公开(公告)号：US20200089113A1

公开(公告)日：2020-03-19

申请号：US16689389

申请日：2019-11-20

Applicant: FUJIFILM Corporation

Inventor： Takeshi KAWABATA ,  Kenta YOSHIDA ,  Yu IWAI ,  Akinori SHIBUYA

IPC: G03F7/037 ,  G03F7/004 ,  C08G73/10 ,  C08G73/22 ,  H01L23/29 ,  H01L21/56

Abstract: A photosensitive resin composition is also provided that includes a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; a photo-radical polymerization initiator; and a solvent, in which an acid value of an acid group contained in the polymer precursor and having a neutralization point in a pH range of 7.0 to 12.0 is in a range of 2.5 to 34.0 mgKOH/g, and either the polymer precursor contains a radically polymerizable group or the photosensitive resin composition includes a radically polymerizable compound other than the polymer precursor.

公开(公告)号：US20180215874A1

公开(公告)日：2018-08-02

申请号：US15938528

申请日：2018-03-28

Applicant: FUJIFILM Corporation

Inventor： Takeshi KAWABATA ,  Yu IWAI ,  Akinori SHIBUYA

IPC: C08G73/12 ,  G03F7/031 ,  G03F7/037 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  H01L23/498

Abstract: Provided is a resin capable of yielding a cured film with less warp and good uniformity, and of yielding a cured film (pattern) with less scum; a composition using the resin; a cured film; and a method for manufacturing a cured film and a semiconductor device. The resin is selected from polyimide precursor, polyimide, polybenzoxazole precursor, and, polybenzoxazole, and has a polymerizable group, and has a total content of a component with a molecular weight of 1,000 or smaller of 0.005 to 1.0% by mass.

公开(公告)号：US20240419072A1

公开(公告)日：2024-12-19

申请号：US18808427

申请日：2024-08-19

Applicant: FUJIFILM Corporation

Inventor： Takeshi KAWABATA ,  Akiyoshi GOTO

IPC: G03F7/039 ,  G03F7/004 ,  G03F7/20

Abstract: A first object of the present invention is to provide an active light ray sensitive or radioactive ray sensitive resin composition having excellent sensitivity and forming a pattern with excellent resolution. A second object of the present invention is to provide a resist film, a pattern-forming method, and a method for manufacturing an electronic device relating to the active light ray sensitive or radioactive ray sensitive resin composition. The active light ray sensitive or radioactive ray sensitive resin composition of the present invention includes a metal compound, a resin having a main chain that is decomposed by irradiation with an X-ray, an electron beam, or an extreme ultraviolet ray, and a solvent, wherein the metal compound includes one or more metal compounds selected from the group consisting of a metal complex, an organic metal salt, and an organic metal compound, and the resin includes a resin including a repeating unit represented by a formula (1) or a repeating unit represented by a formula (XR0).

公开(公告)号：US20180118887A1

公开(公告)日：2018-05-03

申请号：US15852992

申请日：2017-12-22

Applicant: FUJIFILM Corporation

Inventor： Akinori SHIBUYA ,  Yu IWAI ,  Takeshi KAWABATA ,  Ichiro KOYAMA

IPC: C08G73/10 ,  C08G73/22 ,  C08F110/02 ,  C08F136/00 ,  C08F290/14 ,  G03F7/031 ,  G03F7/038 ,  H01L21/02

Abstract: Provided are photosensitive resin compositions having a wide exposure latitude, a precursor composition for providing such a photosensitive resin composition, a method for producing a precursor composition, a cured film, a method for producing a cured film; and a semiconductor device. The precursor composition is a precursor composition containing at least one kind of heterocycle-containing polymer precursor, in which the heterocycle-containing polymer precursor is selected from a polyimide precursor and a polybenzoxazole precursor; and the dispersity which is a weight-average molecular weight/a number-average molecular weight of the heterocycle-containing polymer precursor is 2.5 or more.

