Tightness test for MEMS or for small encapsulated components
    1.
    发明授权
    Tightness test for MEMS or for small encapsulated components 有权
    用于MEMS或小封装元件的密封性测试

    公开(公告)号:US07572053B2

    公开(公告)日:2009-08-11

    申请号:US11630471

    申请日:2005-06-29

    IPC分类号: G01K1/00 G01K7/00

    CPC分类号: G01M3/002 G01M3/3281

    摘要: A tightness testing method for a MEMS or small encapsulated component, the MEMS or small component being housed in a cavity of a carrier. The cavity being sealed and containing a gas having a different density to the density it would have if subjected to the pressure of the medium outside the cavity. The method measures the density of the gas contained in the cavity.

    摘要翻译: 用于MEMS或小封装部件的密封性测试方法,MEMS或小部件被容纳在载体的空腔中。 空腔被密封并且包含具有与其在空腔外部的介质的压力相同的密度的密度的气体。 该方法测量腔体中所含气体的密度。

    Tightness Test for Mems or for Small Encapsulated Components
    2.
    发明申请
    Tightness Test for Mems or for Small Encapsulated Components 有权
    Mems或小型封装组件的密封性测试

    公开(公告)号:US20070234782A1

    公开(公告)日:2007-10-11

    申请号:US11630471

    申请日:2005-06-29

    IPC分类号: G01N25/18

    CPC分类号: G01M3/002 G01M3/3281

    摘要: A tightness testing method for a MEMS or small encapsulated component, the MEMS or small component being housed in a cavity of a carrier. The cavity being sealed and containing a gas having a different density to the density it would have if subjected to the pressure of the medium outside the cavity. The method measures the density of the gas contained in the cavity.

    摘要翻译: 用于MEMS或小封装部件的密封性测试方法,MEMS或小部件被容纳在载体的空腔中。 空腔被密封并且包含具有与其在空腔外部的介质的压力相同的密度的密度的气体。 该方法测量腔体中所含气体的密度。

    Gyrometer with reduced parasitic capacitances
    3.
    发明授权
    Gyrometer with reduced parasitic capacitances 有权
    降低寄生电容的Gyrometer

    公开(公告)号:US09448070B2

    公开(公告)日:2016-09-20

    申请号:US13459618

    申请日:2012-04-30

    CPC分类号: G01C19/5762 G01C19/5712

    摘要: Gyrometer including a substrate and an inertial mass suspended above the substrate, the inertial mass including an excitation part and a detection part, means of moving the excitation part is movable in at least one direction contained in the plane of the inertial mass, and capacitive detection device detecting movement of the detection part outside the plane of the mass. The capacitive detection device includes comprising at least one suspended electrode, located above the detection part located facing the substrate so as to form a variable capacitor with the detection part, the electrode being held above the detection part by at least one pillar passing through the inertial mass.

    摘要翻译: 包括衬底和悬浮在衬底上的惯性块的测微计,包括激励部分和检测部分的惯性质量块,使激发部分移动的装置可以在包含在惯性质量平面中的至少一个方向上移动,并且电容检测 设备检测检测部件在质量平面外的运动。 所述电容检测装置包括至少一个悬置电极,位于所述检测部分的与所述基板相对的位置上,以便与所述检测部分形成可变电容器,所述电极通过至少一个通过所述惯性的柱的所述检测部分 质量

    CAVITY CLOSURE PROCESS FOR AT LEAST ONE MICROELECTRONIC DEVICE
    4.
    发明申请
    CAVITY CLOSURE PROCESS FOR AT LEAST ONE MICROELECTRONIC DEVICE 有权
    用于至少一个微电子设备的密封闭合过程

    公开(公告)号:US20100190301A1

    公开(公告)日:2010-07-29

    申请号:US12693867

    申请日:2010-01-26

    IPC分类号: H01L21/60 H01L21/56

    摘要: A process for closure of at least one cavity intended to encapsulate or be part of a microelectronic device, comprising the following steps: a) Producing a cavity in a first substrate comprising a first layer traversed by an opening forming an access to the cavity; b) Producing a portion of bond material around the opening, on a surface of the first layer located on the side opposite the cavity; c) Producing, on a second substrate, a portion of fusible material, with a deposition of the fusible material on the second substrate and the use of a mask; d) Placing the portion of fusible material in contact with the portion of bond material; e) Forming a plug for the opening, which adheres to the portion of bond material, by melting and then solidification of the fusible material; f) Separating the plug and the second substrate.

