公开(公告)号：US20080238588A1

公开(公告)日：2008-10-02

申请号：US12156532

申请日：2008-06-02

申请人： Evelina F. Yeung ,  Sanjay Dabral ,  Pascal Meier ,  Santanu Chaudhuri

发明人： Evelina F. Yeung ,  Sanjay Dabral ,  Pascal Meier ,  Santanu Chaudhuri

IPC分类号： H04B3/14

CPC分类号： H04B3/145

摘要： Embodiments of a programmable passive equalizer are described herein.

摘要翻译： 本文描述了可编程无源均衡器的实施例。

公开(公告)号：US07394331B2

公开(公告)日：2008-07-01

申请号：US11198111

申请日：2005-08-05

申请人： Evelina F Yeung ,  Sanjay Dabral ,  Pascal Meier ,  Santanu Chaudhuri

发明人： Evelina F Yeung ,  Sanjay Dabral ,  Pascal Meier ,  Santanu Chaudhuri

IPC分类号： H04B3/14

CPC分类号： H04B3/145

摘要： Embodiments of a programmable passive equalizer are described herein.

公开(公告)号：US07671694B2

公开(公告)日：2010-03-02

申请号：US12156532

申请日：2008-06-02

申请人： Evelina F Yeung ,  Sanjay Dabral ,  Pascal Meier ,  Santanu Chaudhuri

发明人： Evelina F Yeung ,  Sanjay Dabral ,  Pascal Meier ,  Santanu Chaudhuri

IPC分类号： H04B3/04

CPC分类号： H04B3/145

摘要： Embodiments of a programmable passive equalizer are described herein.

摘要翻译： 本文描述了可编程无源均衡器的实施例。

公开(公告)号：US20070030092A1

公开(公告)日：2007-02-08

申请号：US11198111

申请日：2005-08-05

申请人： Evelina Yeung ,  Sanjay Dabral ,  Pascal Meier ,  Santanu Chaudhuri

发明人： Evelina Yeung ,  Sanjay Dabral ,  Pascal Meier ,  Santanu Chaudhuri

IPC分类号： H04B3/04

CPC分类号： H04B3/145

摘要： Embodiments of a programmable passive equalizer are described herein.

摘要翻译： 本文描述了可编程无源均衡器的实施例。

公开(公告)号：US20060067066A1

公开(公告)日：2006-03-30

申请号：US10950827

申请日：2004-09-27

申请人： Pascal Meier ,  Sanjay Dabral

发明人： Pascal Meier ,  Sanjay Dabral

IPC分类号： H01R12/28

CPC分类号： G06F1/189 ,  G06F1/184 ,  G06F1/185 ,  G06F1/186 ,  H01R12/79 ,  H05K1/14 ,  H05K1/147 ,  H05K3/222 ,  H05K3/305 ,  H05K2201/044 ,  H05K2201/10356 ,  H05K2201/10492 ,  H05K2201/10704 ,  H05K2201/2027 ,  Y10T29/49117

摘要： A system and method are disclosed in which flex cables are affixed to PCBs, for providing high-speed signaling paths between ICs disposed upon the PCBs. The flex cables are fixably attached to the PCBs so as to substantially mimic their structural orientation. Where the configuration includes more than one PCB, the flex cables include multiple portions which are temporarily separable from one another and from the die, using flex-to-flex and flex-to-package connectors, allowing field maintenance of the configuration. By routing the high-speed signals between ICs onto the flex cable, single-layer PCBs can be used for non-critical and power delivery signals, at substantial cost savings. By disposing the flex cables onto the PCB rather than allowing the cables to float freely, the configuration is thermally managed as if the signals were on the PCB and cable routing problems are avoided.

公开(公告)号：US07907418B2

公开(公告)日：2011-03-15

申请号：US12628778

申请日：2009-12-01

申请人： Pascal Meier ,  Sanjay Dabral

发明人： Pascal Meier ,  Sanjay Dabral

IPC分类号： H05K7/00

CPC分类号： H05K3/4611 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/024 ,  H05K1/112 ,  H05K1/147 ,  H05K3/0064 ,  H05K3/4084 ,  H05K2201/091 ,  H05K2201/09318 ,  H05K2201/10734 ,  Y10T29/49126

摘要： A circuit board may include first and second sides, a plurality of circuit board layers between the sides, and a plurality of signal traces located in respective circuit board layers. The circuit board layers and the signal traces may extend from a first component connection region at the first side of the circuit board to a second component connection region at the first side of the circuit board. The signal traces may thus form stubless signal paths through the circuit board between the component connection regions. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

摘要翻译： 电路板可以包括第一和第二侧，在侧面之间的多个电路板层和位于相应的电路板层中的多个信号迹线。 电路板层和信号迹线可以从电路板的第一侧的第一部件连接区域延伸到电路板的第一侧的第二部件连接区域。 因此，信号迹线可以在组件连接区域之间形成通过电路板的不连续的信号路径。 当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