公开(公告)号：US20150185612A1

公开(公告)日：2015-07-02

申请号：US14656997

申请日：2015-03-13

Applicant: FUJIFILM CORPORATION

Inventor： Takeshi KAWABATA ,  Hideaki TSUBAKI ,  Hiroo TAKIZAWA

IPC: G03F7/038 ,  G03F7/30 ,  G03F7/20 ,  C08F8/32

CPC classification number: G03F7/0388 ,  C08F8/32 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/2002 ,  G03F7/2037 ,  G03F7/2041 ,  G03F7/30 ,  G03F7/32 ,  G03F7/325

Abstract: There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising: (A) a resin having a repeating unit represented by the specific formula and a group capable of decomposing by an action of an acid to produce a polar group; and an ionic compound represented by the specific formula, and a resist film comprising the actinic ray-sensitive or radiation-sensitive resin composition.

Abstract translation: 提供了光化射线敏感或辐射敏感性树脂组合物，其包含：（A）具有由特定式表示的重复单元的树脂和能够通过酸的作用分解以产生极性基团的基团; 和由该具体式表示的离子化合物，以及包含光化射线敏感或辐射敏感性树脂组合物的抗蚀剂膜。

公开(公告)号：US20150118628A1

公开(公告)日：2015-04-30

申请号：US14581484

申请日：2014-12-23

Applicant: FUJIFILM Corporation

Inventor： Takeshi KAWABATA ,  Hideaki TSUBAKI ,  Hiroo TAKIZAWA ,  Natsumi YOKOKAWA

IPC: G03F7/20 ,  C08F28/02 ,  C08F14/18

CPC classification number: G03F7/20 ,  C08F14/185 ,  C08F28/02 ,  G03F7/0017 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/325

Abstract: Provided is an actinic-ray- or radiation-sensitive resin composition including a resin (P) comprising any of repeating units (A) of general formula (I) below, each of which contains an ionic structural moiety that when exposed to actinic rays or radiation, is decomposed to thereby generate an acid in a side chain of the resin.

Abstract translation: 本发明提供一种光化学射线或辐射敏感性树脂组合物，其包含包含以下通式（I）的重复单元（A）的树脂（P），其中每一种都含有当暴露于光化射线时的离子结构部分 辐射被分解，从而在树脂的侧链中产生酸。

公开(公告)号：US20150086912A1

公开(公告)日：2015-03-26

申请号：US14554344

申请日：2014-11-26

Applicant: FUJIFILM CORPORATION

Inventor： Takeshi KAWABATA ,  Hideaki TSUBAKI ,  Hiroo TAKIZAWA ,  Natsumi YOKOKAWA

IPC: G03F7/038 ,  C08F216/10 ,  C08F220/30 ,  C08F216/14

CPC classification number: G03F7/0388 ,  C08F12/20 ,  C08F12/22 ,  C08F12/30 ,  C08F212/14 ,  C08F212/32 ,  C08F216/10 ,  C08F216/14 ,  C08F216/1416 ,  C08F220/30 ,  C08F2220/301 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/11 ,  G03F7/325

Abstract: There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising (P) a resin having a repeating unit (A) represented by the specific formula (I) capable of generating an acid on the side chain of the resin upon irradiation with an actinic ray or radiation, and a resist film formed with the actinic ray-sensitive or radiation-sensitive resin composition, and a pattern forming method comprising: exposing the resist film, and developing the exposed resist film, and a method for manufacturing a semiconductor device, containing the pattern forming method, and a semiconductor device manufactured by the manufacturing method of the semiconductor device.

