Stackable programmable passive device and a testing method
    2.
    发明授权
    Stackable programmable passive device and a testing method 失效
    可堆叠可编程无源器件和测试方法

    公开(公告)号:US08749293B2

    公开(公告)日:2014-06-10

    申请号:US13529557

    申请日:2012-06-21

    IPC分类号: G06G7/19 H01L29/00

    摘要: A programmable passive device comprising a first node and a second node. A plurality of passive device elements electrically coupled to the first node. A plurality of switches are electrically coupled to at least the second node and selectively coupled to a number of the plurality of passive device elements to provide the programmable passive device with a pre-determined value.

    摘要翻译: 一种包括第一节点和第二节点的可编程无源设备。 电耦合到第一节点的多个无源器件元件。 多个开关电耦合到至少第二节点并且选择性地耦合到多个无源器件元件,以向可编程无源器件提供预定值。

    STACKABLE PROGRAMMABLE PASSIVE DEVICE AND A TESTING METHOD
    3.
    发明申请
    STACKABLE PROGRAMMABLE PASSIVE DEVICE AND A TESTING METHOD 失效
    可堆叠可编程被动设备和测试方法

    公开(公告)号:US20120261724A1

    公开(公告)日:2012-10-18

    申请号:US13529557

    申请日:2012-06-21

    IPC分类号: H01L23/52 H01L21/326

    摘要: A programmable passive device comprising a first node and a second node. A plurality of passive device elements electrically coupled to the first node. A plurality of switches are electrically coupled to at least the second node and selectively coupled to a number of the plurality of passive device elements to provide the programmable passive device with a pre-determined value.

    摘要翻译: 一种包括第一节点和第二节点的可编程无源设备。 电耦合到第一节点的多个无源器件元件。 多个开关电耦合到至少第二节点并且选择性地耦合到多个无源器件元件,以向可编程无源器件提供预定值。

    Non-destructive evaluation of microstructure and interface roughness of electrically conducting lines in semiconductor integrated circuits in deep sub-micron regime
    4.
    发明授权
    Non-destructive evaluation of microstructure and interface roughness of electrically conducting lines in semiconductor integrated circuits in deep sub-micron regime 有权
    在深亚微米体系的半导体集成电路中的导电线的微结构和界面粗糙度的非破坏性评估

    公开(公告)号:US07500208B2

    公开(公告)日:2009-03-03

    申请号:US11673369

    申请日:2007-02-09

    IPC分类号: G06F17/50 G01R31/26

    摘要: Novel structures and methods for evaluating lines in semiconductor integrated circuits. A first plurality of lines are formed on a wafer each of which includes multiple line sections. All the line sections are of the same length. The electrical resistances of the line sections are measured. Then, a first line geometry adjustment is determined based on the electrical resistances of all the sections. The first line geometry adjustment represents an effective reduction of cross-section size of the lines due to grain boundary electrical resistance. A second plurality of lines of same length and thickness can be formed on the same wafer. Then, second and third line geometry adjustments are determined based on the electrical resistances of these lines measured at different temperatures. The second and third line geometry adjustments represent an effective reduction of cross-section size of the lines due to grain boundary electrical resistance and line surface roughness.

    摘要翻译: 用于评估半导体集成电路中的线路的新型结构和方法。 在每个包括多个线段的晶片上形成第一组多条线。 所有线段长度相同。 测量线路段的电阻。 然后,基于所有部分的电阻来确定第一行几何调整。 第一行几何调整表示由于晶界电阻而导致的线的横截面尺寸的有效减小。 相同长度和厚度的第二组多条线可以形成在同一晶片上。 然后,基于在不同温度下测量的这些线的电阻来确定第二和第三线几何调整。 第二和第三线几何调整表示由于晶界电阻和线表面粗糙度导致的线的横截面尺寸的有效减小。

    Determination of grain sizes of electrically conductive lines in semiconductor integrated circuits
    5.
    发明授权
    Determination of grain sizes of electrically conductive lines in semiconductor integrated circuits 有权
    确定半导体集成电路中导电线的晶粒尺寸

    公开(公告)号:US07231617B2

    公开(公告)日:2007-06-12

    申请号:US10711418

    申请日:2004-09-17

    IPC分类号: G06F17/50

    摘要: Novel structures and methods for evaluating lines in semiconductor integrated circuits. A first plurality of lines can be formed on a wafer each of which comprises multiple line sections. All the line sections are of the same length. The electrical resistances of the line sections are measured. Then, a first line geometry adjustment is determined based on the electrical resistances of all the sections of all the lines. The first line geometry adjustment represents an effective reduction of cross-section size of the lines due to grain boundary electrical resistance. A second plurality of lines of same length and thickness can be formed on the same wafer. Then, second and third line geometry adjustments can be determined based on the electrical resistances of these lines measured at different temperatures. The second and third line geometry adjustments represent an effective reduction of cross-section size of the lines due to grain boundary electrical resistance and line surface roughness.

