-
公开(公告)号：US20180302991A1
公开(公告)日：2018-10-18
申请号：US15524128
申请日：2014-11-14
IPC分类号： H05K3/12 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B29C64/124 , B29C64/393 , B41M3/00 , B41M7/00 , H05K3/00
CPC分类号： H05K3/1283 , B29C64/112 , B29C64/124 , B29C64/336 , B29C64/393 , B29K2995/0005 , B29L2031/3425 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y80/00 , B41M3/006 , B41M7/0081 , H01L2924/0002 , H05K1/097 , H05K3/0014 , H05K3/0055 , H05K3/0085 , H05K2203/0126 , H05K2203/013 , H05K2203/107 , H01L2924/00
摘要： A device forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a first conveyance speed (low speed) in a case in which a wiring layer forming process is performed directly after the resin layer forming process, and forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a second conveyance speed (high speed) in a case in which a consecutive resin layer forming process is performed directly after the resin layer forming process.
-
公开(公告)号：US20180022033A1
公开(公告)日：2018-01-25
申请号：US15548795
申请日：2015-02-05
IPC分类号： B29C64/393 , H05K3/46 , B33Y80/00 , B33Y30/00 , B33Y50/02
CPC分类号： B29C64/393 , B29C64/386 , B33Y10/00 , B33Y30/00 , B33Y50/00 , B33Y50/02 , B33Y80/00 , G06F17/50 , G06F17/5068 , H05K3/46 , H05K3/4644
摘要： A data conversion device capable of generating data necessary for manufacturing electrical device from three-dimensional data using an additive manufacturing, and an additive manufacturing system which performs layered shaping using post-conversion data are provided. A layer information generation section detects members which are included in three-dimensional data and generates layer information for each of the detected members with respect to the three-dimensional data of an electronic device. A layer data division section generates layer data in which the members which are included in the layer information are divided into layer thicknesses which can be shaped using an additive manufacturing. A unit determination section generates unit information which relates to units to be shaped based on the layer data. A control content determination section generates control data which is control information of the units which perform the shaping based on the unit information and the layer data.
-
公开(公告)号：US20170280567A1
公开(公告)日：2017-09-28
申请号：US15512101
申请日：2014-09-19
CPC分类号： H05K3/0008 , B22F3/105 , B23P21/004 , B29C67/00 , B29C67/0003 , B33Y10/00 , B33Y30/00 , B33Y80/00 , H05K1/097 , H05K3/0014 , H05K3/103 , H05K3/1241 , H05K3/4664 , H05K2203/107 , H05K2203/1131
摘要： A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.
-
公开(公告)号：US20170318681A1
公开(公告)日：2017-11-02
申请号：US15523733
申请日：2014-11-07
CPC分类号： H05K3/125 , C23C14/58 , H05K3/1283 , H05K3/1291 , H05K2201/035 , H05K2203/107
摘要： To form wiring on circuit board and conductor body, metal ink containing metal particles is dispensed by inkjet head straddling the circuit board and the conductor body. Then, a laser is applied by laser emitting device to the dispensed metal ink. The metal ink to which the laser is applied is baked and wiring is formed. A laser corresponding to the laser emission amount per unit of area based on the material of the circuit board, which is resin, is applied to the metal ink on the circuit board, and a laser corresponding to the laser emission amount per unit of area based on the conductor body is applied to the metal ink on the conductor body. The metal ink on the circuit board and the metal ink on the conductor body is baked appropriately, and wiring is formed appropriately straddling the circuit board and the conductor body.
-
-
-
搜索结果
4 条记录 (耗时 0.016 秒)