公开(公告)号：US20060163685A1

公开(公告)日：2006-07-27

申请号：US10905905

申请日：2005-01-26

申请人： Fen Chen ,  Cathryn Christiansen ,  Richard Kontra ,  Tom Lee ,  Alvin Strong ,  Timothy Sullivan ,  Joseph Therrien

发明人： Fen Chen ,  Cathryn Christiansen ,  Richard Kontra ,  Tom Lee ,  Alvin Strong ,  Timothy Sullivan ,  Joseph Therrien

IPC分类号： H01L29/00 ,  H01L21/00

CPC分类号： H01L23/5256 ,  H01L2924/0002 ,  H01L2924/00

摘要： A thermo-mechanical cleavable structure is provided and may be used as a programmable fuse for integrated circuits. As applied to a programmable fuse, the thermo-mechanical cleavable structure includes an electrically conductive cleavable layer adjacent to a thermo-mechanical stressor. As electricity is passed through the cleavable layer, the cleavable layer and the thermo-mechanical stressor are heated and gas evolves from the thermo-mechanical stressor. The gas locally insulates the thermo-mechanical stressor, causing local melting adjacent to the bubbles in the thermo-mechanical stressor and the cleavable structure forming cleaving sites. The melting also interrupts the current flow through the cleavable structure so the cleavable structure cools and contracts. The thermo-mechanical stressor also contracts due to a phase change caused by the evolution of gas therefrom. As the thermo-mechanical cleavable structure cools, the cleaving sites expand causing gaps to be permanently formed therein.

摘要翻译： 提供了一种热机械可切割结构，可用作集成电路的可编程保险丝。 如应用于可编程保险丝，热机械可切割结构包括与热机械应力源相邻的导电可切割层。 当电通过可切割层时，可切割层和热机械应力器被加热并且气体从热机械应力源逸出。 气体将热机械应力局部绝缘，导致邻近热机械应力的气泡局部熔化，形成裂开位置的可切割结构。 熔化还中断当前通过可切割结构的流动，因此可切割结构冷却和收缩。 热机械应力还由于由其产生的气体引起的相变而收缩。 当热机械可裂解结构冷却时，裂解位置膨胀，导致间隙永久形成。

公开(公告)号：US20070051875A1

公开(公告)日：2007-03-08

申请号：US11161941

申请日：2005-08-23

申请人： Fen Chen ,  Richard Kontra ,  Tom Lee ,  Theodore Levin ,  Christopher Muzzy ,  Timothy Sullivan

发明人： Fen Chen ,  Richard Kontra ,  Tom Lee ,  Theodore Levin ,  Christopher Muzzy ,  Timothy Sullivan

IPC分类号： H01J40/14 ,  H01L31/00

CPC分类号： G11C13/0009 ,  G11C13/0004 ,  G11C13/004 ,  G11C13/04 ,  G11C13/047 ,  G11C2013/0054 ,  H01L45/1213 ,  H01L45/145

摘要： A structure and a method for operating the same. The method comprises providing a resistive/reflective region on a substrate, wherein the resistive/reflective region comprises a material having a characteristic of changing the material's reflectance due to the material absorbing heat; sending an electric current through the resistive/reflective region so as to cause a reflectance change in the resistive/reflective region from a first reflectance value to a second reflectance value different from the first reflectance value; and optically reading the reflectance change in the resistive/reflective region.

摘要翻译： 一种结构及其操作方法。 该方法包括在衬底上提供电阻/反射区域，其中电阻/反射区域包括具有由于材料吸收热而改变材料的反射率的特性的材料; 发送电流通过电阻/反射区域，以使电阻/反射区域的反射率变化从第一反射率值到不同于第一反射率值的第二反射率值; 并且光学地读取电阻/反射区域中的反射率变化。

公开(公告)号：US20080061902A1

公开(公告)日：2008-03-13

申请号：US11942396

申请日：2007-11-19

申请人： Fen Chen ,  Kai Feng ,  Robert Gautheir ,  Tom Lee

发明人： Fen Chen ,  Kai Feng ,  Robert Gautheir ,  Tom Lee

IPC分类号： H03H7/38

CPC分类号： H03K19/018571

摘要： A method for trimming impedance matching devices in high-speed circuits includes determining an electrical parameter associated with a first tantalum nitride (TaN) resistor used as an impedance matching device in the circuit under test, and comparing the determined electrical parameter associated with the first TaN resistor to a desired design value of the electrical parameter. The resistance value of the first TaN resistor is altered by application of a trimming voltage thereto, wherein the trimming voltage is based on a voltage-resistance characteristic curve of the first TaN resistor. It is then determined whether the altered resistance value of the first TaN resistor causes the electrical parameter to equal the desired design value thereof, and the altering of the resistance value of the first TaN resistor by application of a trimming voltage is repeated until the electrical parameter equals the desired design value thereof.