公开(公告)号：US20100073892A1

公开(公告)日：2010-03-25

申请号：US12628778

申请日：2009-12-01

申请人： Pascal Meier ,  Sanjay Dabral

发明人： Pascal Meier ,  Sanjay Dabral

IPC分类号： H05K7/02 ,  H05K3/36

CPC分类号： H05K3/4611 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/024 ,  H05K1/112 ,  H05K1/147 ,  H05K3/0064 ,  H05K3/4084 ,  H05K2201/091 ,  H05K2201/09318 ,  H05K2201/10734 ,  Y10T29/49126

摘要： A circuit board may include first and second sides, a plurality of circuit board layers between the sides, and a plurality of signal traces located in respective circuit board layers. The circuit board layers and the signal traces may extend from a first component connection region at the first side of the circuit board to a second component connection region at the first side of the circuit board. The signal traces may thus form stubless signal paths through the circuit board between the component connection regions. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

摘要翻译： 电路板可以包括第一和第二侧，在侧面之间的多个电路板层和位于相应的电路板层中的多个信号迹线。 电路板层和信号迹线可以从电路板的第一侧的第一部件连接区域延伸到电路板的第一侧的第二部件连接区域。 因此，信号迹线可以在组件连接区域之间形成通过电路板的不连续的信号路径。 当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

公开(公告)号：US20080123273A1

公开(公告)日：2008-05-29

申请号：US11557709

申请日：2006-11-08

申请人： Pascal Meier ,  Sanjay Dabral

发明人： Pascal Meier ,  Sanjay Dabral

IPC分类号： G06F1/16 ,  H05K3/36 ,  H05K7/10

CPC分类号： H05K3/4611 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/024 ,  H05K1/112 ,  H05K1/147 ,  H05K3/0064 ,  H05K3/4084 ,  H05K2201/091 ,  H05K2201/09318 ,  H05K2201/10734 ,  Y10T29/49126

摘要： A circuit board may include first and second sides, a plurality of circuit board layers between the sides, and a plurality of signal traces located in respective circuit board layers. The circuit board layers and the signal traces may extend from a first component connection region at the first side of the circuit board to a second component connection region at the first side of the circuit board. The signal traces may thus form stubless signal paths through the circuit board between the component connection regions. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

摘要翻译： 电路板可以包括第一和第二侧，在侧面之间的多个电路板层和位于相应的电路板层中的多个信号迹线。 电路板层和信号迹线可以从电路板的第一侧的第一部件连接区域延伸到电路板的第一侧的第二部件连接区域。 因此，信号迹线可以在组件连接区域之间形成通过电路板的不连续的信号路径。 当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

公开(公告)号：US20070004241A1

公开(公告)日：2007-01-04

申请号：US11170980

申请日：2005-06-30

申请人： Pascal Meier ,  Muraleedhara Navada ,  Sanjay Dabral

发明人： Pascal Meier ,  Muraleedhara Navada ,  Sanjay Dabral

IPC分类号： H05K1/00

CPC分类号： H05K1/147 ,  H05K1/118 ,  H05K1/189

摘要： A method and apparatus, in some embodiments the apparatus includes a flex cable terminating at a first end and a second end and having a plurality of conductors therein, and a repeater circuit disposed between the first end and the second end and connected to at least one of the plurality of conductors to re-transmit a signal transmitted on the at least one of the plurality of conductors.

摘要翻译： 一种方法和装置，在一些实施例中，该装置包括终端于第一端和第二端并在其中具有多个导体的柔性电缆，以及设置在第一端和第二端之间并连接到至少一个 以重新发送在所述多个导体中的至少一个上传输的信号。

公开(公告)号：US07649745B2

公开(公告)日：2010-01-19

申请号：US11557709

申请日：2006-11-08

申请人： Pascal Meier ,  Sanjay Dabral

发明人： Pascal Meier ,  Sanjay Dabral

IPC分类号： H05K7/00

CPC分类号： H05K3/4611 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/024 ,  H05K1/112 ,  H05K1/147 ,  H05K3/0064 ,  H05K3/4084 ,  H05K2201/091 ,  H05K2201/09318 ,  H05K2201/10734 ,  Y10T29/49126

摘要： A circuit board may include first and second sides, a plurality of circuit board layers between the sides, and a plurality of signal traces located in respective circuit board layers. The circuit board layers and the signal traces may extend from a first component connection region at the first side of the circuit board to a second component connection region at the first side of the circuit board. The signal traces may thus form stubless signal paths through the circuit board between the component connection regions. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

摘要翻译： 电路板可以包括第一和第二侧，在侧面之间的多个电路板层和位于相应的电路板层中的多个信号迹线。 电路板层和信号迹线可以从电路板的第一侧的第一部件连接区域延伸到电路板的第一侧的第二部件连接区域。 因此，信号迹线可以在组件连接区域之间形成通过电路板的不连续的信号路径。 当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。