摘要:
In a memory device and a method of manufacturing the memory device, the memory device includes a first gate electrode enclosed by a first gate insulating layer, a second gate electrode enclosed by a second gate insulating layer that can be an ONO layer, and a channel region vertically extending between the first gate electrode and the second gate electrode. The first gate electrode is used for removing a charge trapped in the second gate insulating layer. Thus, the memory device can have an improved characteristic when performing an erase operation.
摘要:
A memory device may include a substrate, a bit line, at least a first lower word line, at least a first trap site, a pad electrode, at least a first cantilever electrode, and/or at least a first upper word line. The bit line may be formed on the substrate in a first direction. The first lower word line and the first trap site may be insulated from the bit line and formed in a second direction crossing the bit line. The pad electrode may be insulated at sidewalls of the first lower word line and the first trap site and connected to the bit line. The first cantilever electrode may be formed in the first direction, connected to the pad electrode, floated on the first trap site with at least a first lower vacant space, and/or configured to be bent in a third direction. The first upper word line may be formed on the first cantilever electrode in the second direction with at least a first upper vacant space.
摘要:
A memory device may include a substrate, a bit line, at least a first lower word line, at least a first trap site, a pad electrode, at least a first cantilever electrode, and/or at least a first upper word line. The bit line may be formed on the substrate in a first direction. The first lower word line and the first trap site may be insulated from the bit line and formed in a second direction crossing the bit line. The pad electrode may be insulated at sidewalls of the first lower word line and the first trap site and connected to the bit line. The first cantilever electrode may be formed in the first direction, connected to the pad electrode, floated on the first trap site with at least a first lower vacant space, and/or configured to be bent in a third direction. The first upper word line may be formed on the first cantilever electrode in the second direction with at least a first upper vacant space.
摘要:
A non-volatile memory device, and method of forming the same, increases or maximizes the performance of an ultramicro-structured device. In one embodiment, a non-volatile memory device comprises a first word line and a second word line insulated from each other and positioned to intersect each other with a vacant space therebetween; a bit line in the vacant space between one of the first word line and the second word line and positioned in parallel with one of the first word line and the second word line, the bit line constructed and arranged to be deflected toward one of the first word line and the second word line by an electric field induced between the first word line and the second word line; and a trap site between the bit line and one of the first word line and the second word line intersecting the bit line, the trap site being insulated from the one of the first word line and the second word line intersecting the bit line and spaced apart from the bit line by a portion of the vacant space, the trap site configured to trap a predetermined electric charge to electrostatically fix the bit line in a deflected position in the direction of the one of the word lines.
摘要:
A semiconductor device having a field effect transistor and a method of fabricating the same. In-situ doped epitaxial patterns are respectively formed at both sidewalls of a protruded channel pattern from a substrate by performing an in-situ doped epitaxial growth process. The in-situ doped epitaxial pattern has a conformal impurity concentration throughout. Accordingly, source/drain regions with a conformal impurity concentration are connected throughout a channel width of a channel region including both sidewalls of a protruded channel pattern. As a result, it is possible to maximize a driving current of the filed effect transistor, and an on-off characteristic can be highly stabilized.
摘要:
A Schottky barrier FinFET device and a method of fabricating the same are provided. The device includes a lower fin body provided on a substrate. An upper fin body having first and second sidewalls which extend upwardly from a center of the lower fin body and face each other is provided. A gate structure crossing over the upper fin body and covering an upper surface of the upper fin body and the first and second sidewalls is provided. The Schottky barrier FinFET device includes a source and a drain which are formed on the sidewalls of the upper fin body adjacent to sidewalls of the gate structure and made of a metal material layer formed on an upper surface of the lower fin body positioned at both sides of the upper fin body, and the source and drain form a Schottky barrier to the lower and upper fin bodies.
摘要:
A semiconductor device having a field effect transistor and a method of fabricating the same. In-situ doped epitaxial patterns are respectively formed at both sidewalls of a protruded channel pattern from a substrate by performing an in-situ doped epitaxial growth process. The in-situ doped epitaxial pattern has a conformal impurity concentration throughout. Accordingly, source/drain regions with a conformal impurity concentration are connected throughout a channel width of a channel region including both sidewalls of a protruded channel pattern. As a result, it is possible to maximize a driving current of the filed effect transistor, and an on-off characteristic can be highly stabilized.
摘要:
A non-volatile memory device, and method of forming the same, increases or maximizes the performance of an ultramicro-structured device. In one embodiment, a non-volatile memory device comprises a first word line and a second word line insulated from each other and positioned to intersect each other with a vacant space therebetween; a bit line in the vacant space between one of the first word line and the second word line and positioned in parallel with one of the first word line and the second word line, the bit line constructed and arranged to be deflected toward one of the first word line and the second word line by an electric field induced between the first word line and the second word line; and a trap site between the bit line and one of the first word line and the second word line intersecting the bit line, the trap site being insulated from the one of the first word line and the second word line intersecting the bit line and spaced apart from the bit line by a portion of the vacant space, the trap site configured to trap a predetermined electric charge to electrostatically fix the bit line in a deflected position in the direction of the one of the word lines.
摘要:
There are provided a multi-bit electro-mechanical memory device capable of enhancing or maximizing a degree of integration of the memory device and a method of manufacturing the multi-bit electro-mechanical memory device which includes a substrate, a bit line on the substrate, and extending in a first direction; a word line on the bit line, insulated from the bit line, and extending in a second direction transverse to the first direction, and a cantilever electrode including a shape memory alloy. The cantilever electrode has a first portion electrically connected to the bit line and a second portion extending in the first direction, and spaced apart from the word line by an air gap, wherein the cantilever electrode, in a first state, is in electrical contact with the word line, and, in a second state, is spaced apart from the word line.
摘要:
There are provided a multi-bit electromechanical memory device capable of enhancing or maximizing a degree of integration of the memory device and a method of manufacturing the multi-bit electromechanical memory device which includes a substrate, a bit line on the substrate, and extending in a first direction; a word line on the bit line, insulated from the bit line, and extending in a second direction transverse to the first direction, and a cantilever electrode including a shape memory alloy. The cantilever electrode has a first portion electrically connected to the bit line and a second portion extending in the first direction, and spaced apart from the word line by an air gap, wherein the cantilever electrode, in a first state, is in electrical contact with the word line, and, in a second state, is spaced apart from the word line.