公开(公告)号：US5662761A

公开(公告)日：1997-09-02

申请号：US374592

申请日：1995-02-02

申请人： Erik Middelman ,  Pieter Hendrik Zuuring

发明人： Erik Middelman ,  Pieter Hendrik Zuuring

IPC分类号： B32B15/08 ,  B29C70/06 ,  B29C70/08 ,  B29C70/20 ,  B29C70/22 ,  B29C70/50 ,  B32B5/12 ,  B32B17/04 ,  B32B37/00 ,  B32B37/02 ,  B32B37/06 ,  B32B37/22 ,  H05K1/03 ,  H05K3/00 ,  H05K3/02 ,  H05K3/46 ,  B65C9/25 ,  B32B3/00 ,  H05K1/00

CPC分类号： B32B37/02 ,  B29C70/083 ,  B29C70/202 ,  B29C70/504 ,  B32B37/1027 ,  B32B37/226 ,  H05K1/0366 ,  B29K2105/0845 ,  B29K2105/108 ,  B29L2031/3425 ,  B32B2305/10 ,  B32B2457/08 ,  H05K2201/0287 ,  H05K3/022 ,  H05K3/4626 ,  Y10S428/901 ,  Y10T156/1084 ,  Y10T428/24074 ,  Y10T428/24132 ,  Y10T428/24802 ,  Y10T428/24917

摘要： The invention relates to a method of manufacturing a composite laminate, preferably a cross-ply laminate, in which process unidirectionally oriented (UD) fibres (3) are provided with matrix material (7) and, together with a pre-formed non-flowing UD composite or cross-ply laminate, passed through a laminating zone (13) in layers of at least two different orientational directions. More particularly, the invention relates to the manufacture of composite material which is pre-eminently suited to be used as a supporting substrate for printed wire boards. The method according to the invention is directed in particular to the utilisation of a double belt press, both for making the preformed non-flowing UD composite and for the manufacture of the final laminate. The invention also comprises printed wire board (PWBs) and multilayer PWBs.

摘要翻译： PCT No.PCT / EP93 / 01919 Sec。 371日期：1995年2月2日 102（e）日期1995年2月2日PCT提交1993年7月20日PCT公布。 公开号WO94 / 02306 日期1994年2月3日本发明涉及一种制造复合层压材料，优选交叉层叠体的方法，其中单向取向（UD）纤维（3）具有基质材料（7），并且与预先 形成的非流动UD复合材料或交叉层压材料以至少两个不同取向方向的层穿过层压区域（13）。 更具体地，本发明涉及复合材料的制造，其特别适用于印刷线路板的支撑基底。 根据本发明的方法特别涉及双辊带式压榨机的用途，用于制造预成型的不流动的UD复合材料和用于制造最终层压板。 本发明还包括印刷线路板（PWB）和多层PWB。

公开(公告)号：US6016598A

公开(公告)日：2000-01-25

申请号：US73143

申请日：1998-05-05

申请人： Erik Middelman ,  Pieter Hendrik Zuuring

发明人： Erik Middelman ,  Pieter Hendrik Zuuring

IPC分类号： H05K3/38 ,  H05K3/46 ,  H05K3/36

CPC分类号： H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0287 ,  H05K2203/0759 ,  H05K3/386 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49163

摘要： A process for manufacturing a multi-layer printed wire board, also referred to as a multilayer, comprising at least two electrically insulating substrates with electrically conductive traces or layers provided on at least three surfaces thereof, in which process, by means of lamination under pressure, a cured basic substrate based on a UD-reinforced synthetic material, provided on either side with traces, is combined with and bonded to a back-up substrate, wherein during the laminating process the back-up substrate is added to the basic substrate, the base substrate and the back-up substrate comprising a UD-reinforced cured core layer, the base substrate having been provided at least on the side facing the back-up substrate with a still plastically deformable (flowable) adhesive layer, and such a pressure is exerted on the laminate as to bring said back-up substrate into contact or practically into contact with the conducting traces of the basic substrate, and the space between these traces is filled with the adhesive material, so bonding the basic substrate and the back-up substrate.

摘要翻译： 一种也称为多层的多层印刷线路板的制造方法，其包括至少两个电绝缘基板，其中至少三个表面设置有导电迹线或层，其中通过压力层压 基于UD增强的合成材料的固化的基底基材在两侧设置有痕迹，与备用基板结合并结合到支撑基板上，其中在层压工艺期间将支撑基板添加到基板， 所述基底基板和所述支撑基板包括UD增强的固化核心层，所述基底基板至少设置在面向所述支撑基板的一侧上，具有可塑性可变形（可流动的）粘合剂层，并且这种压力 施加在层压板上，以使所述备用基板与基本基板的导电迹线接触或实际上接触，并且这些t 种种填充有粘合剂材料，因此粘合基础基材和支撑基材。