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1.发明申请Manufacturing method of semiconductor device and manufacturing method of lead frame 失效半导体器件的制造方法及引线框架的制造方法公开(公告)号：US20060014321A1
公开(公告)日：2006-01-19
申请号：US11181929
申请日：2005-07-15
IPC分类号： H01L21/50
CPC分类号： H01L21/56 , H01L21/4821 , H01L23/3107 , H01L23/49558 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： Improvement in the reliability of a semiconductor device is aimed at. By heating a lead frame, after preparing a lead frame with a tape, until a resin molding is performed, at the temperature 160 to 300° C. (preferably 180 to 300° C.) for a total of more than 2 minutes in the atmosphere which has oxygen, crosslinkage density becoming high in resin of adhesives, a low molecular compound volatilizes and jumps out outside, therefore as a result, since a low molecular compound does not remain in resin of adhesives, the generation of copper migration can be prevented.
摘要翻译： 旨在提高半导体器件的可靠性。 通过加热引线框架，在用带子制备引线框架之后，直到进行树脂模制，在160-300℃（优选180-300℃）的温度下，总共超过2分钟 具有氧的气氛，粘合剂树脂中的交联密度变高，低分子化合物挥发并跳出外部，因此，由于低分子化合物不会残留在粘合剂的树脂中，所以可以防止铜迁移的产生 。
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2.发明授权Manufacturing method of semiconductor device and manufacturing method of lead frame 失效半导体器件的制造方法和引线框架的制造方法公开(公告)号：US07374973B2
公开(公告)日：2008-05-20
申请号：US11181929
申请日：2005-07-15
IPC分类号： H01L21/00
CPC分类号： H01L21/56 , H01L21/4821 , H01L23/3107 , H01L23/49558 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： Improvement in the reliability of a semiconductor device is aimed at. By heating a lead frame, after preparing a lead frame with a tape, until a resin molding is performed, at the temperature 160 to 300° C. (preferably 180 to 300° C.) for a total of more than 2 minutes in the atmosphere which has oxygen, crosslinkage density becoming high in resin of adhesives, a low molecular compound volatilizes and jumps out outside, therefore as a result, since a low molecular compound does not remain in resin of adhesives, the generation of copper migration can be prevented.
摘要翻译： 旨在提高半导体器件的可靠性。 通过加热引线框架，在用带子制备引线框架之后，直到进行树脂模制，在160-300℃（优选180-300℃）的温度下，总共超过2分钟 具有氧的气氛，粘合剂树脂中的交联密度变高，低分子化合物挥发并跳出外部，因此，由于低分子化合物不会残留在粘合剂的树脂中，所以可以防止铜迁移的产生 。
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公开(公告)号：US20060199302A1
公开(公告)日：2006-09-07
申请号：US11367297
申请日：2006-03-06
IPC分类号： H01L21/00
CPC分类号： H01L23/49503 , H01L23/293 , H01L23/3107 , H01L23/49506 , H01L23/49548 , H01L23/49558 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/73 , H01L24/86 , H01L2224/05554 , H01L2224/32014 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor device is manufactured by adhering a fixing tape to plural leads of a lead frame comprising a copper alloy, mounting a semiconductor chip on a tab of the lead frame, electrically connecting the leads to electrodes a of the semiconductor chip via bonding wires, forming a sealing resin portion that seals the semiconductor chip, the tab, the bonding wires, the leads and the fixing tape, and cutting the lead frame. A binder layer of the fixing tape includes at least % by weight of an amine-curable epoxy resin as its main component, and does not include a phenol resin. The binder layer of the fixing tape further includes no more than % by weight of acrylonitrile butadiene rubber. By using this material for the binder layer of the fixing tape, migration of the copper in the leads is suppressed even when a degradation test with strict environmental degradation conditions is conducted.
摘要翻译： 半导体器件通过将固定带粘附到包括铜合金的引线框架的多个引线上，将引线框架的突片上安装半导体芯片，通过接合线将引线电连接到半导体芯片的电极a，形成 密封半导体芯片，突片，接合线，引线和固定带的密封树脂部分，以及切割引线框架。 固定带的粘合剂层至少包含以胺可固化的环氧树脂为主要成分的重量百分比，不包括酚醛树脂。 定影带的粘合剂层还包括不超过重量％的丙烯腈丁二烯橡胶。 通过将该材料用于固定带的粘合剂层，即使进行严格的环境退化条件的劣化试验，也能抑制引线中铜的迁移。
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4.发明授权Manufacturing method of semiconductor device and manufacturing method of lead frame 有权半导体器件的制造方法和引线框架的制造方法公开(公告)号：US07989267B2
公开(公告)日：2011-08-02
申请号：US12104154
申请日：2008-04-16
IPC分类号： H01L21/00
CPC分类号： H01L21/56 , H01L21/4821 , H01L23/3107 , H01L23/49558 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： Improvement in the reliability of a semiconductor device is aimed at. By heating a lead frame, after preparing a lead frame with a tape, until a resin molding is performed, at the temperature 160 to 300° C. (preferably 180 to 300° C.) for a total of more than 2 minutes in the atmosphere which has oxygen, crosslinkage density becoming high in resin of adhesives, a low molecular compound volatilizes and jumps out outside, therefore as a result, since a low molecular compound does not remain in resin of adhesives, the generation of copper migration can be prevented.