    摘要翻译: 用于封闭旨在封装或成为微电子器件的一部分的至少一个空腔的方法,包括以下步骤:a)在第一衬底中产生空腔,该第一衬底包括由开口形成的第一层,形成对腔的通路; b)在位于与空腔相对的一侧的第一层的表面上,在开口周围产生粘合材料的一部分; c)在第二基板上产生可熔材料的一部分,在第二基板上沉积可熔材料并使用掩模; d)将可熔材料的一部分放置在与粘合材料部分接触的位置; e)通过熔化然后固化可熔材料,形成粘合到粘合材料部分上的开口的塞子; f)分离插头和第二基板。

    HETEROGENEOUS SUBSTRATE INCLUDING A SACRIFICIAL LAYER, AND A METHOD OF FABRICATING IT
    5.
    发明申请
    HETEROGENEOUS SUBSTRATE INCLUDING A SACRIFICIAL LAYER, AND A METHOD OF FABRICATING IT 有权
    异质基底包括一个非常复杂的层,以及一种制造它的方法

    公开(公告)号:US20090325335A1

    公开(公告)日:2009-12-31

    申请号:US12488854

    申请日:2009-06-22

    IPC分类号: H01L21/302 H01L21/02

    摘要: The invention relates to a method of making a component from a heterogeneous substrate comprising first and second portions in at least one monocrystalline material, and a sacrificial layer constituted by at least one stack of at least one layer of monocrystalline Si situated between two layers of monocrystalline SiGe, the stack being disposed between said first and second portions of monocrystalline material, wherein the method consists in etching said stack by making: e) at least one opening in the first and/or second portion and the first and/or second layer of SiGe so as to reach the layer of Si; and f) eliminating all or part of the layer of Si.

    摘要翻译: 本发明涉及一种从包含至少一种单晶材料中的第一和第二部分的异质衬底制备组分的方法,以及由位于两层单晶之间的至少一层单晶硅的至少一个叠层构成的牺牲层 SiGe,堆叠设置在单晶材料的第一和第二部分之间,其中该方法包括通过以下步骤蚀刻所述堆叠:e)在第一和/或第二部分中的至少一个开口,以及第一和/ SiGe,以达到Si层; 和f)消除Si的全部或部分层。

    Microsystem, more particularly microgyrometer, with capacitive electrode detection element
    6.
    发明授权
    Microsystem, more particularly microgyrometer, with capacitive electrode detection element 有权
    具有电容电极检测元件的微系统,尤其是微计量器

    公开(公告)号:US07631558B2

    公开(公告)日:2009-12-15

    申请号:US11889182

    申请日:2007-08-09

    申请人: Bernard Diem

    发明人: Bernard Diem

    IPC分类号: G01P9/04

    CPC分类号: G01C19/5747

    摘要: The microgyrometer is provided in a flat substrate and comprises detection means for detecting the movement of two oscillating masses in a measuring direction perpendicular to an excitation direction. The detection means comprise an excitation frame associated with each oscillating mass and a mobile detection element surrounded by a corresponding excitation frame and comprising a plurality of mobile electrodes, and first and second sets of interconnected fixed electrodes fixedly secured to the substrate on which they are formed. Each mobile electrode is disposed between associated fixed electrodes of the first and second sets to form two variable differential capacitors. The fixed electrodes of each set are interconnected by means of interconnection bars made of electrically conducting material extending above the fixed electrodes in a plane substantially parallel to the substrate.