公开(公告)号：US20070115018A1

公开(公告)日：2007-05-24

申请号：US11163948

申请日：2005-11-04

申请人： Kaushik Chanda ,  Birendra Agarwala ,  Lawrence Clevenger ,  Andrew Cowley ,  Ronald Filippi ,  Jason Gill ,  Tom Lee ,  Baozhen Li ,  Paul McLaughlin ,  Du Nguyen ,  Hazara Rathore ,  Timothy Sullivan ,  Chih-Chao Yang

发明人： Kaushik Chanda ,  Birendra Agarwala ,  Lawrence Clevenger ,  Andrew Cowley ,  Ronald Filippi ,  Jason Gill ,  Tom Lee ,  Baozhen Li ,  Paul McLaughlin ,  Du Nguyen ,  Hazara Rathore ,  Timothy Sullivan ,  Chih-Chao Yang

IPC分类号： G01R31/26

CPC分类号： G01R31/2858 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： A microelectronic element such as a chip or microelectronic wiring substrate is provided which includes a plurality of conductive interconnects for improved resistance to thermal stress. At least some of the conductive interconnects include a metallic plate, a metallic connecting line and an upper metallic via. The metallic connecting line has an upper surface at least substantially level with an upper surface of the metallic plate, an inner end connected to the metallic plate at one of the peripheral edges, and an outer end horizontally displaced from the one peripheral edge. The metallic connecting line has a width much smaller than the width of the one peripheral edge of the metallic plate and has length greater than the width of the one peripheral edge. The upper metallic via has a bottom end in contact with the metallic connecting line at a location that is horizontally displaced from the one peripheral edge by at least about 3 microns (μm).

摘要翻译： 提供了诸如芯片或微电子布线基板的微电子元件，其包括用于改善耐热应力的多个导电互连。 至少一些导电互连件包括金属板，金属连接线和上金属通孔。 所述金属连接线具有与所述金属板的上表面至少基本平齐的上表面，在所述周边边缘中的一个处连接到所述金属板的内端和从所述一个周边边缘水平移位的外端。 金属连接线的宽度远小于金属板的一个周边边缘的宽度，并且其长度大于一个周边边缘的宽度。 上金属通孔在与一个外围边缘水平位移至少约3微米（mum）的位置处具有与金属连接线接触的底端。

公开(公告)号：US20080107149A1

公开(公告)日：2008-05-08

申请号：US12004011

申请日：2007-12-19

申请人： Kaushik Chanda ,  Birendra Agarwala ,  Lawrence Clevenger ,  Andrew Cowley ,  Ronald Filippi ,  Jason Gill ,  Tom Lee ,  Baozhen Li ,  Paul McLaughlin ,  Du Nguyen ,  Hazara Rathore ,  Timothy Sullivan ,  Chih-Chao Yang

发明人： Kaushik Chanda ,  Birendra Agarwala ,  Lawrence Clevenger ,  Andrew Cowley ,  Ronald Filippi ,  Jason Gill ,  Tom Lee ,  Baozhen Li ,  Paul McLaughlin ,  Du Nguyen ,  Hazara Rathore ,  Timothy Sullivan ,  Chih-Chao Yang

IPC分类号： G01N25/72 ,  G01R31/26

CPC分类号： G01R31/2858 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： A microelectronic element such as a chip or microelectronic wiring substrate is provided which includes a plurality of conductive interconnects for improved resistance to thermal stress. At least some of the conductive interconnects include a metallic plate, a metallic connecting line and an upper metallic via. The metallic connecting line has an upper surface at least substantially level with an upper surface of the metallic plate, an inner end connected to the metallic plate at one of the peripheral edges, and an outer end horizontally displaced from the one peripheral edge. The metallic connecting line has a width much smaller than the width of the one peripheral edge of the metallic plate and has length greater than the width of the one peripheral edge. The upper metallic via has a bottom end in contact with the metallic connecting line at a location that is horizontally displaced from the one peripheral edge by at least about 3 microns (μm).

