摘要:
A method, apparatus, system, and device provide the ability to form one or more solder bumps on one or more materials. The solder bumps are reflowed. During the reflowing, the solder bumps are monitored in real time. The reflow is controlled in real time, thereby controlling a morphology of each of the solder bumps. Further, the wetting of the solder bumps to a surface of the materials is controlled in real time.
摘要:
A method and device for imaging or detecting electromagnetic radiation is provided. A device structure includes a first chip interconnected with a second chip. The first chip includes a detector array, wherein the detector array comprises a plurality of light sensors and one or more transistors. The second chip includes a Read Out Integrated Circuit (ROIC) that reads out, via the transistors, a signal produced by the light sensors. A number of interconnects between the ROIC and the detector array can be less than one per light sensor or pixel.
摘要:
A method and device for imaging or detecting electromagnetic radiation is provided. A device structure includes a first chip interconnected with a second chip. The first chip includes a detector array, wherein the detector array comprises a plurality of light sensors and one or more transistors. The second chip includes a Read Out Integrated Circuit (ROIC) that reads out, via the transistors, a signal produced by the light sensors. A number of interconnects between the ROIC and the detector array can be less than one per light sensor or pixel.
摘要:
A process for removing indium oxide from indium bumps in a flip-chip structure to reduce contact resistance, by a multi-step plasma treatment. A first plasma treatment of the indium bumps with an argon, methane and hydrogen plasma reduces indium oxide, and a second plasma treatment with an argon and hydrogen plasma removes residual organics. The multi-step plasma process for removing indium oxide from the indium bumps is more effective in reducing the oxide, and yet does not require the use of halogens, does not change the bump morphology, does not attack the bond pad material or under-bump metallization layers, and creates no new mechanisms for open circuits.
摘要:
High-quality surface coatings, and techniques combining the atomic precision of molecular beam epitaxy and atomic layer deposition, to fabricate such high-quality surface coatings are provided. The coatings made in accordance with the techniques set forth by the invention are shown to be capable of forming silicon CCD detectors that demonstrate world record detector quantum efficiency (>50%) in the near and far ultraviolet (155 nm-300 nm). The surface engineering approaches used demonstrate the robustness of detector performance that is obtained by achieving atomic level precision at all steps in the coating fabrication process. As proof of concept, the characterization, materials, and exemplary devices produced are presented along with a comparison to other approaches.
摘要:
Systems and methods for producing high quantum efficiency silicon devices. A silicon MBE has a preparation chamber that provides for cleaning silicon surfaces using an oxygen plasma to remove impurities and a gaseous (dry) NH3+NF3 room temperature oxide removal process that leaves the silicon surface hydrogen terminated. Silicon wafers up to 8 inches in diameter have devices that can be fabricated using the cleaning procedures and MBE processing, including delta doping.
摘要:
High-quality surface coatings, and techniques combining the atomic precision of molecular beam epitaxy and atomic layer deposition, to fabricate such high-quality surface coatings are provided. The coatings made in accordance with the techniques set forth by the invention are shown to be capable of forming silicon CCD detectors that demonstrate world record detector quantum efficiency (>50%) in the near and far ultraviolet (155 nm-300 nm). The surface engineering approaches used demonstrate the robustness of detector performance that is obtained by achieving atomic level precision at all steps in the coating fabrication process. As proof of concept, the characterization, materials, and exemplary devices produced are presented along with a comparison to other approaches.
摘要:
A medical imaging system and method. A UV/visible camera uses a back illuminated silicon imaging detector to observe a surface of a brain of a human subject in vivo during brain surgery for excision of a cancerous tumor. The detector can be a CCD detector or a CMOS detector. Under UV illumination, the camera can record images that can be processed to detect the location and extent of a cancerous tumor because the presence of auto-fluorescent NADH variations can be detected between normal and cancerous cells. The image data is processed in a general purpose programmable computer. In some instances, an image is also taken using visible light, and the identified cancerous region is displayed as an overlay on the visible image.
摘要:
A back-illuminated silicon photodetector has a layer of Al2O3 deposited on a silicon oxide surface that receives electromagnetic radiation to be detected. The Al2O3 layer has an antireflection coating deposited thereon. The Al2O3 layer provides a chemically resistant separation layer between the silicon oxide surface and the antireflection coating. The Al2O3 layer is thin enough that it is optically innocuous. Under deep ultraviolet radiation, the silicon oxide layer and the antireflection coating do not interact chemically. In one embodiment, the silicon photodetector has a delta-doped layer near (within a few nanometers of) the silicon oxide surface. The Al2O3 layer is expected to provide similar protection for doped layers fabricated using other methods, such as MBE, ion implantation and CVD deposition.
摘要翻译:背照式硅光电检测器具有沉积在氧化硅表面上的Al 2 O 3层,其接收待检测的电磁辐射。 Al2O3层具有沉积在其上的抗反射涂层。 Al2O3层在氧化硅表面和抗反射涂层之间提供耐化学腐蚀的分离层。 Al2O3层足够薄,使其光学无害。 在深紫外辐射下,氧化硅层和抗反射涂层不会发生化学反应。 在一个实施例中,硅光电检测器在氧化硅表面附近(在几纳米内)具有δ-掺杂层。 预期Al 2 O 3层可以为使用诸如MBE,离子注入和CVD沉积的其它方法制造的掺杂层提供类似的保护。
摘要:
A back-illuminated silicon photodetector has a layer of Al2O3 deposited on a region of a silicon oxide surface that is left uncovered, while deposition is inhibited in another region by a contact shadow mask. The Al2O3 layer is an antireflection coating. In addition, the Al2O3 layer can also provide a chemically resistant separation layer between the silicon oxide surface and additional antireflection coating layers. In one embodiment, the silicon photodetector has a delta-doped layer near (within a few nanometers of) the silicon oxide surface. The Al2O3 layer is expected to provide similar antireflection properties and chemical protection for doped layers fabricated using other methods, such as MBE, ion implantation and CVD deposition.
摘要翻译:背照式硅光电检测器具有沉积在未被覆盖的氧化硅表面的区域上的Al 2 O 3层,同时通过接触阴影掩模在另一区域中抑制沉积。 Al2O3层是抗反射涂层。 此外,Al 2 O 3层还可以在氧化硅表面和附加的抗反射涂层之间提供耐化学腐蚀的分离层。 在一个实施例中,硅光电检测器在氧化硅表面附近(在几纳米内)具有δ-掺杂层。 预期Al 2 O 3层可以为使用其他方法(例如MBE,离子注入和CVD沉积)制造的掺杂层提供类似的抗反射性质和化学保护。