公开(公告)号：US07879218B1

公开(公告)日：2011-02-01

申请号：US10741048

申请日：2003-12-18

Applicant: Eric Webb ,  Jon Reid ,  Yuichi Takada ,  Timothy Archer

Inventor： Eric Webb ,  Jon Reid ,  Yuichi Takada ,  Timothy Archer

IPC: C25D5/34

CPC classification number: C25D7/123 ,  C25D5/34 ,  H01L21/2885 ,  H01L21/76877

Abstract: The present invention provides improved methods and devices for electroplating copper on a wafer. Some implementations of the present invention involve the pre-treatment of the wafer with a solution containing accelerator molecules. Preferably, the bath into which the wafer is subsequently placed for electroplating has a reduced concentration of accelerator molecules. The pre-treatment causes a reduction in roughness of the electroplated copper surface, particularly during the initial phases of copper growth.

Abstract translation: 本发明提供了用于在晶片上电镀铜的改进方法和装置。 本发明的一些实施方案涉及用含有促进剂分子的溶液预处理晶片。 优选地，晶片随后放置用于电镀的浴具有降低的促进剂分子浓度。 预处理导致电镀铜表面的粗糙度降低，特别是在铜生长的初始阶段。

公开(公告)号：US08197662B1

公开(公告)日：2012-06-12

申请号：US12971367

申请日：2010-12-17

Applicant: Eric Webb ,  Jonathan D. Reid ,  Yuichi Takada ,  Timothy Archer

Inventor： Eric Webb ,  Jonathan D. Reid ,  Yuichi Takada ,  Timothy Archer

IPC: C25D5/34

CPC classification number: C25D7/123 ,  C25D5/34 ,  H01L21/2885 ,  H01L21/76877

Abstract: The present invention provides improved methods and devices for electroplating copper on a wafer. Some implementations of the present invention involve the pre-treatment of the wafer with a solution containing accelerator molecules. Preferably, the bath into which the wafer is subsequently placed for electroplating has a reduced concentration of accelerator molecules. The pre-treatment causes a reduction in roughness of the electroplated copper surface, particularly during the initial phases of copper growth.

Abstract translation: 本发明提供了用于在晶片上电镀铜的改进方法和装置。 本发明的一些实施方案涉及用含有促进剂分子的溶液预处理晶片。 优选地，晶片随后放置用于电镀的浴具有降低的促进剂分子浓度。 预处理导致电镀铜表面的粗糙度降低，特别是在铜生长的初始阶段。

公开(公告)号：US20060166485A1

公开(公告)日：2006-07-27

申请号：US11389428

申请日：2006-03-23

Applicant: Jay Uglow ,  Nicolas Bright ,  Dave Hemker ,  Kenneth MacWilliams ,  Jeffrey Benzing ,  Timothy Archer

Inventor： Jay Uglow ,  Nicolas Bright ,  Dave Hemker ,  Kenneth MacWilliams ,  Jeffrey Benzing ,  Timothy Archer

IPC: H01L21/4763

CPC classification number: H01L21/76835 ,  H01L21/02126 ,  H01L21/02164 ,  H01L21/022 ,  H01L21/02304 ,  H01L21/31116 ,  H01L21/314 ,  H01L21/31633 ,  H01L21/76807 ,  H01L21/76822

Abstract: A dielectric structure and method for making a dielectric structure for dual-damascene applications over a substrate are provided. The method includes forming a barrier layer over the substrate, forming an inorganic dielectric layer over the barrier layer, and forming a low dielectric constant layer over the inorganic dielectric layer. In this preferred example, the method also includes forming a trench in the low dielectric constant layer using a first etch chemistry. The etching is timed to etch through a partial thickness of the low dielectric constant layer and the first etch chemistry is optimized to a selected low dielectric constant material. The method further includes forming a via hole in the inorganic dielectric layer using a second etch chemistry, such that the via is within the trench. In a specific example, the inorganic dielectric layer can be an un-doped TEOS oxide or a fluorine doped oxide, and the low dielectric constant layer can be a carbon doped oxide (C-oxide) or other low K dielectrics.

公开(公告)号：US07799200B1

公开(公告)日：2010-09-21

申请号：US11544957

申请日：2006-10-05

Applicant: Steven T. Mayer ,  John Drewery ,  Richard S. Hill ,  Timothy Archer ,  Avishai Kepten

Inventor： Steven T. Mayer ,  John Drewery ,  Richard S. Hill ,  Timothy Archer ,  Avishai Kepten

IPC: C25F3/00 ,  H01L21/288 ,  B23H3/00

CPC classification number: B23H5/08 ,  C25F3/16 ,  H01L21/02068 ,  H01L21/2885 ,  H01L21/32115 ,  H01L21/7684

Abstract: Methods and apparatus are provided for planar metal plating on a workpiece having a surface with recessed regions and exposed surface regions; comprising the steps of: causing a plating accelerator to become attached to said surface including the recessed and exposed surface regions; selectively removing the plating accelerator from the exposed surface regions without performing substantial metal plating on the surface; and after removal of plating accelerator is at least partially complete, plating metal onto the surface, whereby the plating accelerator remaining attached to the surface increases the rate of metal plating in the recessed regions relative to the rate of metal plating in the exposed surface regions.