    摘要翻译: 用于评估半导体集成电路中的线路的新型结构和方法。 可以在每个包括多个线段的晶片上形成第一组多条线。 所有线段长度相同。 测量线路段的电阻。 然后,基于所有线的所有部分的电阻来确定第一线几何形状调整。 第一行几何调整表示由于晶界电阻而导致的线的横截面尺寸的有效减小。 相同长度和厚度的第二组多条线可以形成在同一晶片上。 然后,可以基于在不同温度下测量的这些线的电阻来确定第二和第三线几何调整。 第二和第三线几何调整表示由于晶界电阻和线表面粗糙度导致的线的横截面尺寸的有效减小。

    3D via capacitor with a floating conductive plate for improved reliability
    7.
    发明授权
    3D via capacitor with a floating conductive plate for improved reliability 有权
    3D通过具有浮动导电板的电容器,以提高可靠性

    公开(公告)号:US08405135B2

    公开(公告)日:2013-03-26

    申请号:US12898340

    申请日:2010-10-05

    IPC分类号: H01L27/108

    摘要: The present invention provides a 3D via capacitor and a method for forming the same. The capacitor includes an insulating layer on a substrate. The insulating layer has a via having sidewalls and a bottom. A first electrode overlies the sidewalls and at least a portion of the bottom of the via. A first high-k dielectric material layer overlies the first electrode. A first conductive plate is over the first high-k dielectric material layer. A second high-k dielectric material layer overlies the first conductive plate and leaves a remaining portion of the via unfilled. A second electrode is formed in the remaining portion of the via. The first conductive plate is substantially parallel to the first electrode and is not in contact with the first and second electrodes. An array of such 3D via capacitors is also provided.

    摘要翻译: 本发明提供一种3D通孔电容器及其形成方法。 电容器包括在基板上的绝缘层。 绝缘层具有通孔,其具有侧壁和底部。 第一电极覆盖通孔的侧壁和底部的至少一部分。 第一高k电介质材料层覆盖在第一电极上。 第一导电板在第一高k电介质材料层之上。 第二高k电介质材料层覆盖在第一导电板上并留下未填充的通孔的剩余部分。 在通孔的剩余部分中形成第二电极。 第一导电板基本上平行于第一电极并且不与第一和第二电极接触。 还提供了这种3D通孔电容器的阵列。

    STACKABLE PROGRAMMABLE PASSIVE DEVICE AND A TESTING METHOD
    8.
    发明申请
    STACKABLE PROGRAMMABLE PASSIVE DEVICE AND A TESTING METHOD 有权
    可堆叠可编程被动设备和测试方法

    公开(公告)号:US20070103228A1

    公开(公告)日:2007-05-10

    申请号:US11161932

    申请日:2005-08-23

    IPC分类号: H01L25/00

    摘要: A programmable passive device comprising a first node and a second node. A plurality of passive device elements electrically coupled to the first node. A plurality of switches are electrically coupled to at least the second node and selectively coupled to a number of the plurality of passive device elements to provide the programmable passive device with a pre-determined value.

    摘要翻译: 一种包括第一节点和第二节点的可编程无源设备。 电耦合到第一节点的多个无源器件元件。 多个开关电耦合到至少第二节点并且选择性地耦合到多个无源器件元件,以向可编程无源器件提供预定值。

    Stackable programmable passive device and a testing method
    10.
    发明授权
    Stackable programmable passive device and a testing method 有权
    可堆叠可编程无源器件和测试方法

    公开(公告)号:US08294505B2

    公开(公告)日:2012-10-23

    申请号:US11161932

    申请日:2005-08-23

    IPC分类号: G06G7/19 H01L29/00

    摘要: A programmable passive device comprising a first node and a second node. A plurality of passive device elements electrically coupled to the first node. A plurality of switches are electrically coupled to at least the second node and selectively coupled to a number of the plurality of passive device elements to provide the programmable passive device with a pre-determined value.

    摘要翻译: 一种包括第一节点和第二节点的可编程无源设备。 电耦合到第一节点的多个无源器件元件。 多个开关电耦合到至少第二节点并且选择性地耦合到多个无源器件元件,以向可编程无源器件提供预定值。