摘要翻译： 旨在提高半导体器件的可靠性。 通过加热引线框架，在用带子制备引线框架之后，直到进行树脂模制，在160-300℃（优选180-300℃）的温度下，总共超过2分钟 具有氧的气氛，粘合剂树脂中的交联密度变高，低分子化合物挥发并跳出外部，因此，由于低分子化合物不会残留在粘合剂的树脂中，所以可以防止铜迁移的产生 。
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5.发明申请MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF LEAD FRAME 有权半导体器件的制造方法和引线框架的制造方法公开(公告)号：US20080199987A1
公开(公告)日：2008-08-21
申请号：US12104154
申请日：2008-04-16
IPC分类号： H01L21/56
CPC分类号： H01L21/56 , H01L21/4821 , H01L23/3107 , H01L23/49558 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： Improvement in the reliability of a semiconductor device is aimed at. By heating a lead frame, after preparing a lead frame with a tape, until a resin molding is performed, at the temperature 160 to 300° C. (preferably 180 to 300° C.) for a total of more than 2 minutes in the atmosphere which has oxygen, crosslinkage density becoming high in resin of adhesives, a low molecular compound volatilizes and jumps out outside, therefore as a result, since a low molecular compound does not remain in resin of adhesives, the generation of copper migration can be prevented.
摘要翻译： 旨在提高半导体器件的可靠性。 通过加热引线框架，在用带子制备引线框架之后，直到进行树脂模制，在160-300℃（优选180-300℃）的温度下，总共超过2分钟 具有氧的气氛，粘合剂树脂中的交联密度变高，低分子化合物挥发并跳出外部，因此，由于低分子化合物不会残留在粘合剂的树脂中，所以可以防止铜迁移的产生 。
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6.发明申请公开(公告)号：US20120315487A1
公开(公告)日：2012-12-13
申请号：US13579413
申请日：2011-02-17
申请人： Yoshitaka Takezawa , Fusao Hojo , Shingo Tanaka , Hiroyuki Kagawa
发明人： Yoshitaka Takezawa , Fusao Hojo , Shingo Tanaka , Hiroyuki Kagawa
CPC分类号： C08L63/00 , C01P2004/61 , C08K3/10 , C08K7/00 , C08K9/00 , C09C1/40 , C09D7/62 , C09K5/14 , Y10T428/31529
摘要： A composite particle is constituted to include: an aluminum nitride particle; a first coating layer that contains α-alumina and coats at least a part of a region of a surface of the aluminum nitride particle; and a second coating layer that contains organic matter and coats a region other than the first coating layer of the surface of the aluminum nitride particle.
摘要翻译： 复合颗粒被构造成包括：氮化铝颗粒; 含有α-氧化铝的第一涂层，并涂覆氮化铝颗粒表面的至少一部分区域; 以及第二涂层，其含有有机物并涂覆除了氮化铝颗粒表面的第一涂层以外的区域。
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7.发明申请RESIN COMPOSITION, RESIN SHEET, AND CURED RESIN MATERIAL AND METHOD FOR PRODUCING THE SAME 审中-公开树脂组合物，树脂片和固化树脂材料及其制造方法公开(公告)号：US20120251830A1
公开(公告)日：2012-10-04
申请号：US13498278
申请日：2010-09-28
申请人： Tomoo Nishiyama , Haruaki Sue , Hideyuki Katagi , Naoki Hara , Hiroyuki Takahashi , Yasuo Miyazaki , Yoshitaka Takezawa , Hiroyuki Tanaka , Kensuke Yoshihara , Masayoshi Joumen
发明人： Tomoo Nishiyama , Haruaki Sue , Hideyuki Katagi , Naoki Hara , Hiroyuki Takahashi , Yasuo Miyazaki , Yoshitaka Takezawa , Hiroyuki Tanaka , Kensuke Yoshihara , Masayoshi Joumen
IPC分类号： C08L63/00 , B32B37/06 , B32B37/14 , C08K3/22 , B32B15/092
CPC分类号： C08L63/08 , B32B15/08 , B32B27/26 , B32B27/38 , C08G59/621 , C08K3/22 , C08K2003/2227 , C08L61/06 , C08L61/12 , C08L63/00 , Y10T156/10 , Y10T428/31529 , C08L2666/22 , C08L2666/16
摘要： A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing.In the following general formula (I), R1, R2 and R3 independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; m represents an integer of 0 to 2; and n an integer of 1 to 7.
