公开(公告)号：US20180302991A1

公开(公告)日：2018-10-18

申请号：US15524128

申请日：2014-11-14

申请人： FUJI MACHINE MFG, CO., LTD.

发明人： Kenji TSUKADA ,  Masatoshi FUJITA ,  Yoshitaka HASHIMOTO ,  Akihiro KAWAJIRI ,  Masato SUZUKI

IPC分类号： H05K3/12 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B29C64/124 ,  B29C64/393 ,  B41M3/00 ,  B41M7/00 ,  H05K3/00

CPC分类号： H05K3/1283 ,  B29C64/112 ,  B29C64/124 ,  B29C64/336 ,  B29C64/393 ,  B29K2995/0005 ,  B29L2031/3425 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y80/00 ,  B41M3/006 ,  B41M7/0081 ,  H01L2924/0002 ,  H05K1/097 ,  H05K3/0014 ,  H05K3/0055 ,  H05K3/0085 ,  H05K2203/0126 ,  H05K2203/013 ,  H05K2203/107 ,  H01L2924/00

摘要： A device forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a first conveyance speed (low speed) in a case in which a wiring layer forming process is performed directly after the resin layer forming process, and forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a second conveyance speed (high speed) in a case in which a consecutive resin layer forming process is performed directly after the resin layer forming process.

公开(公告)号：US20170280567A1

公开(公告)日：2017-09-28

申请号：US15512101

申请日：2014-09-19

申请人： FUJI MACHINE MFG. CO., LTD.

发明人： Masato SUZUKI ,  Akihiro KAWAJIRI ,  Masatoshi FUJITA ,  Kenji TSUKADA ,  Yoshitaka HASHIMOTO

IPC分类号： H05K3/00 ,  B29C67/00 ,  B23P21/00 ,  H05K3/10

CPC分类号： H05K3/0008 ,  B22F3/105 ,  B23P21/004 ,  B29C67/00 ,  B29C67/0003 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  H05K1/097 ,  H05K3/0014 ,  H05K3/103 ,  H05K3/1241 ,  H05K3/4664 ,  H05K2203/107 ,  H05K2203/1131

摘要： A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.

公开(公告)号：US20170318681A1

公开(公告)日：2017-11-02

申请号：US15523733

申请日：2014-11-07

申请人： FUJI MACHINE MFG. CO., LTD.

发明人： Yoshitaka HASHIMOTO ,  Masatoshi FUJITA ,  Kenji TSUKADA ,  Akihiro KAWAJIRI ,  Masato SUZUKI

IPC分类号： H05K3/12 ,  C23C14/58

CPC分类号： H05K3/125 ,  C23C14/58 ,  H05K3/1283 ,  H05K3/1291 ,  H05K2201/035 ,  H05K2203/107

摘要： To form wiring on circuit board and conductor body, metal ink containing metal particles is dispensed by inkjet head straddling the circuit board and the conductor body. Then, a laser is applied by laser emitting device to the dispensed metal ink. The metal ink to which the laser is applied is baked and wiring is formed. A laser corresponding to the laser emission amount per unit of area based on the material of the circuit board, which is resin, is applied to the metal ink on the circuit board, and a laser corresponding to the laser emission amount per unit of area based on the conductor body is applied to the metal ink on the conductor body. The metal ink on the circuit board and the metal ink on the conductor body is baked appropriately, and wiring is formed appropriately straddling the circuit board and the conductor body.