    摘要翻译: 微型计量器设置在平坦基板中,并且包括检测装置,用于检测垂直于激励方向的测量方向上的两个振荡块的移动。 检测装置包括与每个振动质量块相关联的激励框架和由对应的激励框架包围并包括多个移动电极的移动检测元件以及固定地固定到其上形成基板的第一组和第二组互连的固定电极 。 每个移动电极设置在第一和第二组的相关联的固定电极之间以形成两个可变差分电容器。 每组的固定电极通过在基本上平行于衬底的平面中在固定电极上方延伸的导电材料制成的互连条相互连接。

    Method and zone for sealing between two microstructure substrates
    7.
    发明申请
    Method and zone for sealing between two microstructure substrates 有权
    两个微结构基片之间密封的方法和区域

    公开(公告)号:US20070122929A1

    公开(公告)日:2007-05-31

    申请号:US10500196

    申请日:2002-12-17

    IPC分类号: H01L21/00

    CPC分类号: B81B7/0077

    摘要: The invention concerns a sealing zone between two microstructure substrates. Said sealing zone comprises at least the following parts: on a first wafer level (20), a lower edging (22A) made of an adhesive material capable of causing the first substrate (20) to adhere to a sealing material, said sealing material being adapted to spontaneously diffuse jointly with the material of the second wafer level (30); on said lower edging (22A), a layer of said sealing material; and on said layer of sealing material, a protuberance (36) formed on said second wafer level (30) containing a certain amount of sealing material. The invention is applicable to microstructures comprising vacuum-operated components.

    摘要翻译: 本发明涉及两个微结构基片之间的密封区。 所述密封区至少包括以下部分:在第一晶片级(20)上,由能够使第一基板(20)粘附到密封材料上的粘合材料制成的下边缘(22A),所述密封材料 适于与第二晶片级(30)的材料共同扩散; 在所述下边缘(22A)上形成一层所述密封材料; 并且在所述密封材料层上形成有包含一定量的密封材料的所述第二晶片级(30)上的突起(36)。 本发明适用于包括真空操作部件的微结构。

    GYROMETER WITH REDUCED PARASITIC CAPACITANCES
    8.
    发明申请
    GYROMETER WITH REDUCED PARASITIC CAPACITANCES 有权
    具有减少的PARASIIC电容的GYROMETER

    公开(公告)号:US20120279299A1

    公开(公告)日:2012-11-08

    申请号:US13459618

    申请日:2012-04-30

    IPC分类号: G01P15/14 H05K13/00

    CPC分类号: G01C19/5762 G01C19/5712

    摘要: Gyrometer comprising a substrate and an inertial mass suspended above the substrate, the inertial mass comprising an excitation part and a detection part, means of moving the excitation part in at least one direction contained in the plane of said inertial mass, and capacitive detection means detecting movement of said detection part outside the plane of said mass, said capacitive detection means comprising at least one suspended electrode, located above the detection part located facing the substrate so as to form a variable capacitor with said detection part, said electrode being held above said detection part by at least one pillar passing through the inertial mass.

    摘要翻译: 气液分析仪包括基板和悬浮在基板上方的惯性质量块,惯性质量块包括激励部分和检测部分,在包含在所述惯性质量平面中的至少一个方向上移动激发部分的装置,以及电容检测装置检测装置 所述检测部件在所述质量平面外移动,所述电容性检测装置包括至少一个悬置电极,位于面向衬底的检测部分上方,以便与所述检测部分形成可变电容器,所述电极保持在所述检测部分上方 通过至少一个通过惯性块的支柱的检测部分。

    Method of fabricating an electromechanical device including at least one active element
    9.
    发明授权
    Method of fabricating an electromechanical device including at least one active element 有权
    制造包括至少一个有源元件的机电装置的方法