摘要翻译： 含有具有介晶结构的环氧树脂单体，含有具有下述通式（I）表示的结构单元的化合物的酚醛清漆树脂）和无机填料的树脂组合物在固化前的保存稳定性优异，可以达到 固化后导热性好。 在下列通式（I）中，R 1，R 2和R 3独立地表示氢原子，烷基，芳基或芳烷基。 m表示0〜2的整数。 n为1〜7的整数。
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8.发明授权公开(公告)号：US07691473B2
公开(公告)日：2010-04-06
申请号：US12250778
申请日：2008-10-14
申请人： Hiroyuki Yano , Junji Sugiyama , Masaya Nogi , Shin-ichiro Iwamoto , Keishin Handa , Akira Nagai , Takao Miwa , Yoshitaka Takezawa , Toshiyuki Miyadera , Takashi Kurihara , Tohru Matsuura , Nobutatsu Koshoubu , Tohru Maruno
发明人： Hiroyuki Yano , Junji Sugiyama , Masaya Nogi , Shin-ichiro Iwamoto , Keishin Handa , Akira Nagai , Takao Miwa , Yoshitaka Takezawa , Toshiyuki Miyadera , Takashi Kurihara , Tohru Matsuura , Nobutatsu Koshoubu , Tohru Maruno
IPC分类号： B32B27/38
CPC分类号： G02B6/122 , B82Y30/00 , C08J5/005 , C08J5/04 , C08L101/00 , G02B6/10 , G02B6/4214 , G02B2006/12104 , G02B2006/12107 , H05K1/0366 , H05K2201/0108 , H05K2201/0251 , Y10T428/249924 , Y10T428/249928 , Y10T428/24994 , Y10T428/2965 , Y10T428/31518 , Y10T428/31525 , C08L2666/26
摘要： The present invention relates to a fiber-reinforced composite material and a method for manufacturing the same, and also relates to a transparent multilayered sheet, a circuit board, and an optical waveguide.
摘要翻译： 纤维增强复合材料及其制造方法技术领域本发明涉及纤维增强复合材料及其制造方法，还涉及透明多层片材，电路基板和光波导。
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9.发明授权公开(公告)号：US07538166B2
公开(公告)日：2009-05-26
申请号：US10584307
申请日：2004-12-22
CPC分类号： C08G59/22 , C07D303/27 , C08G59/04 , C08G59/5033 , C08J5/24 , C08J2363/00 , H05K1/0326 , Y10T428/24994 , Y10T428/31511
摘要： Novel epoxy compounds represented by the general formula (1) wherein Ar1, Ar2 and Ar3 are each optionally substituted phenylene, cyclohexanyl or the like, R1, R2, R3, R4, R5 and R6 are each hydrogen or alkyl of 1 to 18 carbon atoms, and Q1 and Q2 are each alkylene of 1 to 9 carbon atoms or the like, which are useful as the raw material of cured epoxy resins exhibiting liquid crystallinity; a process for the production thereof; and compositions containing the compounds.
摘要翻译： 由通式（1）表示的新型环氧化合物，其中Ar 1，Ar 2和Ar 3各自为任意取代的亚苯基，环己烷基等，R 1，R 2，R 3，R 4，R 5和R 6各自为氢或1至18个碳原子的烷基 Q1和Q2分别为1〜9个碳原子的亚烷基等，可用作具有液晶性的固化环氧树脂的原料; 一种生产过程; 和含有这些化合物的组合物。
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10.发明申请公开(公告)号：US20090123726A1
公开(公告)日：2009-05-14
申请号：US12250778
申请日：2008-10-14
申请人： Hiroyuki YANO , Junji Sugiyama , Masaya Nogi , Shin-ichiro Iwamoto , Keishin Handa , Akira Nagai , Takao Miwa , Yoshitaka Takezawa , Toshiyuki Miyadera , Takashi Kurihara , Tohru Matsuura , Nobutatsu Koshoubu , Tohru Maruno
发明人： Hiroyuki YANO , Junji Sugiyama , Masaya Nogi , Shin-ichiro Iwamoto , Keishin Handa , Akira Nagai , Takao Miwa , Yoshitaka Takezawa , Toshiyuki Miyadera , Takashi Kurihara , Tohru Matsuura , Nobutatsu Koshoubu , Tohru Maruno
IPC分类号： D04H13/00
CPC分类号： G02B6/122 , B82Y30/00 , C08J5/005 , C08J5/04 , C08L101/00 , G02B6/10 , G02B6/4214 , G02B2006/12104 , G02B2006/12107 , H05K1/0366 , H05K2201/0108 , H05K2201/0251 , Y10T428/249924 , Y10T428/249928 , Y10T428/24994 , Y10T428/2965 , Y10T428/31518 , Y10T428/31525 , C08L2666/26
摘要： The present invention relates to a fiber-reinforced composite material and a method for manufacturing the same, and also relates to a transparent multilayered sheet, a circuit board, and an optical waveguide.
摘要翻译： 纤维增强复合材料及其制造方法技术领域本发明涉及纤维增强复合材料及其制造方法，还涉及透明多层片材，电路基板和光波导。
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