摘要翻译： 提供了诸如芯片或微电子布线基板的微电子元件，其包括用于改善耐热应力的多个导电互连。 至少一些导电互连件包括金属板，金属连接线和上金属通孔。 所述金属连接线具有与所述金属板的上表面至少基本平齐的上表面，在所述周边边缘中的一个处连接到所述金属板的内端和从所述一个周边边缘水平移位的外端。 金属连接线的宽度远小于金属板的一个周边边缘的宽度，并且其长度大于一个周边边缘的宽度。 上金属通孔在与一个外围边缘水平位移至少约3微米（mum）的位置处具有与金属连接线接触的底端。

公开(公告)号：US07700962B2

公开(公告)日：2010-04-20

申请号：US11564213

申请日：2006-11-28

申请人： James McKenzie ,  Tom Lee ,  Majd Zoorob

发明人： James McKenzie ,  Tom Lee ,  Majd Zoorob

IPC分类号： H01L33/00

CPC分类号： H01L33/20 ,  H01L2933/0083

摘要： A light-emitting device (LED) is described which exhibits high extraction efficiency and an emission profile which is substantially more directional than from a Lambertian source. The device comprises a light generating layer disposed between first and second layers of semiconductor material, each having a different type of doping. An upper surface of the first layer has a tiling arrangement of inverted pyramidal or inverted frustro-pyramidal indentations in the semiconductor material filled by a material of different refractive index and which together comprise a photonic band structure. The indentations and their tiling arrangement are configured for efficient extraction of light from the device via the upper surface of the first layer and in a beam that is substantially more directional than from a Lambertian source. An enhanced device employs a reflector beneath the second layer to utilise the microcavity effect. A method for fabricating the device is also described which employs anisotropic wet etching to produce the inverted pyramidal or inverted frustro-pyramidal indentations.

摘要翻译： 描述了一种发光装置（LED），其显示出高的提取效率和与朗伯源相比基本上更有方向性的发射分布。 该器件包括设置在第一和第二半导体材料层之间的发光层，每个具有不同类型的掺杂。 第一层的上表面在由不同折射率的材料填充并且一起包括光子带结构的半导体材料中具有倒棱锥体或反向截锥棱锥形凹陷的平铺布置。 压痕和它们的平铺布置被配置用于通过第一层的上表面和基本上比朗伯源更方向的光束有效地从装置提取光。 增强器件使用第二层下方的反射器来利用微腔效应。 还描述了一种用于制造该器件的方法，其采用各向异性湿法蚀刻以产生倒锥体或反向截锥棱锥形凹陷。

公开(公告)号：US08099681B2

公开(公告)日：2012-01-17

申请号：US12024722

申请日：2008-02-01

申请人： William J. Flanagan ,  Larry D. Auton ,  Keith B. Bingaman ,  Charles Fleischman ,  Philip M. Ginsberg ,  Robert Hargis ,  Tom Lee ,  Gary J. Murakami ,  David A. Radi ,  Kenneth R. Rodemann ,  Gerald C. Vogel ,  David M. Weimer

发明人： William J. Flanagan ,  Larry D. Auton ,  Keith B. Bingaman ,  Charles Fleischman ,  Philip M. Ginsberg ,  Robert Hargis ,  Tom Lee ,  Gary J. Murakami ,  David A. Radi ,  Kenneth R. Rodemann ,  Gerald C. Vogel ,  David M. Weimer

IPC分类号： G06F3/048

CPC分类号： G06F3/0481 ,  G06F17/30554

摘要： The present solution addresses the displaying of multiple levels of information in a constrained display footprint in a manner that allows a user to be vigilant over the information. Systems and methods are described herein for organizing data and information queries against data sources in a relational display with hierarchical grids, linked to query results, score displays, and alert monitoring. In an embodiment of the present solution, a system allows an analyst to view results and status from monitoring numerous and persistent queries against real-time data streams. Many of these queries may be inter-related and composed in a way to comprehensively analyze a problem. To display, monitor, and interact with a collection of queries, the present solution provides a relational display that makes use of a set of grids via a feature referred to as “grid of grids”. The grids may be arranged in a hierarchy of any number of levels. For example, the grids may be arranged as a directed acyclic graph to facilitate nesting of grids, in which the grids are expanded according to the complexity and levels of granularity in the decomposition of queries for a problem or domain of interest.

摘要翻译： 本解决方案以允许用户对信息警惕的方式解决在受限显示占用空间中显示多个级别的信息。 本文描述了系统和方法，用于组织针对与分层网格的关系显示中的数据源的数据和信息查询，链接到查询结果，分数显示和警报监视。 在本解决方案的一个实施例中，系统允许分析者从实时数据流监视多个持续查询来查看结果和状态。 这些查询中的许多可能是相互关联的，并以一种全面分析问题的方式组成。 为了显示，监视和与一组查询进行交互，本解决方案提供了一种关系显示，通过被称为“网格格网”的特征使用一组网格。 网格可以以任何级别的层次结构排列。 例如，网格可以被布置为有向非循环图，以便于网格的嵌套，其中根据对于问题或感兴趣的领域的查询的分解的复杂性和粒度级别来扩展网格。

