公开(公告)号：US20160211222A1

公开(公告)日：2016-07-21

申请号：US14995831

申请日：2016-01-14

Applicant: Freescale Semiconductor, Inc.

Inventor： Shun Meen Kuo ,  Paul R. Hart ,  Margaret A Szymanowski

IPC: H01L23/552 ,  H03F3/195 ,  H01L23/66 ,  H01L23/00 ,  H03F1/02 ,  H03F3/21

CPC classification number: H01L23/552 ,  H01L23/66 ,  H01L24/04 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2223/6611 ,  H01L2223/6644 ,  H01L2223/6655 ,  H01L2223/6661 ,  H01L2224/04042 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/85 ,  H01L2924/19107 ,  H01L2924/30111 ,  H03F1/0288 ,  H03F3/195 ,  H03F3/211 ,  H03F2200/222 ,  H03F2200/387 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A device (e.g., a Doherty amplifier) housed in an air cavity package includes one or more isolation structures over a surface of a substrate and defining an active circuit area. The device also includes first and second adjacent circuits within the active circuit area, first and second leads coupled to the isolation structure(s) between opposite sides of the package and electrically coupled to the first circuit, third and fourth leads coupled to the isolation structure(s) between the opposite sides of the package and electrically coupled to the second circuit, a first terminal over the first side of the package between the first lead and the third lead, a second terminal over the second side of the package between the second lead and the fourth lead, and an electronic component coupled to the package and electrically coupled to the first terminal, the second terminal, or both the first and second terminals.

公开(公告)号：US09978691B2

公开(公告)日：2018-05-22

申请号：US14995831

申请日：2016-01-14

Applicant: Freescale Semiconductor, Inc.

Inventor： Shun Meen Kuo ,  Paul R. Hart ,  Margaret A. Szymanowski

IPC: H01L21/44 ,  H01L23/552 ,  H01L23/00 ,  H03F1/02 ,  H01L23/66 ,  H03F3/195 ,  H03F3/21

CPC classification number: H01L23/552 ,  H01L23/66 ,  H01L24/04 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2223/6611 ,  H01L2223/6644 ,  H01L2223/6655 ,  H01L2223/6661 ,  H01L2224/04042 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/85 ,  H01L2924/19107 ,  H01L2924/30111 ,  H03F1/0288 ,  H03F3/195 ,  H03F3/211 ,  H03F2200/222 ,  H03F2200/387 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A device (e.g., a Doherty amplifier) housed in an air cavity package includes one or more isolation structures over a surface of a substrate and defining an active circuit area. The device also includes first and second adjacent circuits within the active circuit area, first and second leads coupled to the isolation structure(s) between opposite sides of the package and electrically coupled to the first circuit, third and fourth leads coupled to the isolation structure(s) between the opposite sides of the package and electrically coupled to the second circuit, a first terminal over the first side of the package between the first lead and the third lead, a second terminal over the second side of the package between the second lead and the fourth lead, and an electronic component coupled to the package and electrically coupled to the first terminal, the second terminal, or both the first and second terminals.

公开(公告)号：US09673164B2

公开(公告)日：2017-06-06

申请号：US14261899

申请日：2014-04-25

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： Michael E. Watts ,  Shun Meen Kuo ,  Margaret A. Szymanowski

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L24/49 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/06135 ,  H01L2224/45099 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A system and method for packaging a semiconductor device that includes a structure to reduce electromagnetic coupling is presented. The semiconductor device has a substrate on which a first circuit and a second circuit with inputs and outputs are formed proximate to each other. An isolation structure of electrically conductive material is located between components of the first and second circuits, the isolation structure being configured to reduce inductive coupling between those components during an operation of the semiconductor device. The isolation structure may be positioned on or over exterior surfaces of the semiconductor device housing or inside the housing. In one embodiment, the isolation structure includes a first leg extending transverse to the surface of the substrate and a first cross member connected to and projecting from the first leg over the substrate.

公开(公告)号：US09240390B2

公开(公告)日：2016-01-19

申请号：US14261387

申请日：2014-04-24

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： Shun Meen Kuo ,  Paul R. Hart ,  Margaret A. Szymanowski

IPC: H01L23/34 ,  H01L23/00 ,  H03F1/02 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L23/66 ,  H01L24/04 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2223/6611 ,  H01L2223/6644 ,  H01L2223/6655 ,  H01L2223/6661 ,  H01L2224/04042 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/85 ,  H01L2924/19107 ,  H01L2924/30111 ,  H03F1/0288 ,  H03F3/195 ,  H03F3/211 ,  H03F2200/222 ,  H03F2200/387 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A device (e.g., a Doherty amplifier) housed in an air cavity package includes one or more isolation structures over a surface of a substrate and defining an active circuit area. The device also includes first and second adjacent circuits within the active circuit area, first and second leads coupled to the isolation structure(s) between opposite sides of the package and electrically coupled to the first circuit, third and fourth leads coupled to the isolation structure(s) between the opposite sides of the package and electrically coupled to the second circuit, a first terminal over the first side of the package between the first lead and the third lead, a second terminal over the second side of the package between the second lead and the fourth lead, and an electronic component coupled to the package and electrically coupled to the first terminal, the second terminal, or both the first and second terminals.

Abstract translation: 容纳在空气腔封装中的器件（例如，Doherty放大器）包括在衬底的表面上的一个或多个隔离结构并且限定有源电路区域。 该器件还包括有源电路区域内的第一和第二相邻电路，耦合到封装的相对侧之间的隔离结构的电耦合到第一电路的第一和第二引线，耦合到隔离结构的第三和第四引线 在所述封装的相对侧之间并且电耦合到所述第二电路的第一端子，在所述封装的所述第一引线和所述第三引线之间的第一侧上的第一端子，在所述封装的第二侧之间的第二端子处于所述第二引线 引线和第四引线，以及耦合到封装并且电耦合到第一端子，第二端子或第一端子和第二端子两者的电子部件。