Abstract translation: 提供了用于在具有凹陷区域和暴露表面区域的表面的工件上进行平面金属电镀的方法和装置; 包括以下步骤：使电镀加速器附着到包括凹入和暴露的表面区域的所述表面; 选择性地从暴露的表面区域去除电镀加速器，而不在表面上进行实质的金属电镀; 在去除电镀促进剂至少部分完成后，将金属镀在表面上，由此保持附着在表面上的电镀加速剂相对于露出的表面区域中的金属电镀速率增加凹陷区域中的金属电镀速率。

公开(公告)号：US20050267673A1

公开(公告)日：2005-12-01

申请号：US11039570

申请日：2005-01-20

Applicant: Derek Blagg ,  Joseph Masters ,  Timothy Archer ,  John Simmons

Inventor： Derek Blagg ,  Joseph Masters ,  Timothy Archer ,  John Simmons

IPC: G06G7/70 ,  G06Q10/00

CPC classification number: G06Q10/06

Abstract: A fuel management server creates a primary transaction record for a primary fueling agent assigned to a fueling transaction and a secondary transaction record for each secondary fueling agent assigned to the fueling transaction. Each fueling agent interacts with a fueling agent client device to collect fueling transaction data to be stored in the transaction records. Certain transaction data collected by the secondary fueling agent is shared with the primary fueling agent. The primary transaction record stores final fuel load data indicating the amount of fuel dispensed from a primary fueling vehicle and an aggregate amount of fuel dispensed during the fueling transaction. The secondary transaction record stores final fuel load data indicating the amount of fuel dispensed from a secondary fueling vehicle during the fueling transaction. Selected portions of the primary transaction record and the secondary transaction record may be accessed for purposes of reporting and presentation.

Abstract translation: 燃料管理服务器为分配给加油交易的主要加油代理和分配给加油交易的每个二次加油代理的次要交易记录创建主交易记录。 每个加油剂与加油剂客户装置相互作用以收集要存储在交易记录中的加油交易数据。 由二次加油剂收集的某些交易数据与主加油剂共享。 主要交易记录存储指示从主加油车辆分配的燃料量和在加油交易期间分配的燃料的总量的最终燃料负荷数据。 次要交易记录存储指示在加油交易期间从二次加油车辆分配的燃料量的最终燃料负荷数据。 可以为报告和呈现的目的访问主要交易记录和次要交易记录的所选部分。

公开(公告)号：US20050159878A1

公开(公告)日：2005-07-21

申请号：US11039310

申请日：2005-01-20

Applicant: Keith Coggins ,  Steven Jackson ,  Timothy Archer ,  John Simmons ,  Derek Blagg

Inventor： Keith Coggins ,  Steven Jackson ,  Timothy Archer ,  John Simmons ,  Derek Blagg

IPC: G06F17/00 ,  G06F19/00 ,  G06G7/70 ,  G06G7/76

CPC classification number: B67D7/145 ,  G06Q50/06

Abstract: A fueling agent operates a fueling agent client device for collecting and generating transaction data relating to a fueling transaction. The fueling agent client device transmits the transaction data to a fuel management server, for example, via a wireless communications link. The fuel management server stores the transaction data in a transaction record. The transaction data includes final fuel load data indicating an amount of fuel dispensed during the fueling transaction. Selected transaction data is retrieved from the transaction record and is delivered to a data communications system for transmission to a receiver. The receiver may be in the cockpit of an aircraft. An aircraft data communication system may be a digital data link system for transmitting data to and from the aircraft via VHF radio, such as ACARS. The fuel management server may communicate with an aircraft data communication system directly, or indirectly via an airline computer system.

Abstract translation: 加油剂操作加油剂客户装置，用于收集和产生与加油交易有关的交易数据。 加油代理客户端装置例如经由无线通信链路将交易数据发送到燃料管理服务器。 燃料管理服务器将事务数据存储在事务记录中。 交易数据包括指示在加油交易期间分配的燃料量的最终燃料负荷数据。 从交易记录中检索所选择的交易数据，并将其交付给数据通信系统以传送到接收机。 接收器可能在飞机的驾驶舱内。 飞机数据通信系统可以是用于经由VHF无线电（例如ACARS）向飞机发送数据的数字数据链路系统。 燃料管理服务器可以直接或经由航空公司计算机系统间接地与飞行器数据通信系统进行通信。