公开(公告)号：US20070176295A1

公开(公告)日：2007-08-02

申请号：US11307325

申请日：2006-02-01

申请人： Anil Chinthakindi ,  Douglas Coolbaugh ,  Jason Gill ,  Douglas Kemerer ,  Tom Lee

发明人： Anil Chinthakindi ,  Douglas Coolbaugh ,  Jason Gill ,  Douglas Kemerer ,  Tom Lee

IPC分类号： H01L21/44

CPC分类号： H01L27/0688 ,  H01L23/5226 ,  H01L23/5228 ,  H01L27/016 ,  H01L28/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： A contact via scheme with staggered contact vias to, interalia, increase current density of a resistor by mitigating electromigration and reducing the resistive heating of each contact via is disclosed. The contact via scheme increases the current density of a thin film resistor by increasing the number of current carrying contact vias and by arranging the contact vias in staggered arrangement, which redistributes the current at the ends of the resistor. Hence, the contact via scheme decreases the current density per contact via and enables a higher maximum current density for the resistor. A method and a semiconductor device are also disclosed.

摘要翻译： 公开了一种具有交错通孔的接触通孔方案，通过减轻电迁移并降低每个接触通孔的电阻加热来增加电阻器的电流密度。 接触通孔方案通过增加载流接触通孔的数量并且通过以交错布置布置接触通孔来增加薄膜电阻器的电流密度，其重新分布电阻器末端处的电流。 因此，接触通孔方案降低了每个接触通孔的电流密度，并使得电阻器具有更高的最大电流密度。 还公开了一种方法和半导体器件。

公开(公告)号：US20060231945A1

公开(公告)日：2006-10-19

申请号：US10907873

申请日：2005-04-19

申请人： Anil Chinthakindi ,  Lawrence Clevenger ,  Tom Lee ,  Gerald Matusiewicz ,  Conal Murray ,  Chih-Chao Yang

发明人： Anil Chinthakindi ,  Lawrence Clevenger ,  Tom Lee ,  Gerald Matusiewicz ,  Conal Murray ,  Chih-Chao Yang

IPC分类号： H01L23/34

CPC分类号： H01L23/5228 ,  H01L23/3677 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure and method are disclosed for heat dissipation relative to a heat generating element in a semiconductor device. The structure includes a plurality of heat transmitting lines partially vertically coincidental with the heat generating element, and at least one interconnecting path from each heat transmitting line to a substrate of the semiconductor device. In one embodiment, the heat generating element includes a resistor in a non-first metal level. The invention is compatible with conventional BEOL interconnect schemes, minimizes the amount of heat transfer from the resistor to the surrounding interconnect wiring, thus eliminating the loss of current carrying capability in the wiring.

摘要翻译： 公开了相对于半导体器件中的发热元件的散热的结构和方法。 该结构包括多个与发热元件垂直一致的传热线，以及从每个传热线到半导体器件的基板的至少一个互连路径。 在一个实施例中，发热元件包括非第一金属水平的电阻器。 本发明与传统的BEOL互连方案兼容，使得从电阻器到周围互连布线的传热量最小化，从而消除了布线中的载流能力的损失。

公开(公告)号：US20050057079A1

公开(公告)日：2005-03-17

申请号：US10665065

申请日：2003-09-17

申请人： Tom Lee

发明人： Tom Lee

IPC分类号： A47C4/04 ,  A47C5/04 ,  A47C12/02 ,  B60N2/32

CPC分类号： A47C12/02 ,  A47C4/04 ,  A47C5/04

摘要： A multi-functional chair includes a seat having a front end and a rear end, a first foot having a top pivotally mounted to the front end of the seat, a second foot having a fastening portion and a top pivotally mounted to the rear end of the seat, a back having one end connected to the second foot, a first extension having a first end pivotally mounted to the front end of the seat, a second extension having one end pivotally mounted to a second end of the first extension, and a connection having one end pivotally mounted to the first foot at a position close to the top of the first foot. The connection also has fastening portions to be selectively fastened to the fastening portion of the second foot to from furniture with different functions.

摘要翻译： 多功能椅子包括具有前端和后端的座，第一脚具有枢转地安装在座椅前端的顶部，第二脚具有紧固部分和顶部枢转地安装到座椅的后端 所述座椅，具有连接到所述第二脚部的一端的后部，具有枢转地安装到所述座椅的前端的第一端的第一延伸部，具有枢转地安装到所述第一延伸部的第二端的一端的第二延伸部， 连接件，其一端在接近第一脚的顶部的位置枢转地安装到第一脚。 该连接件还具有紧固部分，以将其选择性地固定到第二脚的紧固部分，从而具有不同功能的家具。