    公开(公告)号:US08076169B2

    公开(公告)日:2011-12-13

    申请号:US12488882

    申请日:2009-06-22

    IPC分类号: H01L21/00

    摘要: The invention relates to a method of fabricating an electromechanical device including an active element, wherein the method comprises the following steps:a) making a monocrystalline first stop layer on a monocrystalline layer of a first substrate;b) growing a monocrystalline mechanical layer epitaxially on said first stop layer out of at least one material that is different from that of the stop layer;c) making a sacrificial layer on said active layer out of a material that is suitable for being etched selectively relative to said mechanical layer;d) making a bonding layer on the sacrificial layer;e) bonding a second substrate on the bonding layer; andf) eliminating the first substrate and the stop layer to reveal the surface of the mechanical layer opposite from the sacrificial layer, the active element being made by at least a portion of the mechanical layer.

    摘要翻译: 本发明涉及一种制造包括有源元件的机电装置的方法,其中该方法包括以下步骤:a)在第一衬底的单晶层上制备单晶第一阻挡层; b)在所述第一停止层上外延生长至少一种不同于所述停止层的材料的单晶机械层; c)在适合于相对于所述机械层选择性蚀刻的材料中在所述有源层上制造牺牲层; d)在牺牲层上形成结合层; e)在接合层上粘合第二衬底; 以及f)消除所述第一衬底和所述阻挡层以露出与所述牺牲层相对的所述机械层的表面,所述有源元件由所述机械层的至少一部分制成。

    METHOD OF FABRICATING A MEMS/NEMS ELECTROMECHANICAL COMPONENT
    10.
    发明申请
    METHOD OF FABRICATING A MEMS/NEMS ELECTROMECHANICAL COMPONENT 有权
    制造MEMS / NEMS电子元件的方法

    公开(公告)号:US20100029031A1

    公开(公告)日:2010-02-04

    申请号:US12488898

    申请日:2009-06-22

    IPC分类号: H01L21/18

    摘要: The invention relates to a method of fabricating and electromechanical device on at least one substrate, the device including at least one active element and wherein the method comprises: a) making a heterogeneous substrate comprising a first portion, an interface layer, and a second portion, the first portion including one or more buried zones sandwiched between first and second regions formed in a first monocrystalline material, the first region extending to the surface of the first portion, and the second region extending to the interface layer, at least one said buried zone being made at least in part out of a second monocrystalline material so as to make it selectively attackable relative to the first and second regions; b) making openings from the surface of the first portion and through the first region, which openings open out to at least one said buried zone; and c) etching at least part of at least one buried zone to form at least one cavity so as to define at least one active element that is at least a portion of the second region between a said cavity and said interface layer; and wherein the first and second portions of the substrate are constituted respectively from first and second substrates that are assembled together by bonding, at least one of them including at least one said interface layer over at least a fraction of its surface.

    摘要翻译: 本发明涉及在至少一个基板上制造和机电装置的方法,所述装置包括至少一个有源元件,并且其中所述方法包括:a)制造包含第一部分,界面层和第二部分 ,所述第一部分包括被夹在形成于第一单晶材料中的第一和第二区域之间的一个或多个掩埋区域,所述第一区域延伸到所述第一部分的表面,并且所述第二区域延伸到所述界面层,所述第二区域延伸至所述界面层, 区域至少部分地由第二单晶材料制成,以使其相对于第一和第二区域选择性地被破坏; b)从所述第一部分的表面和所述第一区域制造开口,所述第一区域开放到至少一个所述掩埋区域; 以及c)蚀刻至少一个掩埋区的至少一部分以形成至少一个空腔,以便限定至少一个有源元件,所述至少一个有源元件是所述空腔和所述界面层之间的所述第二区域的至少一部分; 并且其中所述基底的第一和第二部分分别由通过粘合而组装在一起的第一和第二基底构成,其中至少一个在其表面的至少一部分上包括至少一个所述界面层。