Abstract translation: 提供了一种光化射线敏感性或辐射敏感性树脂组合物，其包含（P）具有在具有式（I）表示的重复单元（A）的树脂中，所述重复单元（A）能够在照射时在树脂的侧链上产生酸 光化射线或辐射，以及形成有光化射线敏感或辐射敏感性树脂组合物的抗蚀剂膜，以及图案形成方法，包括：使抗蚀剂膜曝光并显影曝光的抗蚀剂膜，以及半导体制造方法 包含图案形成方法的器件，以及通过半导体器件的制造方法制造的半导体器件。

公开(公告)号：US20240201589A1

公开(公告)日：2024-06-20

申请号：US18418331

申请日：2024-01-21

Applicant: FUJIFILM Corporation

Inventor： Takeshi KAWABATA ,  Minoru UEMURA ,  Tomotaka TSUCHIMURA

IPC: G03F7/004 ,  C07C25/18 ,  C07C43/225 ,  C07C309/07 ,  C07C309/11 ,  C07C311/09 ,  C07C381/12 ,  C07D295/26 ,  C07D327/06 ,  G03F7/038 ,  G03F7/039

CPC classification number: G03F7/0045 ,  C07C25/18 ,  C07C43/225 ,  C07C309/07 ,  C07C309/11 ,  C07C311/09 ,  C07C381/12 ,  C07D295/26 ,  C07D327/06 ,  G03F7/038 ,  G03F7/039

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition containing a compound (I) that generates an acid upon irradiation with actinic rays or radiation, the compound (I) having at least two acid anionic groups and cationic groups equal in number to the acid anionic groups. At least one of the acid anionic groups and at least one of the cationic groups are linked via covalent bonding, and at least two acid groups generated from the compound (I) upon irradiation with the actinic rays or radiation include at least two acid groups having different acid dissociation constants (pKa).

公开(公告)号：US20240192592A1

公开(公告)日：2024-06-13

申请号：US18421949

申请日：2024-01-24

Applicant: FUJIFILM Corporation

Inventor： Takeshi KAWABATA ,  Minoru UEMURA ,  Tomotaka TSUCHIMURA

IPC: G03F7/004 ,  C07C25/18 ,  C07C43/225 ,  C07C309/07 ,  C07C309/11 ,  C07C309/12 ,  C07C309/17 ,  C07C311/09 ,  C07C381/12 ,  C07D327/06 ,  G03F7/038 ,  G03F7/039

CPC classification number: G03F7/0045 ,  C07C25/18 ,  C07C43/225 ,  C07C309/07 ,  C07C309/11 ,  C07C309/12 ,  C07C309/17 ,  C07C311/09 ,  C07C381/12 ,  C07D327/06 ,  G03F7/038 ,  G03F7/039

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition contains a compound (I) that generates an acid upon irradiation with actinic rays or radiation and has an ionic structure and a zwitterionic structure. A pattern forming method contains forming an actinic ray-sensitive or radiation-sensitive film on a substrate using the actinic ray-sensitive or radiation-sensitive resin composition, exposing the actinic ray-sensitive or radiation-sensitive film to light; and developing the exposed actinic ray-sensitive or radiation-sensitive film with a developer.

公开(公告)号：US20180222164A1

公开(公告)日：2018-08-09

申请号：US15940321

申请日：2018-03-29

Applicant: FUJIFILM Corporation

Inventor： Yu IWAI ,  Takeshi KAWABATA ,  Akinori SHIBUYA

IPC: B32B27/08 ,  H01L23/14 ,  G03F7/038 ,  B32B27/28 ,  B32B15/08 ,  B32B15/20

Abstract: Provided is a laminate that excels in adhesion among a plurality of resin layers formed as insulating layers containing polyimide and so forth, a method for manufacturing the laminate, a semiconductor device, and, a method for manufacturing the semiconductor device. The laminate comprises a substrate, and at least two resin layers, each of the resin layers is independently brought into contact, in at least a part of the surface thereof, with other resin layer, and the layers independently has a Young's modulus exceeding 2.8 GPa and not exceeding 5.0 GPa, and, an elongation after fracture exceeding 50% and not exceeding 200%, and further has a three-dimensional radical crosslinked structure, and at least one of the resin layers contains at least either polyimide or polybenzoxazole.