过将所述结构加热至第二温度以分解所述填充材料，从所述多个孔中除去所述填充材料。

    Reduction of pore fill material dewetting
    10.
    发明授权
    Reduction of pore fill material dewetting 失效
    减少孔隙填充材料去湿

    公开(公告)号：US08541301B2

    公开(公告)日：2013-09-24

    申请号：US13180734

    申请日：2011-07-12

    申请人： Geraud Jean-Michel Dubois ,  Theo J. Frot ,  Teddie P. Magbitang ,  Willi Volksen

    发明人： Geraud Jean-Michel Dubois ,  Theo J. Frot ,  Teddie P. Magbitang ,  Willi Volksen

    IPC分类号： H01L21/4763

    CPC分类号： H01L21/3105 ,  H01L21/02203 ,  H01L21/76802 ,  H01L21/7682 ,  H01L21/76822 ,  H01L21/76826 ,  H01L21/76828 ,  H01L2221/1047

    摘要： In one exemplary embodiment, a method includes: providing a structure having a first layer overlying a substrate, where the first layer includes a dielectric material having a plurality of pores; applying a filling material to a surface of the first layer, where the filling material includes a polymer and at least one additive, where the at least one additive includes at least one of a surfactant, a high molecular weight polymer and a solvent; and after applying the filling material, heating the structure to enable the filling material to at least partially fill the plurality of pores uniformly across an area of the first layer, where heating the structure results in residual filling material being uniformly left on the surface of the first layer.

    摘要翻译： 在一个示例性实施例中，一种方法包括：提供具有覆盖衬底的第一层的结构，其中第一层包括具有多个孔的电介质材料; 将填充材料施加到第一层的表面，其中填充材料包括聚合物和至少一种添加剂，其中至少一种添加剂包括表面活性剂，高分子量聚合物和溶剂中的至少一种; 并且在施加填充材料之后，加热该结构以使得填充材料能够在第一层的区域上均匀地至少部分地填充多个孔，其中加热该结构导致剩余的填充材料均匀地留在表面上 第一层