公开(公告)号：US20160268223A1

公开(公告)日：2016-09-15

申请号：US14644473

申请日：2015-03-11

Applicant: Flipchip International LLC

Inventor： Guy F. Burgess ,  Theodore Gerard Tessier ,  Anthony Paul Curtis ,  Lillian Charell Thompson

IPC: H01L23/00

CPC classification number: H01L24/11 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/03426 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05172 ,  H01L2224/05184 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05672 ,  H01L2224/05684 ,  H01L2224/1132 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/11505 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/11902 ,  H01L2224/13006 ,  H01L2224/13007 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/132 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13301 ,  H01L2224/13305 ,  H01L2224/13309 ,  H01L2224/13311 ,  H01L2224/13313 ,  H01L2224/13316 ,  H01L2224/13318 ,  H01L2224/1332 ,  H01L2224/13324 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13364 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2924/00015 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01048 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/381 ,  H01L2224/11462 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/034 ,  H01L2224/036

Abstract: The subject matter contained herein discloses methods for forming a vertical metallic pillar overlying an under bump metal pad further overlying a semiconductor substrate, and applying a discrete solder cap on a top surface of the pillar, wherein the metallic pillar is defined by at least one photoresist layer. The method includes heating a multi-element metallic paste containing a variable amount of metallic powder, a melting point depressant and a flux such that the metal powder sinters to form the metallic pillar and simultaneously adheres the metallic pillar to the underbump metal pad.

Abstract translation: 本文包含的主题公开了用于形成垂直金属柱的方法，所述垂直金属柱覆盖在半导体衬底上的下凸块金属焊盘上，并且在柱的顶表面上施加分立的焊料帽，其中金属柱由至少一个光致抗蚀剂 层。 该方法包括加热含有可变量的金属粉末，熔点降低剂和助熔剂的多元素金属膏，使得金属粉末烧结形成金属柱，同时将金属柱粘附到底部金属垫上。